초록 ▼

Apparatuses are provided for thermally conditioning material. The apparatus includes a plate having a top surface for receiving material, a temperature controller connected to control the temperature of the top surface of the plate and the temperature controller is controlled by a computer controlle

Apparatuses are provided for thermally conditioning material. The apparatus includes a plate having a top surface for receiving material, a temperature controller connected to control the temperature of the top surface of the plate and the temperature controller is controlled by a computer controller. In a preferred embodiment, three tubular shaped ceramic support members, each containing a bore, are provided to support the material and a negative pressure source is provided in fluid communication with the bores. In addition, three lift elements having contacting ends are slidably disposed through receiving holes in the thermal conditioning plate and aligned to support the material on the contacting ends. Preferably, at least one of the lift pins contains a bore with a sensor positioned to detect the presence of material on the contacting end of the lift pin and provide a signal to the computer controller that can be used to control the negative pressure source and the relative movement of the plate and lift pins. Also, in a preferred embodiment, the apparatus includes an exhausted cover providing for a stagnation region adjacent to the material during operation, thereby providing for more uniform heat transfer to the material.

대표청구항 ▼

[ What is claimed is:] [1.] A thermal conditioning apparatus comprising:an enclosure having an opening for inserting a wafer to be thermally conditioned, said enclosure having supporting elements for a plate having a top surface, said plate having a thermal conditioning element;a temperature control

[ What is claimed is:] [1.] A thermal conditioning apparatus comprising:an enclosure having an opening for inserting a wafer to be thermally conditioned, said enclosure having supporting elements for a plate having a top surface, said plate having a thermal conditioning element;a temperature controller coupled to said thermal conditioning element to control the temperature of the top surface of said plate;a computer controller coupled to said temperature controller for controlling said temperature controller;at least three support members each having a proximal end and a longitudinal axis and at least one of said support members containing a bore extending from said proximal end along said longitudinal axis of said at least one support members, said support members being mounted in said top surface with each said proximal end thereof extending beyond said top surface;a negative pressure source connected by a port in said plate with said at least one bore;at least three lift elements having contacting ends disposed through and movable relative to said top surface of said plate;a drive for moving said top surface relative to said lift elements; and,a sensor positioned to detect the presence of material on at least one of said contacting ends of said lift elements.