초록 ▼

Removable extension areas electrically connected to the original die bond pad allow for testing connections to be made. After removal of the extension areas, the circuitry below the region of the extension areas can be seen through a microscope. The use of perforations and/or underlayer sections can

Removable extension areas electrically connected to the original die bond pad allow for testing connections to be made. After removal of the extension areas, the circuitry below the region of the extension areas can be seen through a microscope. The use of perforations and/or underlayer sections can aid in the removal of the extension areas. Underlayer sections may comprise a metal that forms an intermetallic interaction with the metal layer of the extension areas.

대표청구항 ▼

[ What is claimed is:] [1.] A structure comprising:a die;a wire bond pad on the die;an extension area electrically connected to the wire bond pad, the extension area comprising a first type of metal, the extension area extending, beyond the area of the wire bond pad;a barrier layer separating the wi

[ What is claimed is:] [1.] A structure comprising:a die;a wire bond pad on the die;an extension area electrically connected to the wire bond pad, the extension area comprising a first type of metal, the extension area extending, beyond the area of the wire bond pad;a barrier layer separating the wire bond pad and the extension area, wherein said barrier layer is electrically conductive; andan intermetallic region connected to the extension area, the intermetallic region including an alloy of the first type of metal and another type of metal.