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Adjusting DC bias voltage in plasma chambers 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • H05H-001/00
출원번호 US-0666981 (1996-06-20)
발명자 / 주소
  • Shan Hong Ching
  • Lee Evans Yip
  • Welch Michael D
  • Wu Robert W
  • Pu Bryan
  • Luscher Paul Ernest
  • Carducci James David
  • Blume Richard
출원인 / 주소
  • Applied Materials, Inc.
대리인 / 주소
    Stern
인용정보 피인용 횟수 : 77  인용 특허 : 27

초록

A method of adjusting the cathode DC bias in a plasma chamber for fabricating semiconductor devices. A dielectric shield is positioned between the plasma and a selected portion of the electrically grounded components of the chamber, such as the electrically grounded chamber wall. The cathode DC bias

대표청구항

[ We claim:] [1.] A plasma chamber for fabricating semiconductor devices, comprising:(a) a plasma chamber;(b) a gas inlet for receiving a gas into the chamber;(c) plasma excitation means for exciting the gas to a plasma state;(d) an exhaust port through which gas can be exhausted from the chamber;(e

이 특허에 인용된 특허 (27)

  1. Shan Hongching (San Jose CA) Lee Evans (Milpitas CA) Wu Robert (Pleasanton CA), Adjustable dc bias control in a plasma reactor.
  2. Zhao Jun (Milpitas CA) Cho Tom (San Francisco CA) Dornfest Charles (Fremont CA) Wolff Stefan (Sunnyvale CA) Fairbairn Kevin (Saratoga CA) Guo Xin S (Mountain View CA) Schreiber Alex (Santa Clara CA) , CVD Processing chamber.
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  4. Laporte Philippe (Echirolles FRX) Peccoud Louise (Claix FRX), Enclosure for the treatment, and particularly for the etching of substrates by the reactive plasma method.
  5. Cho Tom (San Francisco CA) Ngai Christopher (Burlingame CA), Exhaust baffle for uniform gas flow pattern.
  6. Koike Atsushi (Chiba JPX), Film forming apparatus capable of preventing adhesion of film deposits.
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  10. Engelhardt Manfred (Feldkirchen-Westerham DEX), Method for structuring a layer using a ring electrode and multiple RF power sources.
  11. Nakaguma Shinji (Fukuoka JPX) Banjyo Toshinobu (Fukuoka JPX), Method for the plasma treatment of semiconductor devices.
  12. Hasegawa Makoto (Kawasaki JPX) Sanda Atsuo (Yokohama JPX), Method of performing plain etching treatment and apparatus therefor.
  13. Zarowin Charles B. (Rowayton CT) Bollinger L. David (Ridgefield CT), Methods and apparatus for confinement of a plasma etch region for precision shaping of surfaces of substances and films.
  14. Law Kam S. (Union City CA) Robertson Robert (Palo Alto CA) Lou Pamela (San Francisco CA) Kollrack Marc M. (Alameda CA) Lee Angela (Sunnyvale CA) Maydan Dan (Los Altos Hills CA), Plasma CVD of silicon nitride thin films on large area glass substrates at high deposition rates.
  15. Mase Yasukazu (Fujisawa JPX) Abe Masahiro (Yokohama JPX), Plasma chemical vapor deposition apparatus.
  16. Lenz Eric H. (San Jose CA) Dible Robert D. (Fremont CA), Plasma etching apparatus utilizing plasma confinement.
  17. Fujimoto Hideki (Fuchu JPX), Plasma processing apparatus.
  18. Yamada Minoru,JPX ; Hayami Toshihiro,JPX, Plasma processing apparatus.
  19. Drage David J. (Sebastopol CA), Plasma reactor having slotted manifold.
  20. Bonifield Thomas D. (Garland TX) Purdes Andrew J. (Garland TX), Plasma reactor sidewall shield.
  21. Charlet Barbara (Meylan FRX) Peccoud Louise (Claix FRX), Process for etching by gas plasma.
  22. Hendrix Howard A. (Morgan Hill CA) Schmidt ; Jr. Howard W. (Gilroy CA) Ward Ernest S. (San Jose CA), RF plasma processing apparatus.
  23. Coultas Dennis K. (Hopewell Junction NY) Keller John H. (Poughkeepsie NY), Radio frequency induction/multipole plasma processing tool.
  24. Foster Robert F. (Weston MA) Rebenne Helen E. (Fair Lawn NJ) LeBlanc Rene E. (Branford CT) White Carl L. (Gilbert AZ) Arora Rikhit (Mesa AZ), Semiconductor wafer processing CVD reactor apparatus comprising contoured electrode gas directing means.
  25. Shumate David A. (Phoenix AZ) Baker Thomas R. (Tempe AZ) Gray Robert W. (Mesa AZ), Sputter chamber with extended protection plate and method of use.
  26. Itoh Hitoshi (Tokyo JPX), Thin-film depositing apparatus.
  27. Collins Kenneth S. (Morgan Hill CA) Roderick Craig A. (San Jose CA) Yang Chan-Lon (Los Gatos CA) Wang David N. K. (Saratoga CA) Maydan Dan (Los Altos CA), VHF/UHF reactor system.

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  43. Berkoh, Daniel Kwadwo Amponsah; Woodard, Elena Becerra; Scott, Dean G., Methods for shielding a plasma etcher electrode.
  44. Berkoh, Daniel Kwadwo Amponsah; Woodard, Elena Becerra; Scott, Dean G., Methods of measuring electrical characteristics during plasma etching.
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  64. Otsuki, Hayashi, Processing apparatus with a chamber having therein a high-corrosion-resistant sprayed film.
  65. Tsuji, Naoto, Semiconductor manufacturing apparatus.
  66. Sato Kiyoshi,JPX, Semiconductor processing system.
  67. Good,Brian James, Shielding system for plasma chamber.
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  73. Sung, Su-Jen, Systems and methods for uniform gas flow in a deposition chamber.
  74. Han, Kyung-Don; Cho, Jeen-Seok, Thin film deposition apparatus.
  75. Condrashoff, Robert S.; Fazio, James P.; Getty, James D.; Tyler, James S., Ultra high speed uniform plasma processing system.
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