초록 ▼

A microelectronic assembly (10) includes an integrated circuit die (12) mounted onto a substrate (14) by solder bump interconnections (32). The die (12) and the substrate (14) are spaced apart by a gap (30) that is filled with a polymeric encapsulant (16). The die (12) includes a die perimeter (24)

A microelectronic assembly (10) includes an integrated circuit die (12) mounted onto a substrate (14) by solder bump interconnections (32). The die (12) and the substrate (14) are spaced apart by a gap (30) that is filled with a polymeric encapsulant (16). The die (12) includes a die perimeter (24) and a face (27) facing away from the substrate (14). A polymeric reinforcement (18) is disposed onto the die face (27) to protect the die (12) and to reduce the effects of thermally induced stresses on the die (12) and the solder bump interconnections (32). The polymeric reinforcement (18) is spaced apart from the die perimeter (24) to maintain a desired peripheral fillet geometry of the encapsulant (16).

대표청구항 ▼

[ The embodiments of this invention in which an exclusive property or privilege is claimed are defined as follows:] [1.] A microelectronic assembly comprising:a substrate;an integrated circuit die overlying the substrate and spaced apart therefrom by a gap, said integrated circuit die including a pe

[ The embodiments of this invention in which an exclusive property or privilege is claimed are defined as follows:] [1.] A microelectronic assembly comprising:a substrate;an integrated circuit die overlying the substrate and spaced apart therefrom by a gap, said integrated circuit die including a perimeter and a face facing away from the substrate;a plurality of solder bump interconnections bonded to the integrated circuit die, extending across the gap, and connecting the substrate to the integrated circuit die;an encapsulant disposed within the gap about the plurality of solder bump interconnections; anda polymeric reinforcement disposed on the face of the integrated circuit die and the polymeric reinforcement spaced apart from the perimeter.