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[미국특허] Method for encapsulating an integrated semi-conductor circuit 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • H01L-021/00
출원번호 US-0871960 (1997-06-10)
우선권정보 NL-1003315 (1996-06-11)
발명자 / 주소
  • Kaldenberg Peter Jacobus,NLX
출원인 / 주소
  • European Semiconductor Assembly (Eurasem) B.V., NLX
대리인 / 주소
    Young & Thompson
인용정보 피인용 횟수 : 117  인용 특허 : 2

초록 ▼

e) before closing the mould a layer of heat resistant deformable material in the form of a ring or a continuous layer is brought in between the upper side of the integrated semi-conductor circuit and said end surface of the inwards extending part, which layer not or hardly adheres to the plastic hou

대표청구항 ▼

[ I claim:] [1.] A method for encapsulating an integrated semi-conductor circuit (die) comprising the following steps:a) mounting the semi-conductor circuit onto the surface of a lead frame,b) attaching connecting wires between the contact surfaces of the semi-conductor circuit and selected parts of

이 특허에 인용된 특허 (2) 인용/피인용 타임라인 분석

  1. Maslakow William H. (Lewisville TX), Method of making homogeneous thermoplastic semi-conductor chip carrier package.
    상세보기
  2. Yamawaki Masao (Itami JPX) Kondo Takashi (Itami JPX), Semiconductor device having a light transparent window and a method of producing same.
    상세보기

이 특허를 인용한 특허 (117) 인용/피인용 타임라인 분석

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