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[미국특허] Self aligning electrical component 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • H05K-007/02
출원번호 US-0926082 (1997-09-02)
발명자 / 주소
  • Tan Wiling,MYX ITX 11600
  • Tiong Raymond Teh Wai,MYX ITX 50490
  • Song Lian It,MYX ITX 11900
인용정보 피인용 횟수 : 60  인용 특허 : 4

초록 ▼

An electrical device (400) includes a substrate (300) having solder pads (215, 220) formed thereon and a self aligning electrical component (200) mounted to the solder pads (215, 220). The self aligning electrical component (200) includes a body having a cylindrical shape, a first terminal (205) for

대표청구항 ▼

[ What is claimed is:] [1.] An electrical device, comprising:a substrate having solder pads formed thereon, the solder pads including a first circular pad surrounding a second circular pad, wherein the first and second circular pads are not in direct contact; anda self aligning electrical component

이 특허에 인용된 특허 (4) 인용/피인용 타임라인 분석

  1. Sakamoto Yukio (Nagaokakyo JPX) Madokoro Shinichi (Nagaokakyo JPX) Okuyama Shingo (Nagaokakyo JPX), Chip-like LC filter.
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  2. Volpe ; Jr. Luke R. (Melrose MA) Thomas Lowell E. (Tewksbury MA), Modular thermal print head and method of fabrication.
    상세보기
  3. Derfiny Dennis J. (Clarendon Hills IL) van den Heuvel Anthony P. (Arlington Heights IL) Edguer Nihat S. (Palatine IL), Mounting system for stress relief in surface mounted components.
    상세보기
  4. Sawairi Hitoshi (Hirakata JPX) Hirose Fuminori (Hirakata JPX) Konishikawa Kaoru (Hirakata JPX), Printed circuit board.
    상세보기

이 특허를 인용한 특허 (60) 인용/피인용 타임라인 분석

  1. Minervini, Anthony D., Bottom port multi-part surface mount MEMS microphone.
    상세보기
  2. Minervini, Anthony D., Bottom port multi-part surface mount silicon condenser microphone package.
    상세보기
  3. Minervini, Anthony D., Bottom port surface mount MEMS microphone.
    상세보기
  4. Minervini, Anthony D., Bottom port surface mount MEMS microphone.
    상세보기
  5. Minervini, Anthony D., Bottom port surface mount silicon condenser microphone package.
    상세보기
  6. Minervini, Anthony D., Bottom port surface mount silicon condenser microphone package.
    상세보기
  7. Wu, Kai-Wen, Circuit board and optical-electrical module with same.
    상세보기
  8. Glenn A. Rinne ; Paul A. Magill, Controlled-shaped solder reservoirs for increasing the volume of solder bumps.
    상세보기
  9. Glenn A. Rinne ; Paul A. Magill, Controlled-shaped solder reservoirs for increasing the volume of solder bumps, and structures formed thereby.
    상세보기
  10. Jan, Jong Rong; Lu, Tsai Hua; Chiu, Sao Ling; Kung, Ling Chen, Electronic devices including offset conductive bumps.
    상세보기
  11. Nair, Krishna K.; Rinne, Glenn A.; Batchelor, William E., Electronic structures including conductive shunt layers.
    상세보기
  12. Szczech, John B.; Van Kessel, Peter, Embedded dielectric as a barrier in an acoustic device and method of manufacture.
    상세보기
  13. Schwiebert Matthew K. ; Hutchison Brian R. ; Chew Geary L. ; Barnett Ron, High-frequency electronic package with arbitrarily-shaped interconnects and integral shielding.
    상세보기
  14. Watson, Joshua; Grosse, Daniel Todd; Jacobs, Michael Robert; Schimpf, William F.; Del Valle Figueroa, Ivelisse, Ingress protection for reducing particle infiltration into acoustic chamber of a MEMS microphone package.
    상세보기
  15. Rinne Glenn A. ; Mis Joseph Daniel, Key-shaped solder bumps and under bump metallurgy.
    상세보기
  16. Rinne,Glenn A.; Nair,Krishna K., Low temperature methods of bonding components and related structures.
    상세보기
  17. Ootorii, Hiizu, Member mounting method and member assembly.
    상세보기
  18. Ootorii, Hiizu, Member mounting method and member assembly.
    상세보기
  19. Gijs, Martin; Reyal, Jean-Pierre; Amalou, Farid, Method for producing parts for passive electronic components and parts produced.
    상세보기
  20. Glenn A. Rinne ; Joseph Daniel Mis, Methods for forming integrated redistribution routing conductors and solder bumps.
    상세보기
  21. Nair, Krishna K.; Rinne, Glenn A.; Batchelor, William E., Methods of forming electronic structures including conductive shunt layers and related structures.
    상세보기
  22. Nair,Krishna K.; Rinne,Glenn A.; Batchelor,William E., Methods of forming electronic structures including conductive shunt layers and related structures.
    상세보기
  23. Mis, J. Daniel; Adema, Gretchen; Bumgarner, Susan; Chilukuri, Pooja; Rinne, Christine; Rinne, Glenn, Methods of forming lead free solder bumps.
    상세보기
  24. Rinne, Glenn A., Methods of forming metal layers using multi-layer lift-off patterns.
    상세보기
  25. Mis,J. Daniel, Methods of forming solder bumps on exposed metal pads.
    상세보기
  26. Minervini, Anthony D., Methods of manufacture of bottom port multi-part surface mount MEMS microphones.
    상세보기
  27. Minervini, Anthony D., Methods of manufacture of bottom port multi-part surface mount silicon condenser microphone packages.
    상세보기
  28. Minervini, Anthony D., Methods of manufacture of bottom port surface mount MEMS microphones.
    상세보기
  29. Minervini, Anthony D., Methods of manufacture of bottom port surface mount MEMS microphones.
    상세보기
  30. Minervini, Anthony D., Methods of manufacture of bottom port surface mount silicon condenser microphone packages.
    상세보기
  31. Minervini, Anthony D., Methods of manufacture of bottom port surface mount silicon condenser microphone packages.
    상세보기
  32. Minervini, Anthony D., Methods of manufacture of top port multi-part surface mount MEMS microphones.
    상세보기
  33. Minervini, Anthony D., Methods of manufacture of top port multi-part surface mount silicon condenser microphone packages.
    상세보기
  34. Minervini, Anthony D., Methods of manufacture of top port multi-part surface mount silicon condenser microphones.
    상세보기
  35. Minervini, Anthony D., Methods of manufacture of top port multipart surface mount silicon condenser microphone package.
    상세보기
  36. Minervini, Anthony D., Methods of manufacture of top port surface mount MEMS microphones.
    상세보기
  37. Minervini, Anthony D., Methods of manufacture of top port surface mount MEMS microphones.
    상세보기
  38. Minervini, Anthony D., Methods of manufacture of top port surface mount silicon condenser microphone packages.
    상세보기
  39. Minervini, Anthony D., Methods of manufacture of top port surface mount silicon condenser microphone packages.
    상세보기
  40. Rinne,Glenn A., Methods of providing solder structures for out plane connections.
    상세보기
  41. Jan,Jong Rong; Lu,Tsai Hua; Chiu,Sao Ling; Kung,Ling Chen, Methods of selectively bumping integrated circuit substrates and related structures.
    상세보기
  42. Loeppert, Peter V.; McCall, Ryan M.; Giesecke, Daniel; Vos, Sandra F.; Szczech, John B.; Lee, Sung Bok; Van Kessel, Peter, Microphone assembly with barrier to prevent contaminant infiltration.
    상세보기
  43. Batchelor, William E.; Rinne, Glenn A., Non-Circular via holes for bumping pads and related structures.
    상세보기
  44. Rinne,Glenn A., Optical structures including liquid bumps and related methods.
    상세보기
  45. Moresco Larry Louis ; Wheeler Richard L. ; Beilin Solomon I. ; Horine David A., Power supply distribution structure for integrated circuit chip modules.
    상세보기
  46. Kusakawa Shinichi,JPX, Printed circuit board having a marker trace for component alignment.
    상세보기
  47. Rinne, Glenn A., Solder structures for out of plane connections.
    상세보기
  48. Mis, J. Daniel; Adema, Gretchen; Bumgarner, Susan; Chilukuri, Pooja; Rinne, Christine; Rinne, Glenn, Solder structures including barrier layers with nickel and/or copper.
    상세보기
  49. Burns David W. ; Bryzek Janusz, Stress isolated integrated circuit and method for making.
    상세보기
  50. Schwiebert Matthew K. ; Barnett Ron ; Chew Geary L. ; Gleason Gerald J. ; Nicholson Dean B., Surface mountable coaxial solder interconnect and method.
    상세보기
  51. Minervini, Anthony D., Top port multi-part surface mount MEMS microphone.
    상세보기
  52. Minervini, Anthony D., Top port multi-part surface mount silicon condenser microphone.
    상세보기
  53. Minervini, Anthony D., Top port multi-part surface mount silicon condenser microphone.
    상세보기
  54. Minervini, Anthony D., Top port multi-part surface mount silicon condenser microphone.
    상세보기
  55. Minervini, Anthony D., Top port multi-part surface mount silicon condenser microphone package.
    상세보기
  56. Minervini, Anthony D., Top port multi-part surface mount silicon condenser microphone package.
    상세보기
  57. Minervini, Anthony D., Top port surface mount MEMS microphone.
    상세보기
  58. Minervini, Anthony D., Top port surface mount MEMS microphone.
    상세보기
  59. Minervini, Anthony D., Top port surface mount silicon condenser microphone package.
    상세보기
  60. Minervini, Anthony D., Top port surface mount silicon condenser microphone package.
    상세보기

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