초록 ▼

Provided is a single-piece integrated heat spreader/stiffener which is bonded to the substrate and die in a semiconductor package following electrical bonding of the die to the substrate, a packaging method using the integrated heat spreader/stiffener, and a semiconductor package incorporating the i

Provided is a single-piece integrated heat spreader/stiffener which is bonded to the substrate and die in a semiconductor package following electrical bonding of the die to the substrate, a packaging method using the integrated heat spreader/stiffener, and a semiconductor package incorporating the integrated heat spreader/stiffener. In a preferred embodiment, the integrated heat spreader/stiffener is a piece of high modulus, high thermal conductivity material shaped to attach over a die on the surface of a packaging substrate. The heat spreader/stiffener is equipped with a plurality of apertures to provide access to the top surface of the die for adhesive to bond the heat spreader/stiffener to the die, and to its perimeter to provide access for dispensation of underfill material between the die and the substrate. Once the adhesive and underfill materials are in place, the adhesive and underfill resins are cured by heating. A ball grid array (BGA) process may then be used to apply solder balls to the underside of the substrate for subsequent bonding of the package to a circuit board for use.

대표청구항 ▼

[ What is claimed is:] [1.] A semiconductor device package, comprising:a packaging substrate;a semiconductor die attached to said substrate;a top portion of an integrated heat spreader/stiffener having a plurality of apertures;a circumferential side region attached to said top portion; anda cavity d

[ What is claimed is:] [1.] A semiconductor device package, comprising:a packaging substrate;a semiconductor die attached to said substrate;a top portion of an integrated heat spreader/stiffener having a plurality of apertures;a circumferential side region attached to said top portion; anda cavity defined by said top portion and said circumferential side region, the top of said cavity partially covering and the circumferential side region of said cavity enclosing said die, while providing access to a perimeter region of the die through said apertures;wherein said integrated heat spreader/stiffener is attached to said die and to said packaging substrate to hold said die substantially in place on said substrate, and substantially prevent warpage of said die; andat least one of said apertures is at least partially aligned with a region adjacent to said die such that said die does not lie along a path defined by a straight line that passes through said at least one aperture and said substrate.