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Process for production of thin layers of semiconductor material 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • H01L-021/76
  • H01L-021/265
  • H01L-021/425
출원번호 US-0080783 (1998-05-18)
발명자 / 주소
  • Egloff Richard
출원인 / 주소
  • Philips Electronics North America Corporation
대리인 / 주소
    Fox
인용정보 피인용 횟수 : 72  인용 특허 : 5

초록 ▼

Thin layers of semiconductor material having a high degree of surface uniformity are produced by: implantion of deuterium ions into a body of semiconductor material to form a buried region of high stress, the buried region defining a thin outer region of the body; attaching a stiffening carrier to t

대표청구항 ▼

[ What I claim as my invention is:] [1.] A method of forming a thin layer of semiconductor material, the method comprising:(a) implanting a species of ions through a surface of a body of semiconductor material to form a buried region of high stress in the body, the buried region defining a thin oute

이 특허에 인용된 특허 (5)

  1. Kwo Jueinai R. (Somerset County NJ), Method for low temperature growth of epitaxial silicon and devices produced thereby.
    상세보기
  2. Li Jianming (Beijing CNX), Method of making silicon material with enhanced surface mobility by hydrogen ion implantation.
    상세보기
  3. Bruel Michel (Veurey FRX), Process for the production of thin semiconductor material films.
    상세보기
  4. Pankove Jacques I. (Boulder CO) Wu Chung P. (Trenton NJ), Silicon light emitting device and a method of making the device.
    상세보기
  5. Horning Robert D. (Burnsville MN) Stratton Thomas G. (Roseville MN) Saathoff Deidrich J. (Burnsville MN), Wafer bonding enhancement technique.
    상세보기

이 특허를 인용한 특허 (72)

  1. Francois J. Henley ; Michael A. Brayan ; William G. En, Cleaving process to fabricate multilayered substrates using low implantation doses.
    상세보기
  2. Henley,Francois J.; Bryan,Michael A.; En,William G., Cleaving process to fabricate multilayered substrates using low implantation doses.
    상세보기
  3. Francois J. Henley ; Nathan Cheung, Controlled cleavage process and device for patterned films.
    상세보기
  4. Henley, Francois J.; Cheung, Nathan, Controlled cleavage process and device for patterned films.
    상세보기
  5. Francois J. Henley ; Nathan W. Cheung, Controlled cleavage process and resulting device using beta annealing.
    상세보기
  6. Henley, Francois J.; Cheung, Nathan, Controlled cleavage process using pressurized fluid.
    상세보기
  7. Henley, Francois J.; Cheung, Nathan W., Controlled cleaving process.
    상세보기
  8. Henley,Francois J.; Cheung,Nathan W., Controlled cleaving process.
    상세보기
  9. Henley,Francois J.; Cheung,Nathan W., Controlled cleaving process.
    상세보기
  10. Henley, Francois J.; Cheung, Nathan W., Controlled process and resulting device.
    상세보기
  11. Henley, Francois J.; Cheung, Nathan W., Controlled process and resulting device.
    상세보기
  12. Henley, Francois J.; Cheung, Nathan W., Controlled process and resulting device.
    상세보기
  13. Henley,Francois J.; Cheung,Nathan W., Controlled process and resulting device.
    상세보기
  14. Tiwari, Sandip; Kumar, Arvind, Dense backplane cell for configurable logic.
    상세보기
  15. Narayanan, Sundar; Ramkumar, Krishnaswamy, Deuterium incorporated nitride.
    상세보기
  16. Henley, Francois J.; Cheung, Nathan W., Gettering technique for wafers made using a controlled cleaving process.
    상세보기
  17. Henley, Francois J.; Cheung, Nathan W., Gettering technique for wafers made using a controlled cleaving process.
    상세보기
  18. Couillard, James G.; Gadkaree, Kishor P.; Mach, Joseph F., Glass-based SOI structures.
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  19. Couillard, James G.; Gadkaree, Kishor P.; Mach, Joseph F., Glass-based SOI structures.
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  20. Couillard,James G.; Gadkaree,Kishor P.; Mach,Joseph F., Glass-based SOI structures.
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  21. Couillard,James G.; Gadkaree,Kishor P.; Mach,Joseph F., Glass-based SOI structures.
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  22. Couillard,James G.; Gadkaree,Kishor P.; Mach,Joseph F., Glass-based SOI structures.
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  23. Couillard,James Gregory; Gadkaree,Kishor Purushottam; Mach,Joseph Frank, Glass-based SOI structures.
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  24. Joly, Jean-Pierre; Ulmer, Laurent; Parat, Guy, Integrated circuit on high performance chip.
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  25. Henley, Francois J., Layer transfer of films utilizing controlled propagation.
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  26. Henley, Francois J., Layer transfer of films utilizing controlled shear region.
    상세보기
  27. Tiwari, Sandip, Low temperature semiconductor layering and three-dimensional electronic circuits using the layering.
    상세보기
  28. Faris,Sadeg M., MEMS and method of manufacturing MEMS.
    상세보기
  29. Francois J. Henley ; Nathan W. Cheung, Method and device for controlled cleaving process.
    상세보기
  30. Henley, Francois J.; Cheung, Nathan W., Method and device for controlled cleaving process.
    상세보기
  31. Henley,Francois J.; Cheung,Nathan, Method and device for controlled cleaving process.
    상세보기
  32. Sanchez, Loïc, Method and device for monitoring a heat treatment of a microtechnological substrate.
    상세보기
  33. Henley, Francois J., Method and structure for fabricating solar cells using a thick layer transfer process.
    상세보기
  34. Aspar,Bernard; Lagache,Chrystelle, Method for cutting a block of material and forming a thin film.
    상세보기
  35. Fournel, Franck; Moriceau, Hubert; Lagahe, Christelle, Method for making a stressed structure designed to be dissociated.
    상세보기
  36. Deguet, Chrystel; Clavelier, Laurent, Method for making a thin-film element.
    상세보기
  37. Aspar, Bernard; Lagahe, Christelle; Ghyselen, Bruno, Method for making thin layers containing microcomponents.
    상세보기
  38. Iwamoto, Takashi, Method for manufacturing piezoelectric device with a composite piezoelectric substrate.
    상세보기
  39. Tauzin, Aurélie; Dechamp, Jérôme; Mazen, Frédéric; Madeira, Florence, Method for preparing thin GaN layers by implantation and recycling of a starting substrate.
    상세보기
  40. Nakano, Masatake; Yokokawa, Isao; Mitani, Kiyoshi, Method for producing bonded wafer and bonded wafer.
    상세보기
  41. Nguyen, Nguyet-Phuong; Cayrefourcq, Ian; Lagahe-Blanchard, Christelle; Bourdelle, Konstantin; Tauzin, Aurélie; Fournel, Franck, Method for self-supported transfer of a fine layer by pulsation after implantation or co-implantation.
    상세보기
  42. Nguyen, Nguyet-Phuong; Cayrefourcq, Ian; Lagahe-Blanchard, Christelle, Method of catastrophic transfer of a thin film after co-implantation.
    상세보기
  43. Cayrefourcq,Ian; Mohamed,Nadia Ben; Lagahe Blanchard,Christelle; Nguyen,Nguyet Phuong, Method of detaching a thin film at moderate temperature after co-implantation.
    상세보기
  44. Tauzin, Aurélie; Faure, Bruce; Garnier, Arnaud, Method of detaching a thin film by melting precipitates.
    상세보기
  45. Brüderl, Georg; Eichler, Christoph; Strauss, Uwe, Method of fabricating a quasi-substrate wafer and semiconductor body fabricated using such a quasi-substrate wafer.
    상세보기
  46. Faris,Sadeg M., Method of fabricating multi layer devices on buried oxide layer substrates.
    상세보기
  47. Deguet, Chrystel; Clavelier, Laurent; Dechamp, Jerome, Method of transferring a thin film onto a support.
    상세보기
  48. Fournel, Franck, Method of transferring a thin layer onto a target substrate having a coefficient of thermal expansion different from that of the thin layer.
    상세보기
  49. Wasshuber,Christoph; Joyner,Keith A., Methods and apparatus for inducing stress in a semiconductor device.
    상세보기
  50. Ries, Michael J.; Libbert, Jeffrey Louis; Lottes, Charles R., Methods for preparing layered semiconductor structures.
    상세보기
  51. Moriceau, Hubert; Rayssac, Olivier; Cartier, Anne-Marie; Aspar, Bernard, Multilayer structure with controlled internal stresses and making same.
    상세보기
  52. Malik, Igor J.; Kang, Sien G.; Fuerfanger, Martin; Kirk, Harry; Flat, Ariel; Current, Michael Ira; Ong, Philip James, Non-contact etch annealing of strained layers.
    상세보기
  53. Bryan, Michael A.; Kai, James K., Nozzle for cleaving substrates.
    상세보기
  54. Bryan, Michael A., Particle distribution method and resulting structure for a layer transfer process.
    상세보기
  55. Moriceau, Hubert; Bruel, Michel; Aspar, Bernard; Maleville, Christophe, Process for the transfer of a thin film.
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  56. Moriceau,Hubert; Bruel,Michel; Aspar,Bernard; Maleville,Christophe, Process for the transfer of a thin film.
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  57. Moriceau, Hubert; Bruel, Michel; Aspar, Bernard; Maleville, Christophe, Process for the transfer of a thin film comprising an inclusion creation step.
    상세보기
  58. Henley, Francois J.; Brailove, Adam, Race track configuration and method for wafering silicon solar substrates.
    상세보기
  59. Faris,Sadeg M., Selectively bonded thin film layer and substrate layer for processing of useful devices.
    상세보기
  60. Takafuji, Yutaka; Itoga, Takashi, Semiconductor device and manufacturing method thereof, SOI substrate and display device using the same, and manufacturing method of the SOI substrate.
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  61. Takafuji, Yutaka; Itoga, Takashi, Semiconductor device and manufacturing method thereof, SOI substrate and display device using the same, and manufacturing method of the SOI substrate.
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  62. Itoga, Takashi; Ogawa, Yasuyuki, Semiconductor device with recessed registration marks partially covered and partially uncovered.
    상세보기
  63. Henley, Francois J.; Cheung, Nathan W., Silicon-on-silicon hybrid wafer assembly.
    상세보기
  64. Takafuji,Yutaka; Itoga,Takashi, Single-crystal silicon substrate, SOI substrate, semiconductor device, display device, and manufacturing method of semiconductor device.
    상세보기
  65. Moriceau, Hubert; Aspar, Bernard; Margail, Jacques, Stacked structure and production method thereof.
    상세보기
  66. Henley, Francois; Lamm, Al; Chow, Yi-Lei, Substrate cleaving under controlled stress conditions.
    상세보기
  67. Henley, Francois; Lamm, Al; Chow, Yi-Lei, Substrate cleaving under controlled stress conditions.
    상세보기
  68. Henley, Francois; Lamm, Al; Chow, Yi-Lei, Substrate cleaving under controlled stress conditions.
    상세보기
  69. Ishihara, Shigenori; Kawase, Nobuo, Surface treatment method, manufacturing method of semiconductor device, and manufacturing method of capacitive element.
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  70. Brailove, Adam; Liu, Zuqin; Henley, Francois J.; Lamm, Albert J., Techniques for forming thin films by implantation with reduced channeling.
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  71. Tauzin,Aur��lie, Thin film splitting method.
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  72. Faris,Sadeg M, Vertical integrated circuits.
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