초록 ▼

An air duct structure for use in cooling a circuit card comprised of a printed circuit board to which an integrated circuit is connected. The air duct structure includes an air duct cover and a spring. The air duct cover includes a major panel that is sized or dimensioned to substantially cover the

An air duct structure for use in cooling a circuit card comprised of a printed circuit board to which an integrated circuit is connected. The air duct structure includes an air duct cover and a spring. The air duct cover includes a major panel that is sized or dimensioned to substantially cover the circuit card. First and second side panels extending substantially perpendicularly from opposing ends of the major panel to form a bracket. A depth of the bracket is suitable for receiving the circuit card and a heatsink positioned in close contact with the integrated circuit. When the circuit card and the heatsink are suitably received within the air duct cover, the air duct cover and the printed circuit board define an air duct within which the heatsink resides. The spring is attached to an interior surface of the major panel. The spring is positioned on the major panel to contact the heatsink and retain the heatsink in the close contact with the integrated circuit when the heatsink and the circuit card are suitably received by the air duct cover.

대표청구항 ▼

[ What is claimed is:] [1.] A heat dissipation assembly comprising:an air duct cover including a major panel, first and second side panels, and a spring, wherein said major panel is dimensioned to substantially cover a printed circuit card, said circuit card comprising an integrated circuit affixed

[ What is claimed is:] [1.] A heat dissipation assembly comprising:an air duct cover including a major panel, first and second side panels, and a spring, wherein said major panel is dimensioned to substantially cover a printed circuit card, said circuit card comprising an integrated circuit affixed to a printed circuit board, and wherein said first and second side panels extend approximately perpendicularly from opposing ends of said major panel to form a bracket, wherein a depth of said bracket is suitable for receiving said circuit card and a heat sink positioned in close contact with said integrated circuit, and further wherein said spring is affixed to an interior surface of said major panel and positioned wherein said spring is suitable for retaining said heat sink in said close contact with said integrated circuit; anda template dimensioned for being received within said bracket and wherein said template is attached to said major panel with spacer structures such that said template is substantially parallel to and displaced from said major panel, and further wherein said template includes a template aperture dimensioned and positioned within said template to circumscribe said heat sink.