초록 ▼

A micromechanical device or microactuator based upon the piezoelectric, pyroelectric, and electrostrictive properties of ferroelectric thin film ceramic materials such as PZT. The microdevice has a device substrate and a deflectable component. The deflectable component is mounted for deflection on t

A micromechanical device or microactuator based upon the piezoelectric, pyroelectric, and electrostrictive properties of ferroelectric thin film ceramic materials such as PZT. The microdevice has a device substrate and a deflectable component. The deflectable component is mounted for deflection on the device substrate and has a sensor/actuator. The sensor/actuator has first and second electrodes and a piezoelectric thin film disposed between the first and second electrodes. The thin film is preferably PZT. The sensor/actuator is disposed on a sensor/actuator substrate. The sensor/actuator substrate is formed of a material selected for being resistive to attack by hydrofluoric acid vapor. The invention also relates to a method for fabricating such micromechanical devices or microactuators.

대표청구항 ▼

[ I claim:] [1.] A microdevice comprising:a device substrate having a trench area;a deflectable component being mounted for deflection on the device substrate over the trench area, the deflectable component having a sensor/actuator, the sensor/actuator having a first top electrode and a second botto

[ I claim:] [1.] A microdevice comprising:a device substrate having a trench area;a deflectable component being mounted for deflection on the device substrate over the trench area, the deflectable component having a sensor/actuator, the sensor/actuator having a first top electrode and a second bottom electrode and a piezoelectric thin film disposed between said first and second electrodes, said thin film being PZT, the sensor/actuator being disposed on a sensor/actuator substrate, the device substrate and sensor/actuator substrate each being formed of a material selected for being resistive to attack by a selected etchant used for etching in the trench area; anda selectively removable encapsulation layer being deposited on selected portions of the microdevice to substantially isolate the selected portions of the microdevice from exposure to the selected etchant, wherein the selectively removable encapsulation layer can be removed from the selected portions of the microdevice.