IPC분류정보
국가/구분 |
United States(US) Patent
등록
|
국제특허분류(IPC7판) |
|
출원번호 |
US-0898983
(1997-07-23)
|
발명자
/ 주소 |
- Morton James R.
- Provost Robert G.
|
출원인 / 주소 |
|
대리인 / 주소 |
|
인용정보 |
피인용 횟수 :
56 인용 특허 :
6 |
초록
▼
A package (10, 110, 210, 310) comprises a planar heat exchanger (14, 114, 314) with an air inlet (16, 116, 316) and an air outlet (18, 118, 318) thermally coupled to an electronic module (12). A flexible diaphragm operated pump (20, 120, 220, 320) with one-way valves (132, 134; 232, 234; 332, 334) a
A package (10, 110, 210, 310) comprises a planar heat exchanger (14, 114, 314) with an air inlet (16, 116, 316) and an air outlet (18, 118, 318) thermally coupled to an electronic module (12). A flexible diaphragm operated pump (20, 120, 220, 320) with one-way valves (132, 134; 232, 234; 332, 334) are disposed between the air inlet and the air outlet. The diaphragm is oscillable to pump air through the heat exchanger from the inlet and out through the outlet. One or more piezo-electric transducers (138, 138; 232, 238; 338) are mounted on a diaphragm (136, 236, 336) and a power source and oscillator (140) are coupled to the transducer(s) to cause the diaphragm to rapidly flex and pump the air. The heat exchanger includes an internal structure (142, 342) defining a multitude of continuous air conducting passages. The heat exchanger and the flexible diaphragm operated pump are formed as thin as possible, and the heat exchanger has an internal reticulated structure of cells connected by continuous, solid metal ligaments.
대표청구항
▼
[ What is claimed is:] [1.] A heat exchanger for cooling electronic devices, comprising:a heat generating electronics module containing electronic devices;a heat exchange component thermally coupled to said electronics module;an air intake fluidly coupled to said heat exchanger component;an air exha
[ What is claimed is:] [1.] A heat exchanger for cooling electronic devices, comprising:a heat generating electronics module containing electronic devices;a heat exchange component thermally coupled to said electronics module;an air intake fluidly coupled to said heat exchanger component;an air exhaust fluidly coupled to said air intake;a pump including a flexible diaphragm and a mechanism coupled to and capable of oscillating said diaphragm, and arranged to pump air through said heat exchanger component from said intake to said exhaust; anda unidirectional air flow mechanism coupled in an air path including said air intake and exhaust, and operable in conjunction with said pump to enable unidirectional flow of the air from said intake to said exhaust.
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