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Multiple circuit board assembly having an interconnect mechanism that includes a flex connector 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • H05K-001/11
출원번호 US-0876376 (1997-06-16)
발명자 / 주소
  • Johnson Dean A.
  • Laubengayer William R.
  • Richardson Stephen G.
출원인 / 주소
  • Eastman Kodak Company
대리인 / 주소
    Leimbach
인용정보 피인용 횟수 : 102  인용 특허 : 33

초록

A multiple circuit board assembly comprising: a first circuit board having a first predetermined set of conductive traces on a surface; a second circuit board having a second predetermined set of conductive traces on a surface; an interconnect mechanism having a third set of traces that mate the fir

대표청구항

[ What is claimed is:] [1.] A multiple circuit board assembly comprising:a first circuit board having a first predetermined set of conductive traces on a surface, the first set of conductive traces forming a first at least one arcuate pattern that is essentially symmetric about a first center;a seco

이 특허에 인용된 특허 (33)

  1. Carter David P. (Watlington GB2), Assembly for electrically connecting conductive paths of a first body to conductive paths of a second body.
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  13. Difrancesco Louis (Hayward CA), Electrical interconnect using particle enhanced joining of metal surfaces.
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  17. Deak Frederick R. (Kernersville NC) Wrisley ; Jr. David B. (Greensboro NC), Flexible area array connector.
  18. MacKay Colin A. (Austin TX), Flexible electrical interconnect and method of making.
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  20. Akkapeddi Kaushik S. (Hanover Township ; Morris County NJ) Bonanni Rocco (Wayne Township ; Passaic County NJ) Gashler Robert J. (Olathe KS) German Michael G. (Secaucus NJ) Lambert William R. (Mendham, High density connector for stacked circuit boards.
  21. Bunnell Edward D. (Palm Harbor FL), High density mother/daughter circuit board connector.
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  23. Ceresa Myron (Advance NC) Zimmerman Richard Henry (Palmyra PA), Interconnection of oppositely disposed circuit devices.
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  26. Giguere Winfield Joseph (Lincroft NJ) Padnes David Richard (Matawan NJ), Method of fabricating a printed wiring board assembly.
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  28. Mok Sammy L. (Cupertino CA), Multiple chip module mounting assembly and computer using same.
  29. Cardashian Vahram S. (Plymouth MN) Loy Jerald M. (Anoka MN), Multiple integrated circuit interconnection arrangement.
  30. Petersen Kurt H. (Austin TX) Schmolze Christopher A. (Austin TX), Multipurpose socket.
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  32. Schoenthaler David (Yardley PA), Stepped multilayer interconnection apparatus and method of making the same.
  33. Lin Paul T. (Austin TX) McShane Michael B. (Austin TX), Thin, molded, surface mount electronic device.

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