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Electronically conducting polymers with silver grains 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • H01B-001/02
  • H01B-001/12
출원번호 US-0697641 (1996-08-29)
발명자 / 주소
  • Murphy Oliver J.
  • Hitchens G. Duncan
  • Hodko Dolibor
출원인 / 주소
  • Lynntech, Inc.
대리인 / 주소
    Patterson & Streets, L.L.P.
인용정보 피인용 횟수 : 8  인용 특허 : 28

초록

The present invention provides electronically conducting polymer films formed from photosensitive formulations of pyrrole and an electron acceptor that have been selectively exposed to UV light, laser light, or electron beams. The formulations may include photoinitiators, flexibilizers, solvents and

대표청구항

[ What is claimed is:] [1.] A composition, comprising:(a) a three dimensional matrix formed by photopolymerizing an electronically conducting polymer; and(b) silver grains substantially uniformly distributed throughout the matrix and having a diameter less than about 5 .mu.m.

이 특허에 인용된 특허 (28)

  1. Angelopoulos Marie (Cortlandt Manor NY) Brusic Vlasta A. (Amawalk NY) Graham Teresita Ordonez (Irvington NY) Purushothaman Sampath (Yorktown Heights NY) Saraf Ravi F. (Briarcliff Manor NY) Shaw Jane , Composition containing a polymer and conductive filler and use thereof.
  2. Miki Hisashi (Nagaokakyo JPX), Conductive paste and its usage.
  3. Tieke Bernd (Giffers CHX) Zahir Sheik A. (Oberwil CHX) Finter Jrgen (Freiburg/Br. DEX), Curable mixtures containing copolymerizable dibenzalacetone palladium complexes.
  4. Hyatt Hugh M. (Camarillo CA), Electrical overstress pulse protection.
  5. Durand David (Providence RI) Vieau David P. (East Greenwich RI) Chu Ang-Ling (Cranston RI) Weiu Tai S. (Warwick RI), Electrically conductive cement containing agglomerate, flake and powder metal fillers.
  6. Stramel Rodney D. (Edmond OK), Electrically conductive pigmentary composites.
  7. Leventis Nicholas (Somerville MA) Chung Young C. (Somerville MA), Electrically conductive polymer composition, method of making same and device incorporating same.
  8. Angelopoulos Marie (Briarcliff Manor) Huang Wu-Song (Poughkeepsie) Kaplan Richard D. (Wappingers Falls NY) Le Corre Marie-Annick (St Fargeau Ponthierry FRX) Perreault Stanley E. (Wappingers Falls NY), Electrically conductive polymeric materials and uses thereof.
  9. Angelopoulos Marie (Briarcliff Manor) Huang Wu-Song (Poughkeepsie) Kaplan Richard D. (Wappingers Falls NY) Le Corre Marie-Annick (St Fargeau Ponthierry FRX) Perreault Stanley E. (Wappingers Falls NY), Electrically conductive polymeric materials and uses thereof.
  10. Murakami Hisatoshi,JPX ; Wakita Shinichi,JPX ; Terada Tsunehiko,JPX ; Morimoto Shohei,JPX, Electroconductive coating composition, a printed circuit board fabricated by using it and a flexible printed circuit as.
  11. Angelopoulos Marie (Briarcliff Manor NY) Huang Wu-Song (Poughkeepsie NY) Park Jae M. (Binghamton NY) White James R. (Owego NY), Fabrication of printed circuit boards using conducting polymer.
  12. Morgan Charles R. (Brookeville MD) Ketley Arthur D. (Chevy Chase MD), Heat curable conductive ink.
  13. Bercaw Robert M. (Box 100 ; Rte. 3 Winona MN 55987), Insulating electromagnetic shielding resin composition.
  14. Gilleo Kenneth B. (Northfield MN), Low temperature cure having single component conductive adhesive.
  15. Heeger Alan J. (Santa Barbara CA) Smith Paul (Santa Barbara CA), Melt-processible conducting polymer blends based on fibrils of intractable conducting polymers.
  16. Gottesfeld Shimshon (Los Alamos NM) Uribe Francisco A. (Los Alamos NM), Metallization of electronic insulators.
  17. Auerbach Abraham (Albany NY), Method for deposition of elemental metals and metalloids on substrates.
  18. Murphy Oliver J. (Bryan TX) Hitchens G. Duncan (Bryan TX) Hodko Dalibor (College Station TX) Clarke Eric T. (Bryan TX) Miller David L. (Austin TX) Parker Donald L. (Bryan TX), Method of using conductive polymers to manufacture printed circuit boards.
  19. Rubinstein Israel (Rishon-Letzion NM ILX) Gottesfeld Shimshon (Los Alamos NM) Sabatani Eyal (Rehovot ILX), Morphology in electrochemically grown conducting polymer films.
  20. Krismer Bruno E.,DEX ; Thies Uwe,DEX ; Ladstatter Peter,DEX ; Hunert Rudolf,DEX, Pastes for the coating of substrates, methods for manufacturing them and their use.
  21. Shikatani Yutaka (Kanagawa JPX) Akita Seiichi (Kanagawa JPX) Kuroda Nobuyuki (Kanagawa JPX) Matsuura Kazuo (Tokyo JPX), Polymer compositions.
  22. Yaniger Stuart I. (Palmdale CA) Macdiarmid Alan G. (Drexel Hill PA) Angelopoulos Marie (Dover NJ), Preparation of base-type conducting polymers.
  23. Han Chien-Chung (Madison NJ) Shacklette Lawrence W. (Maplewood NJ), Process for forming dispersions or solutions of electrically conductive conjugated polymers in a polymeric or liquid pha.
  24. Whitlaw Keith J. (Derbyshire GB3) Goodenough Mark (Stockport GB3), Process for metallizing a through-hole board.
  25. Ikkala Olli (Helsinki FIX) Passiniemi Pentti (Helsinki FIX), Processible electrically conducting polyaniline compositions.
  26. Elsenbaumer Ronald L. (Morristown NJ), Thermally stable forms of electrically conductive polyaniline.
  27. Russell Dale D. (Boise ID), Use of templated polymers for analyte-activated microelectronic switching devices.
  28. Angelopoulos Marie (Briarcliff Manor NY) Gelorme Jeffrey D. (Plainville CT) Newman Thomas H. (Mount Kisco NY) Patel Niranjan M. (Wappingers Falls NY) Seeger David E. (Congers NY), Water-soluble electrically conducting polymers, their synthesis and use.

이 특허를 인용한 특허 (8)

  1. Naab, Benjamin, Electroless metallization of through-holes and vias of substrates with tin-free ionic silver containing catalysts.
  2. Waheguru Pal Singh ; Dalibor Hodko ; Suchitra Chepin ; Oliver J. Murphy, Electronically conductive polymers.
  3. Deng, Tao; Arias, Francisco; Ismagilov, Rustem F.; Kenis, Paul J. A.; Whitesides, George M., Fabrication of metallic microstructures via exposure of photosensitive composition.
  4. Deng,Tao; Arias,Francisco; Ismagilov,Rustem F.; Kenis,Paul J. A.; Whitesides,George M., Fabrication of metallic microstructures via exposure of photosensitive composition.
  5. Deng, Tao; Arias, Francisco; Ismagilov, Rustem F.; Kenis, Paul J. A.; Whitesides, George M., Fabrication of metallic microstructures via exposure of photosensitive compostion.
  6. Larsson Karl-Gunnar,SEX ; Pettersson Alf Lage,SEX ; Hedlund Stig Tomas,SEX ; Forsling Willis Rudolf,SEX ; Gunneriusson Lars Anders,SEX ; Lindberg Mats Einar Eugen,SEX, Method of applying metal layers in distinct patterns.
  7. Andriessen,Hieronymus, Process for preparing a substantially transparent conductive layer configuration.
  8. Liu, Peikang; Ferguson, Scott Wayne; Edwards, Dave N.; Sasaki, Yukihiko, Radio frequency identification device and method.
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