초록 ▼

A method and apparatus for assembly of liquid crystal cells with a thin (<4 pm), uniform (.+-.100 .mu.m) cell gap. The method can be used for the assembly of either individual or multiple liquid crystal cells on a single substrate. The method uses a photo-definable polymeric resin as both an edge se

A method and apparatus for assembly of liquid crystal cells with a thin (<4 pm), uniform (.+-.100 .mu.m) cell gap. The method can be used for the assembly of either individual or multiple liquid crystal cells on a single substrate. The method uses a photo-definable polymeric resin as both an edge seal and a spacer and has several important steps: spin-coating defines the cell gap, patterning defines the cell structure, and thermocompression bonding provides adhesion. The method for assembling liquid crystal cells having a thin, uniform cell gap, comprises the steps of: diluting a photo-definable polymeric resin with a solvent; applying the diluted photo-definable polymeric resin on a substrate; patterning the diluted photo-definable polymeric resin by selective exposure to a light; and selectively removing portions of the diluted photo-definable polymeric resin based upon exposure to the light resulting in a resin pattern.

대표청구항 ▼

[ What is claimed is:] [1.] A method for assembling liquid crystal cells having a thin, uniform cell gap, comprising the steps of:diluting a photo-definable polymeric resin with a solvent;applying the diluted photo-definable polymeric resin on a substrate;patterning the diluted photo-definable polym

[ What is claimed is:] [1.] A method for assembling liquid crystal cells having a thin, uniform cell gap, comprising the steps of:diluting a photo-definable polymeric resin with a solvent;applying the diluted photo-definable polymeric resin on a substrate;patterning the diluted photo-definable polymeric resin by selective exposure to a light; andselectively removing portions of the diluted photo-definable polymeric resin that were not exposed to the light, resulting in a viscous, uncured resin pattern that will maintain its physical structure during thermal curing, and that is adapted to serve as a spacer, an edge seal and an adhesive upon thermal curing.