초록 ▼

Two covered wires conductively connected with each other are overlapped with each other at connection portions. The overlapped connection portions are pinched by a pair of resin chips. Cover portions are melted and pressurized from the outside of resin chips capable of obtaining a sealing condition

Two covered wires conductively connected with each other are overlapped with each other at connection portions. The overlapped connection portions are pinched by a pair of resin chips. Cover portions are melted and pressurized from the outside of resin chips capable of obtaining a sealing condition and providing an excellent melting operation efficiency so as to connect conductive wire portions conductively at the connection portions. Then, the pair of the resin chips are melted together to seal the connection portions. In introducing end portions in which a covered wire is introduced out of the resin chips, between a melting surface relative to a mating resin chip and an outer peripheral surface, a round corner having a curvature continuously changing smoothly is provided. Thus, it is possible to obtain a sealing condition securely and an excellent melting operation efficiency.

대표청구항 ▼

[ What is claimed is:] [1.] A covered wire structure for electrically connecting conductive members, at least one of the members being a covered wire having a conductive wire portion and a cover portion formed by coating resin around an outer periphery of the conductive wire portion, said structure

[ What is claimed is:] [1.] A covered wire structure for electrically connecting conductive members, at least one of the members being a covered wire having a conductive wire portion and a cover portion formed by coating resin around an outer periphery of the conductive wire portion, said structure being formed by overlapping said members with each other and pinching an overlapping portion of said members between a pair of resin chips, pressurizing and exciting said overlapping portion pinched by said resin chips using an ultrasonic vibration welding apparatus so as to melt and disperse said cover portion, thereby to expose the conductive wire portion and electrically connect the conductive wire portion of said at least one member with another of the members at said overlapping portion and so as to melt-fix said pair of resin chips to seal the overlapping portion of said members with said resin chips, wherein:each of said resin chips includes a melting surface facing the other resin chip and an introducing end portion from which said covered wire extends out of the resin chips,at least one of said resin chips has a curved surface portion in the introducing end portion thereof, andsaid curved surface portion continuously changes smoothly and is formed between said melting surface and an outer peripheral surface of said at least one of said resin chips.