초록 ▼

Two covered wires to be conductively connected with each other are overlapped with each other at connection portions. The overlapped connection portions are pinched by a pair of resin chips and then cover portions are melted and conductive wire portions of the covered wires are conductively contacte

Two covered wires to be conductively connected with each other are overlapped with each other at connection portions. The overlapped connection portions are pinched by a pair of resin chips and then cover portions are melted and conductive wire portions of the covered wires are conductively contacted with each other by pressing from the outside of the resin chips at the connection portions. The pair of the resin chips are melted together to seal the connection portions. The pair of the resin chips are provided with wire introducing hole portions formed in a shape of non-through hole gradually narrowing from the introducing end toward the connection portion when the resin chips are fit together. With the cover portions at least at the introducing ends of the covered wires in the wire introducing hole portions left, the resin chips are melted together. Thus, it is possible to ensure an excellent melting operation efficiency and improve the mechanical strength of the entire connection portions.

대표청구항 ▼

[ What is claimed is:] [1.] A covered wire connection structure for conductively connecting members, at least one of the members including a covered wire having a conductive wire portion and a cover portion formed by coating resin around an outer periphery of the conductive wire portion, said struct

[ What is claimed is:] [1.] A covered wire connection structure for conductively connecting members, at least one of the members including a covered wire having a conductive wire portion and a cover portion formed by coating resin around an outer periphery of the conductive wire portion, said structure being formed by overlapping said members with each other and pinching an overlapping portion of said members between a pair of resin chips, pressurizing and exciting said overlapping portion pinched by said resin chips using an ultrasonic vibration welding apparatus so as to melt and disperse said cover portion, thereby to expose the conductive wire portion and electrically conductively connect the conductive wire portion of said one member with the other member at said overlapping portion and so as to melt-fix said pair of resin chips to seal the overlapping portion with said resin chips, characterized in that:a wire introducing hole portion is formed in said pair of resin chips overlapped with each other in a shape of non-through hole gradually narrowing from an introducing end of said covered wire toward said overlapping portion, and wherein the cover portion on the conductive wire portion at the introducing end of said wire introducing hole portion remains when said resin chips are melted together.