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A wet process apparatus, e.g., plating cell for plating a flat substrate introduces a flow of electrolyte or other plating solution across the surface of the substrate to be plated. The substrate is mounted on a holder that is positioned on a door that swings between a horizontal open position and a

A wet process apparatus, e.g., plating cell for plating a flat substrate introduces a flow of electrolyte or other plating solution across the surface of the substrate to be plated. The substrate is mounted on a holder that is positioned on a door that swings between a horizontal open position and a vertical closed position. There is a circular opening in a front wall against which the door seats. The door can have a sealing ring that contacts the wall of the cell outside of the opening. A cathode ring disposed in a recess in the periphery of the opening makes electrical contact with the substrate. The cathode ring can include a thin metal thieving ring. A fluid-powered rotary blade or wiper within the plating chamber rotates to draw bubbles or other impurities from the substrate, and a megasonic transducer applies megasonic acoustic energy to the solution, e.g., at 0.2 to 5 Mhz. The cell can be used for electroless or galvanic plating.

대표청구항 ▼

[ I claim:] [1.] In a wet process arrangement for wet process treatment of a substrate in which a cell contains a solution in which said substrate is immersed; sparger means in the plating cell adapted to introduce the solution into the cell; spillover means on said cell permits the solution to spil

[ I claim:] [1.] In a wet process arrangement for wet process treatment of a substrate in which a cell contains a solution in which said substrate is immersed; sparger means in the plating cell adapted to introduce the solution into the cell; spillover means on said cell permits the solution to spill over from the cell into a fluid return that is adapted to carry away the solution from the cell; carrier means hold the substrate in the cell below the spillover means; fluid conditioning means coupled between the return and the sparger means remove any particulate matter from said solution, condition the solution, and return the solution through a conduit to said sparger means; the improvement wherein said carrier means is disposed on a sealable door in said cell and which sealably seats onto an opening in a side wall of said cell, and which includes means for moving said door between a horizontal open position and a vertical closed position. [5.] A wet process arrangement according to claim 1, wherein said plating cell is adapted for galvanic plating said of substrate with a metal layer, employing an electrolyic solution, and wherein said cell includes a conductive cathode ring disposed at the periphery of said door opening for electrically contacting said substrate when said door is in its closed position.