초록 ▼

A powdered slush molding device has debris capturing devices in its reservoir. A resin material is passed back and forth through openings between the reservoir and the mold by rotating the apparatus back and forth until a film of desired thickness is formed on the mold. The capturing devices capture

A powdered slush molding device has debris capturing devices in its reservoir. A resin material is passed back and forth through openings between the reservoir and the mold by rotating the apparatus back and forth until a film of desired thickness is formed on the mold. The capturing devices capture the debris formed during a molding process. Unwanted debris are then removed from the capturing devices either while the capturing devices remain within the reservoir or by removing them and removing the debris outside the reservoir.

대표청구항 ▼

[ What is claimed is:] [1.] A powder slush molding device for molding film comprising:a reservoir having a holding chamber and at least one entry opening;said holding chamber being effective for holding a resin powder material, for forming said film;a mold for shaping said resin powder material atta

[ What is claimed is:] [1.] A powder slush molding device for molding film comprising:a reservoir having a holding chamber and at least one entry opening;said holding chamber being effective for holding a resin powder material, for forming said film;a mold for shaping said resin powder material attached to said reservoir, said mold having a molding surface, said molding surface communicating with said holding chamber through said at least one entry opening; andat least one capturing means detachably mounted to said reservoir, said capturing means including at least one surface shape effective for capturing fused debris generated during film formation; wherein said capturing means includes means on its surface for catching said fused debris. [5.] A method for capturing fused debris during molding of a film comprising:placing a resin powder material in a reservoir;affixing said reservoir to a mold;heating said mold;moving said reservoir and said mold in a manner to pass said resin powder material through at least one opening between said reservoir and said mold a sufficient number of times to build up a desired thickness of solidified resin material on said mold;forming at least one capturing surface on at least one capturing means; andplacing said at least one capturing means in said reservoir in a position where contact with and capture of said fused debris is performed.