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Multi-stage electronic cooling device 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • H01L-035/28
출원번호 US-0992096 (1997-12-17)
발명자 / 주소
  • Tauchi Hitoshi,JPX
출원인 / 주소
  • Aisin Seiki Kabushiki Kaisha, JPX
대리인 / 주소
    Oblon, Spivak, McClelland, Maier & Neustadt, P.C.
인용정보 피인용 횟수 : 53  인용 특허 : 2

초록

A multi-stage electronic cooling device has an electrically insulating base plate, a first thermoelectric converter portion having the Peltier effect and disposed on one surface of the electrically insulating base plate, and a second thermoelectric converter portion having the Peltier effect and dis

대표청구항

[ What is claimed as new and desired to be secured by Letters Patent of the United States is:] [1.] A multi-stage electronic cooling device comprising:an electrically insulating base plate;a first thermoelectric converter portion having the Peltier effect and disposed on one surface of the electrica

이 특허에 인용된 특허 (2)

  1. Bierschenk James L. (4805 Highgate La. Rowlett TX 75088) Burke Edward J. (1700 Hearthstone Plano TX 75023), Thermoelectric cooler.
  2. Koyanagi Tadamasa (Yasatomachi JPX) Oohira Tsunehiro (Tsukuba JPX), Thermoelectric element sheet in which thermoelectric semiconductors are mounted between films.

이 특허를 인용한 특허 (53)

  1. Brewer,Richard Grant; Upadhya,Girish; Zhou,Peng; McMaster,Mark; Tsao,Paul, Apparatus and method of efficient fluid delivery for cooling a heat producing device.
  2. Kenny,Thomas; McMaster,Mark; Lovette,James, Apparatus and method of forming channels in a heat-exchanging device.
  3. Kenny, Jr.,Thomas William; Goodson,Kenneth E.; Santiago,Juan G.; Everett, Jr.,George Carl, Apparatus for conditioning power and managing thermal energy in an electronic device.
  4. Datta, Madhav; McMaster, Mark, Bonded metal and ceramic plates for thermal management of optical and electronic devices.
  5. Lofy, John, Climate controlled seating assembly with sensors.
  6. Lofy, John, Condensation and humidity sensors for thermoelectric devices.
  7. Lofy, John D., Condensation and humidity sensors for thermoelectric devices.
  8. Kenny, Thomas W.; Munch, Mark; Zhou, Peng; Shook, James Gill; Goodson, Kenneth; Corbin, Dave; McMaster, Mark; Lovette, James, Cooling systems incorporating heat exchangers and thermoelectric layers.
  9. Shook,James Gill; Lovette,James, Decoupled spring-loaded mounting apparatus and method of manufacturing thereof.
  10. Correa, Adrian; Lin, Tien Chih (Eric); Hom, James; Shiomoto, Gregory; Chow, Norman; Leong, Brandon; Brewer, Richard Grant; Werner, Douglas E.; McMaster, Mark, Device and methodology for the removal of heat from an equipment rack by means of heat exchangers mounted to a door.
  11. Correa, Adrian; Lin, Tien-Chieh (Eric); Hom, James; Shiomoto, Gregory; Chow, Norman; Leong, Brandon; Brewer, Richard Grant; Werner, Douglas E.; McMaster, Mark, Device and methodology for the removal of heat from an equipment rack by means of heat exchangers mounted to a door.
  12. Shanfield, Stanley R.; Langdo, Thomas A.; Weinberg, Marc S.; Imhoff, Albert C., Devices, systems, and methods for controlling the temperature of resonant elements.
  13. Shanfield, Stanley R.; Langdo, Thomas A.; Weinberg, Marc S.; Imhoff, Albert C., Devices, systems, and methods for controlling the temperature of resonant elements.
  14. Saiki, Takaki; Honda, Seiji; Sato, Kunihito; Iwasaki, Junichi, Electronic apparatus and image forming apparatus with thermoelectric converters.
  15. Brykalski, Michael J.; Terech, John; Petrovski, Dusko, Environmentally-conditioned bed.
  16. Brykalski, Michael J.; Terech, John; Petrovski, Dusko, Environmentally-conditioned bed.
  17. Munch, Mark; Werner, Douglas E., Gimballed attachment for multiple heat exchangers.
  18. Petrovski, Dusko, Heating and cooling systems for seating assemblies.
  19. Werner,Douglas; Munch,Mark; Kenny,Thomas, Hermetic closed loop fluid system.
  20. Hom, James; Upadhya, Girish; Werner, Douglas E.; Munch, Mark; Tsao, Paul; Conway, Bruce; Zhou, Peng; Brewer, Richard, Integrated liquid to air conduction module.
  21. Hom, James; Choi, Hae-won; Lin, Tien Chih (Eric); Werner, Douglas E.; Chow, Norman; Correa, Adrian; Leong, Brandon; Gopalakrishnan, Sudhakar; Brewer, Richard Grant; McMaster, Mark; Upadhya, Girish, Internal access mechanism for a server rack.
  22. Upadhya,Girish; Kenny,Thomas W.; Zhou,Peng; Munch,Mark; Shook,James Gill; Goodson,Kenneth; Corbin,David, Interwoven manifolds for pressure drop reduction in microchannel heat exchangers.
  23. Chow, Norman; Tsao, Paul; Werner, Douglas E.; McMaster, Mark; Upadhya, Girish; Landry, Frederic; Spearing, Ian; Schrader, Tim, Liquid cooling loops for server applications.
  24. Upadhya, Girish; Munch, Mark; Chow, Norman; Tsao, Paul; Werner, Douglas E.; McMaster, Mark; Landry, Frederic; Spearing, Ian; Schrader, Tim, Liquid cooling loops for server applications.
  25. Goodson,Kenneth; Kenny,Thomas; Zhou,Peng; Upadhya,Girish; Munch,Mark; McMaster,Mark; Horn,James, Method and apparatus for achieving temperature uniformity and hot spot cooling in a heat producing device.
  26. Upadhya,Girish; Brewer,Richard Grant; McMaster,Mark, Method and apparatus for controlling freezing nucleation and propagation.
  27. Kenny,Thomas W.; Munch,Mark; Zhou,Peng; Shook,James Gill; Upadhya,Girish; Goodson,Kenneth; Corbin,Dave; McMaster,Mark; Lovette,James, Method and apparatus for efficient vertical fluid delivery for cooling a heat producing device.
  28. Petrovski, Dusko; Zheng, Sihai; Maass, Michael, Method and system for controlling an operation of a thermoelectric device.
  29. Ladd Michael M. ; Li Kin ; McKenney Frederick D. ; Tanielian Minas H., Method for making advanced thermoelectric devices.
  30. Datta, Madhav; McMaster, Mark; Brewer, Rick; Zhou, Peng; Tsao, Paul; Upadhaya, Girish; Munch, Mark, Method of fabricating high surface to volume ratio structures and their integration in microheat exchangers for liquid cooling system.
  31. Brewer, Richard Grant; Chow, Norman; Hom, James, Methodology of cooling multiple heat sources in a personal computer through the use of multiple fluid-based heat exchanging loops coupled via modular bus-type heat exchangers.
  32. Kenny,Thomas W.; Shook,James Gill; Zeng,Shulin; Lenehan,Daniel J.; Santiago,Juan; Lovette,James, Micro-fabricated electrokinetic pump with on-frit electrode.
  33. Datta, Madhav; Leong, Brandon; McMaster, Mark, Microheat exchanger for laser diode cooling.
  34. Brykalski, Michael; Marquette, David, Moisture abatement in heating operation of climate controlled systems.
  35. Lovette,James; Zhou,Peng; Shook,James Gill, Multi-level microchannel heat exchangers.
  36. Upadhya, Girish; Herms, Richard; Zhou, Peng; Goodson, Kenneth; Hom, James, Optimal spreader system, device and method for fluid cooled micro-scaled heat exchange.
  37. Zhou,Peng; van Der Heide,Dolf; Goodson,Kenneth; Upadhya,Girish, Optimized multiple heat pipe blocks for electronics cooling.
  38. Yu, Chih-Kuang; Liu, Chun-Kai; Tain, Ra-Min, Package structures for integrating thermoelectric components with stacking chips.
  39. Kenny, Jr.,Thomas William; Goodson,Kenneth E.; Santiago,Juan G.; Everett, Jr.,George Carl, Power conditioning module.
  40. Lenehan, Daniel J.; Goodson, Kenneth; Kenny, Thomas W.; Munch, Mark; Sahu, Saroj, Pump and fan control concepts in a cooling system.
  41. Lenehan, Daniel J.; Goodson, Kenneth; Kenny, Thomas W.; Munch, Mark; Sahu, Saroj, Pump and fan control concepts in a cooling system.
  42. Munch,Mark; Goodson,Kenneth; Corbin,David; Zeng,Shulin; Kenny,Thomas W.; Shook,James Gill, Remedies to prevent cracking in a liquid system.
  43. Munch,Mark; Goodson,Kenneth; Corbin,David; Zeng,Shulin; Kenny,Thomas W.; Shook,James Gill, Remedies to prevent cracking in a liquid system.
  44. Munch,Mark; Goodson,Kenneth; Corbin,David; Zeng,Shulin; Kenny,Thomas W.; Shook,James Gill, Remedies to prevent cracking in a liquid system.
  45. Munch,Mark; Goodson,Kenneth; Corbin,David; Zeng,Shulin; Kenny,Thomas W.; Shook,James Gill, Remedies to prevent cracking in a liquid system.
  46. Munch,Mark; Goodson,Kenneth; Corbin,David; Zeng,Shulin; Kenny,Thomas W.; Shook,James Gill, Remedies to prevent cracking in a liquid system.
  47. Petrovski, Dusko, Thermoelectric device.
  48. Petrovski, Dusko; Zheng, Sihai; Maass, Michael, Thermoelectric device controls and methods.
  49. Inaba, Masahiko; Clark, Jay Christopher; Comiskey, Brian, Thermoelectric device with internal sensor.
  50. Sienel, Tobias H., Thermoelectric heat exchanger.
  51. Yamada, Kazukiyo; Tashiro, Kohei; Esaki, Hidenori; Kudou, Tomohide, Thermoelectric module.
  52. Morimoto, Akihiro; Kimura, Takahiro, Thermoelectric module device.
  53. Steinman, Adam Joseph; Bunyak, Kenneth James; Orlando, Bruno Antonio, Vehicle headliner assembly for zonal comfort.
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