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Method and apparatus for sequentially metalizing polymeric films and products made thereby 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • C25D-017/00
출원번호 US-0925220 (1997-09-08)
발명자 / 주소
  • Ameen Thomas J.
  • DeWitt Robert D.
  • Peckham Peter
  • Haines Ronald K.
  • Bay Adam G.
출원인 / 주소
  • Gould Electronics Inc.
대리인 / 주소
    Kusner
인용정보 피인용 횟수 : 4  인용 특허 : 42

초록

An electrolytic cell comprised of a tank for holding electrolytic solution, and a drum rotatable about a horizontal axis having a non-conductive cylindrical outer surface disposed within the tank, and a plurality of elongated, like anodes arranged about the outer surface of the drum. The anodes toge

대표청구항

[ Having described the invention, the following is claimed:] [1.] An electrolytic cell, comprised of:a tank for holding electrolytic solution;a drum disposed within said tank rotatable about a horizontal axis, said drum having a non-conductive cylindrical outer surface;a plurality of elongated anode

이 특허에 인용된 특허 (42)

  1. Adler Edward (266 Arch Rd. Englewood NJ 07631), Anode for production of electrodeposited foil.
  2. DeWitt Robert D. (Lyndhurst OH) Bay Adam G. (Chesterland OH) Paraday Tibor (Eastlake OH), Apparatus for electrodepositing metal.
  3. Kamps Karl H. (Rheinberg DEX) Neuendorf Hans C. (Wesel DEX), Apparatus for the galvanic reinforcement of a conductive trace on a glass pane.
  4. Marton Henry J. (Midland MI) Kurfman Virgil B. (Midland MI), Delamination resistant multilayer metal/polymer composites.
  5. Kurfman Virgil B. (Midland MI), Duplex metal alloy/polymer compositions.
  6. Woodard ; Jr. Kenneth E. (Cleveland TN) Dotson Ronald L. (Cheshire CT), Electrodes for electrolytic cells.
  7. Houska Karl H. (Munich DEX) Floegel Lothar (Neuried DEX) Hauck Joachim (Taufkirchen DEX) Hosten Daniel (Handzame BEX) Denys Wilfried (Oostkamp BEX) Boone Luc (Oostkamp BEX) De Vogelaere Marc (Zedelge, Electrolysis device for the galvanic reinforcement of tape-shaped plastic foils which are precoated to be conductive.
  8. Niksa Andrew J. (Concord OH) Pohto Gerald R. (Mentor OH), Electroplating cell anode.
  9. Bladon John J. (Wayland MA), Electroplating process.
  10. Bladon John J. (Wayland MA) Robinson John N. (Ayer MA) Rousseau Michael (Woburn MA), Electroplating process.
  11. Gulla Michael (Millis MA) Foust Donald F. (Scotia NY) Philipose George K. (Waltham MA), Electroplating process.
  12. Gregory Vernon C. (Escondido CA), Metal substrated printed circuit.
  13. Ameen Thomas J. (Mentor OH) Bay Adam G. (Chesterland OH) DeWitt Robert D. (Lyndhurst OH), Method and apparatus for applying surface treatment to metal foil.
  14. Beyerle Richard A. (Chesterland OH) Plascak Robert J. (Schaumburg IL), Method and apparatus for forming printed circuits.
  15. Fuchs Harold E. (Kansas City MO) McAnany Robert E. (Kansas City MO), Method and apparatus for plating insulating strip.
  16. Ameen Thomas J. (Mentor OH) DeWitt Robert D. (Highland Heights OH) Peckham Peter (Painesville OH) Haines Ronald K. (Mentor OH) Bay Adam G. (Chesterland OH), Method and apparatus for sequentially metalized polymeric films and products made thereby.
  17. Ameen Thomas J. ; DeWitt Robert D. ; Peckham Peter ; Haines Ronald K. ; Bay Adam G., Method and apparatus for sequentially metalizing polymeric films and products made thereby.
  18. Morrissey Denis M. (Glen Cove NY) Takach Peter E. (Garden City South NY) Zeblisky Rudolph J. (Hauppauge NY), Method for electroplating non-metallic surfaces.
  19. Ameen Thomas J. (Mentor OH) DeWitt Robert D. (Highland Heights OH) Peckham Peter (Painesville OH) Haines Ronald K. (Mentor OH) Bay Adam G. (Chesterland OH), Method for forming printed circuits.
  20. Beyerle Richard A. (Chesterland OH) Plascak Robert J. (Schaumburg IL), Method for forming printed circuits by elctroplating.
  21. Sato Junichi (Yokohama JPX), Method for making a raw board for use in printed circuits.
  22. Kurfman Virgil B. (Midland MI), Method for making duplex metal alloy/polymer composites.
  23. Heymann Kurt (Berlin DT) Woldt Gunter (Berlin DT), Method for the preliminary treatment of plastic surfaces for electroplating.
  24. Kurze Peter (Oberlichtenau DDX) Krysmann Waldemar (Karl-Marx-Stadt DDX) Berger Maria (Karl-Marx-Stadt DDX) Rabending Klaus (Taura DDX) Schreckenbach Joachim (Limbach-Oberfrohna DDX) Schwarz Thomas (K, Method for the preparation of decorative coating on metals.
  25. Doty Warren R. (Royal Oak MI) Kinney Timothy J. (Berkley MI), Method for treating plastic substrates prior to plating.
  26. Leidheiser ; Jr. Henry (Bethlehem PA) Konno Hidetaka (Allentown PA), Method of making corrosion inhibited metal.
  27. Nakatsugawa Hiroshi (Yokohama JPX), Method of making electrolytic metal foil and apparatus used therefor.
  28. Beach Sidney C. (Parma OH) Fellman Jack D. (Brunswick OH), Method of plating plastics.
  29. Hamby ; Jr. John T. (Richmond VA) Townsend Wesley P. (Princeton Township ; Mercer County NJ), Methods of providing contact between two members normally separable by an intervening member.
  30. Drauglis Edmund (Columbus OH) Wielonski Roy F. (Worthington OH) Sliemers Francis A. (Columbus OH), Plasma polymerized interfacial coatings for improved adhesion of sputtered bright metal on plastic.
  31. Bladon John J. (Wayland MA), Pretreatment for electroplating process.
  32. Roubal Jiri (Geislingen ; Steige DT) Korpiun Joachim (Geislingen ; Steige DT), Pretreatment of plastic materials for metal plating.
  33. Luce Betty M. (Willowick OH) Berdan Betty L. (Willowick OH), Process and apparatus for electroplating copper foil.
  34. Goffredo Daniel L. (Riverton NJ) Meyer Walter J. (Berlin DEX) Blising Horst (Berlin DEX), Process and apparatus for plating onto articles.
  35. Kadija Igor V. (Cheshire CT) Oxley James E. (New Haven CT), Process and apparatus for producing surface treated metal foil.
  36. Deyrup Edward Johnson (Northeast MD), Process for electroplating polyoxymethylene.
  37. Pendleton Phillip (Cheshire CT), Process for preparing nonconductive substrates.
  38. Piano Anthony M. (Lodi NJ) Galvez Randolfo (North Bergen NJ), Process for preparing the through hole walls of a printed wiring board for electroplating.
  39. Roubal Jiri (Bad berkingen DEX), Process for the production of metal patterns on insulating substrates as well as insulating substrates with metal patter.
  40. Bangs Leigh B. (Midland MI) Tuttle Carole K. (Midland MI) Evani Syamalarao (Midland MI), Process of metal plating on plastics.
  41. Holtzman Abraham M. (Bat Yam ILX) Relis Joseph (Ramat Gan ILX), Selective plating process for the electrolytic coating of circuit boards without an electroless metal coating.
  42. Chamberlain Jamie H. (Concord OH) Bay Adam G. (Chesterland OH) DeWitt Robert D. (Highland Heights OH), Thin plate anode.

이 특허를 인용한 특허 (4)

  1. Clouser Sidney J. ; Wang Jiangtao ; Briggs John C. ; Stevens Michael L., Anode structure for manufacture of metallic foil.
  2. Gheeraert Philippe,FRX ; Vienne Jean-Marie,FRX ; Vandenbussche Bernard,FRX, Electroplating installation, electrode and support device for this installation and electroplating process.
  3. Philippe Gheeraert FR; Jean-Marie Vienne FR; Bernard Vandenbussche FR, Electroplating installation, electrode and support device for this installation and electroplating process.
  4. Miyamoto, Matsuhiro; D'Urso, John J.; Fujimoto, Takuya; Ichikawa, Masateru, Method and apparatus for fabrication of metal-coated optical fiber, and the resulting optical fiber.
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