초록 ▼

A mounting for a flip chip integrated circuit device having a light sensitive cell is disclosed. The mounting includes an insulating substrate having an aperture between its first and second surfaces. A flip chip integrated circuit device is placed on the first surface of the substrate. A light sens

A mounting for a flip chip integrated circuit device having a light sensitive cell is disclosed. The mounting includes an insulating substrate having an aperture between its first and second surfaces. A flip chip integrated circuit device is placed on the first surface of the substrate. A light sensitive cell of the integrated circuit device faces the aperture. Solder bumps on the integrated circuit are electrically connected to corresponding conductive metallizations on the first surface of the substrate. A transparent aperture cover is affixed to the second surface of the substrate with an adhesive bead. The aperture cover extends over the aperture, allowing light to be transmitted through the aperture cover to the light sensitive cell. The side surfaces of the aperture cover include features for locking the adhesive bead to the aperture cover. The numerous locking features disclosed include protrusions and indentations that engage the adhesive bead and thereby enhance the connection of the aperture cover to the substrate.

대표청구항 ▼

[ I claim:] [19.] A mounting for an integrated circuit device comprising:an insulating substrate having a first surface, an opposite second surface, and an aperture through the substrate between the first and second surfaces, said first surface including conductive metallization;an integrated circui

[ I claim:] [19.] A mounting for an integrated circuit device comprising:an insulating substrate having a first surface, an opposite second surface, and an aperture through the substrate between the first and second surfaces, said first surface including conductive metallization;an integrated circuit device having a first surface, wherein the first surface of the integrated circuit device has a plurality of conductive pads thereon and a light sensitive cell; anda transparent aperture cover having first surface;wherein the first surface of the integrated circuit device faces and is affixed to the first surface of the substrate, the light sensitive cell is aligned with the aperture, and the conductive pads of the integrated circuit device are electrically connected to the conductive metallization on the first surface of the substrate; anda first adhesive material affixing the first surface of the aperture cover to the second surface of the substrate around the aperture so that the aperture cover transmits light to the light sensitive cell through the aperture;wherein said aperture cover includes a side surface adjacent to said first surface, and said side surface includes a means for enhancing a connection between said first adhesive material and said aperture cover; andwherein said means and only about 0.125 mm or less of a peripheral portion of the first surface of the aperture cover are in contact with said first adhesive material.