$\require{mediawiki-texvc}$
  • 검색어에 아래의 연산자를 사용하시면 더 정확한 검색결과를 얻을 수 있습니다.
  • 검색연산자
검색연산자 기능 검색시 예
() 우선순위가 가장 높은 연산자 예1) (나노 (기계 | machine))
공백 두 개의 검색어(식)을 모두 포함하고 있는 문서 검색 예1) (나노 기계)
예2) 나노 장영실
| 두 개의 검색어(식) 중 하나 이상 포함하고 있는 문서 검색 예1) (줄기세포 | 면역)
예2) 줄기세포 | 장영실
! NOT 이후에 있는 검색어가 포함된 문서는 제외 예1) (황금 !백금)
예2) !image
* 검색어의 *란에 0개 이상의 임의의 문자가 포함된 문서 검색 예) semi*
"" 따옴표 내의 구문과 완전히 일치하는 문서만 검색 예) "Transform and Quantization"

특허 상세정보

Mounting having an aperture cover with adhesive locking feature for flip chip optical integrated circuit device

국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판) H01L-031/0203   
미국특허분류(USC) 361/783 ; 361/820 ; 257/433 ; 257/434 ; 257/680 ; 257/681 ; 257/704 ; 438/116 ; 174/052.2 ; 174/052.3
출원번호 US-0118197 (1998-07-17)
발명자 / 주소
출원인 / 주소
대리인 / 주소
    Skjerven, Morrill, MacPherson, Franklin & Friel LLPMacPherson
인용정보 피인용 횟수 : 89  인용 특허 : 16
초록

A mounting for a flip chip integrated circuit device having a light sensitive cell is disclosed. The mounting includes an insulating substrate having an aperture between its first and second surfaces. A flip chip integrated circuit device is placed on the first surface of the substrate. A light sensitive cell of the integrated circuit device faces the aperture. Solder bumps on the integrated circuit are electrically connected to corresponding conductive metallizations on the first surface of the substrate. A transparent aperture cover is affixed to the s...

대표
청구항

[ I claim:] [19.] A mounting for an integrated circuit device comprising:an insulating substrate having a first surface, an opposite second surface, and an aperture through the substrate between the first and second surfaces, said first surface including conductive metallization;an integrated circuit device having a first surface, wherein the first surface of the integrated circuit device has a plurality of conductive pads thereon and a light sensitive cell; anda transparent aperture cover having first surface;wherein the first surface of the integrated ...

이 특허에 인용된 특허 (16)

  1. Choi Sihn,KRX. Charge coupled device (CCD) semiconductor chip package. USP1998055753857.
  2. Chun Heung S. (Seoul KRX). Charge coupled device package with glass lid. USP1994105352852.
  3. Nagano Tuyosi (Tokyo JPX). Chip carrier for optical device. USP1994105357056.
  4. Hoffman Paul R. (Modesto CA) Strauman Linda E. (Oakdale CA) Liang Dexin (Modesto CA) Pareno Sonny S. (Stockton CA) Ramirez German J. (Antioch CA). Electronic package having controlled epoxy flow. USP1993085239131.
  5. Austin Francis D. (Haymarket) Kachmarik Richard (Bealeton) Olson Leonard T. (Centreville VA). High speed optical interconnect. USP1993045200631.
  6. Ozawa Kazuhito (Nara JPX). LSI chip and method of producing same. USP1992065118370.
  7. Juskey Frank J. (Coral Springs FL) Suppelsa Anthony B. (Coral Springs FL) Dorinski Dale W. (Coral Springs FL). Light erasable multichip module. USP1995085438216.
  8. Zollo James A. (Plantation FL) Doutre Barbara R. (Plantation FL) Yorio Rudy (Boca Raton FL). Method and assembly for mounting an electronic device having an optically erasable surface. USP1996025495450.
  9. Marrs Robert C. (Scottsdale AZ). Method for interconnection of integrated circuit chip and substrate. USP1995125478007.
  10. Krivanek Ondrej L.,GB2 ; Mooney Paul Edward ; Swann Nils Timothy. Optically coupled large-format solid state imaging apparatus having edges of an imaging device. USP1998105818035.
  11. Nishizawa Hideaki (Osaka JPX). Package for optical device. USP1987054663652.
  12. Bigler Robert R. (Moorestown NJ) Goldfarb Samuel (Princeton NJ). Package for solid state image sensors. USP1988074760440.
  13. Segawa Masao,JPX ; Ooi Kazushige,JPX ; Kimura Masanobu,JPX ; Sugi Shuichi,JPX. Photoelectric converting device with anisotropically conductive film for connecting leads of wiring board and electrode. USP1998075786589.
  14. Byrne Robert C. (Sunnyvale CA) Ewanich Jon T. (San Jose CA) Yu Chee-Men (Singapore TWX). Process of making a ceramic lid for use in a hermetic seal package. USP1989054833102.
  15. Nishiguchi Masanori (Yokohama JPX). Semiconductor chip module. USP1995025387815.
  16. Orton Kevin R. (970 Calle Negocio San Clemente CA 92672). Surface-mount LED. USP1994075331512.

이 특허를 인용한 특허 피인용횟수: 89

  1. Mott, Lawrence; Bettger, Kenneth; Brown, Elliot. Asymmetrical flexible edge seal for vacuum insulating glass. USP2012108283023.
  2. Mostafazadeh,Shahram; Smith,Joseph O.. Bumped integrated circuits for optical applications. USP2006037012282.
  3. Mostafazedeh, Shahram; Smith, Joseph O.. Bumped integrated circuits for optical applications. USP2004036707148.
  4. Kim, Young-Seok; Kwon, Hyeok-Hwan; Choi, Hyun-Kyu; Lee, Hwan-Chul. Camera module. USP2010057720374.
  5. Onodera, Masanori; Moriya, Susumu; Kobayashi, Izumi; Aoki, Hiroshi; Sawahata, Koji; Iriguchi, Shigeo; Honda, Toshiyuki; Hiraiwa, Katsuro. Camera module equipped with an optical filter having an edge not in contact with a fixing portion. USP2010027659937.
  6. Webster,Steven. Camera module fabrication method including singulating a substrate. USP2007047199359.
  7. Webster,Steven. Camera module fabrication method including the step of removing a lens mount and window from the mold. USP2008027332712.
  8. Webster,Steven. Camera module having a threaded lens barrel and a ball grid array connecting device. USP2006107126111.
  9. Glenn, Thomas P.; Webster, Steven. Camera module with window mechanical attachment. USP2010087786429.
  10. Combs, Edward G.; Sheppard, Robert P.; Pun, Tai Wai; Ng, Hau Wan; Fan, Chun Ho; McLellen, Neil Robert. Enhanced thermal dissipation integrated circuit package. USP2004056734552.
  11. Bettger, Kenneth J.; Stark, David H.. Filament-strung stand-off elements for maintaining pane separation in vacuum insulating glazing units. USP2013088512830.
  12. Bettger, Kenneth J.; Stark, David H.. Flexible edge seal for vacuum insulating glazing units. USP2012128329267.
  13. Glenn, Thomas P.; Webster, Steven; Hollaway, Roy Dale. Flip chip image sensor package fabrication method. USP2003066571466.
  14. Glenn, Thomas P.; Webster, Steven; Hollaway, Roy Dale. Flip chip on glass sensor package. USP2005026849916.
  15. Tanaka Yuji,JPX. Flip-chip bonding parts, flip-chip bonding confirmation parts and a flip-chip bonding method. USP2000096116493.
  16. Stark, David H.. Hermetically sealed micro-device package using cold-gas dynamic spray material deposition. USP2005086924974.
  17. Stark, David H.. Hermetically sealed micro-device package with window. USP2004076759590.
  18. Stark,David H.. Hermetically sealed micro-device package with window. USP2007077238546.
  19. Cohn, Michael B.. High force MEMS device. USP2010047692521.
  20. Watanabe, Naoyuki; Honda, Toshiyuki; Akutagawa, Yoshito; Moriya, Susumu; Kobayashi, Izumi. Image capturing device. USP2009117616250.
  21. Webster, Steven. Image sensor package. USP2004096791076.
  22. Webster, Steven. Image sensor package fabrication method. USP2005106956201.
  23. Stark, David H. Insulated glazing units. USP2010117832177.
  24. Stark, David H.. Insulating glass unit having multi-height internal standoffs and visible decoration. USP2011087989040.
  25. Zhang,Leilei. Integrated circuit package and method of attaching a lid to a substrate of an integrated circuit. USP2008067388284.
  26. Dosdos, S. Gabriel R.; Kim, Dong Wook. Integrated circuit package and method of forming an integrated circuit package. USP2013018362609.
  27. Pedron, Serafin; McLellan, Neil Robert; Yee, Lin Tsui. Integrated circuit package and method of manufacturing the integrated circuit package. USP2005096940154.
  28. Zohni, Nael; Nagarajan, Kumar; Boja, Ronilo. Integrated circuit packaging devices and methods. USP2014088810028.
  29. Masumoto,Kenji. Integrated circuit structure having a flip-chip mounted photoreceiver. USP2006027005719.
  30. Boyle John J. ; Robbins William L.. Intergrated circuit die assembly. USP2000026020646.
  31. Wu,Paul Ying Fung; Chee,Soon Shin; Hsieh,Steven H. C.. Lid and method of employing a lid on an integrated circuit. USP2008097429501.
  32. Wu,Paul Ying Fung; Chee,Soon Shin; Hsieh,Steven H. C.. Lid and method of employing a lid on an integrated circuit. USP2006037012326.
  33. Kim, Do Hyung; Lee, Chung-Hoon. Light emitting diode and method of fabricating the same. USP2014088809892.
  34. Kim, Do Hyung; Lee, Chung-Hoon. Light emitting diode and method of fabricating the same. USP2011118058662.
  35. Cohn, Michael Bennett; Xu, Ji-Hai. MEMS device with integral packaging. USP2012058179215.
  36. Francis, IV, William H.; Freebury, Gregg E.; Beidleman, Neal J.; Hulse, Michael. Method and apparatus for an insulating glazing unit and compliant seal for an insulating glazing unit. USP2016059328512.
  37. Boyle John J. ; Robbins William L.. Method for attaching a die to a carrier utilizing an electrically nonconductive layer. USP2001036204090.
  38. Peterson, Kenneth A.; Watson, Robert D.. Method of fabricating a microelectronic device package with an integral window. USP2003036531341.
  39. Glenn, Thomas P.; Webster, Steven. Method of fabricating and using an image sensor package. USP2005096946316.
  40. Thomas P. Glenn ; Steven Webster. Method of fabricating image sensor packages in an array. USP2002056389687.
  41. Chiang, Cheng-Lien. Method of forming a three-dimensional stacked semiconductor package device. USP2004046716670.
  42. Thomas P. Glenn. Method of making a plastic package for an optical integrated circuit device. USP2002076420204.
  43. Chiang, Cheng-Lien. Method of making a semiconductor package device that includes a conductive trace with recessed and non-recessed portions. USP2005066908794.
  44. Chiang,Cheng Lien. Method of making a semiconductor package device that includes an insulative housing with first and second housing portions. USP2006016989295.
  45. Chiang,Cheng Lien. Method of making a semiconductor package device that includes singulating and trimming a lead. USP2006016987034.
  46. Chiang, Cheng-Lien. Method of making an optoelectronic semiconductor package device. USP2005086936495.
  47. Ong,King Hoo; Khor,Lily; Liew,Boon Pek; Thong,Kai Choh. Method of manufacturing a cavity package. USP2007097273767.
  48. Combs,Edward G.; Sheppard,Robert P.; Pun,Tai Wai; Ng,Hau Wang; Fan,Chun Ho; McLellen,Neil Robert. Method of manufacturing an enhanced thermal dissipation integrated circuit package. USP2006037015072.
  49. McLellan, Neil Robert; Fan, Chun Ho; Combs, Edward G.; Cheung, Tsang Kwok; Keung, Chow Lap; Labeeb, Sadak Thamby. Method of manufacturing an integrated circuit package. USP2004096790710.
  50. Chiang, Cheng-Lien. Method of testing a semiconductor package device. USP2004086774659.
  51. Salatino,Matthew M.; Weber,Patrick O.. Methods and apparatus for making integrated circuit package including opening exposing portion of the IC. USP2006057049166.
  52. Haskett, Bradley Morgan; O'Connor, John Patrick; Miller, Mark Myron; Crowley, Sean Timothy; Miks, Jeffrey Alan; Popovich, Mark Phillip. Micro-optical device packaging system. USP2013058445984.
  53. Cohn, Michael Bennett; Kung, Joseph T.. Microelectromechanical systems using thermocompression bonding. USP2010077750462.
  54. Cohn,Michael B.; Kung,Joseph T.. Microelectromechanical systems using thermocompression bonding. USP2007107276789.
  55. Kenneth A. Peterson ; Robert D. Watson. Microelectronic device package with an integral window. USP2002056384473.
  56. Steven Webster. Molded image sensor package. USP2002096455774.
  57. Webster, Steven. Molded image sensor package and method. USP2015038994860.
  58. Steven Webster. Molded image sensor package having lens holder. USP2002116483101.
  59. Webster, Steven. Molded semiconductor package. USP2017089735191.
  60. Webster, Steven. Molded semiconductor package with snap lid. USP2016059332164.
  61. Miller, Seth A.; Stark, David H.; Francis, IV, William H.; Puligandla, Viswanadham; Boulos, Edward N.; Pernicka, John. Multi-pane glass unit having seal with adhesive and hermetic coating layer. USP2015028950162.
  62. Chiang, Cheng-Lien. Multichip semiconductor package device. USP2004066744126.
  63. Paek, Jong Sik. Optical device packages having improved conductor efficiency, optical coupling and thermal transfer. USP2004056740950.
  64. Chiang, Cheng-Lien. Optoelectronic semiconductor package device. USP2004106803651.
  65. Heckman, James Kent; Shermer, Stephen Gregory. Placement template and method for placing optical dies. USP2005036861720.
  66. Glenn Thomas P.. Plastic package for an optical integrated circuit device and method of making. USP2001086274927.
  67. Shoji,Hiroyuki. Resin-molded package with cavity structure. USP2007037187073.
  68. Lin, Charles W. C.. Semiconductor chip assembly with interlocked conductive trace. USP2003116653742.
  69. Lin, Charles W.C.. Semiconductor chip assembly with interlocked conductive trace. USP2003066576539.
  70. Okada, Akira; Sato, Mitsuru. Semiconductor device for fingerprint recognition. USP2011087989938.
  71. Okada,Akira; Sato,Mitsuru. Semiconductor device for fingerprint recognition. USP2006037015579.
  72. Miyawaki, Katumi. Semiconductor device having a package structure. USP2003096621161.
  73. Shivkumar, Bharat; Cheah, Chuan. Semiconductor multichip module package with improved thermal performance; reduced size and improved moisture resistance. USP2014018629566.
  74. Chiang, Cheng-Lien. Semiconductor package device. USP2005056891276.
  75. Chiang,Cheng Lien. Semiconductor package device that includes a conductive trace with a routing line, a terminal and a lead. USP2006016989584.
  76. Chiang,Cheng Lien. Semiconductor package device that includes an insulative housing with a protruding peripheral portion. USP2006037009309.
  77. Yu, Chen Shih; Yang, Chih-Jen; Jui-Hsiang, Hung; Liu, Chin Jeng; Yang, Chen-Hsung. Semiconductor package with die pad having recessed portion. USP2004106809408.
  78. Glenn,Thomas P.; Webster,Steven. Snap lid camera module. USP2008097425750.
  79. Thomas P. Glenn ; Steven Webster. Snap lid image sensor package. USP2002116483030.
  80. Nishida, Kazuhiro; Maeda, Hiroshi; Negishi, Yoshihisa; Hosaka, Shunichi; Watanabe, Eiji; Yasumatsu, Masatoshi. Solid-state imaging device and method for manufacturing the same. USP2010037688382.
  81. Nishida, Kazuhiro; Maeda, Hiroshi; Negishi, Yoshihisa; Hosaka, Shunichi; Yasumatsu, Masatoshi; Watanabe, Eiji. Solid-state imaging device and method for manufacturing the same. USP2010047692720.
  82. Thomas P. Glenn. Surface acoustical wave flip chip. USP2002096448635.
  83. Glenn, Thomas P.; Webster, Steven; Hollaway, Roy Dale. Thin image sensor package. USP2003096627864.
  84. Jeanice Glenn; Di Caprio, Vincent; Webster, Steven; Glenn, Thomas P.. Thin integrated circuit package having an optically transparent window. USP2004086784534.
  85. Chiang,Cheng Lien. Three-dimensional stacked semiconductor package device with bent and flat leads and method of making same. USP2007037190060.
  86. Stark, David H.. Wafer-level hermetic micro-device packages. USP2009047517712.
  87. Stark, David H.. Wafer-level hermetic micro-device packages. USP2005116962834.
  88. Li, Zong-Fu. Windowed package for electronic circuitry. USP2003026525944.
  89. Gotoh Masashi,JPX ; Kanazawa Jitsuo,JPX ; Yamamoto Syuichiro,JPX. Wiring board and process for the production thereof. USP2001036204454.