초록 ▼

An electronic package assembly for being electrically connected to a conducting member (e.g., a printed circuit board) wherein the assembly includes a pair of substrates. The first substrate includes opposing circuit patterns, those on one surface being of higher density and thus adapted for having

An electronic package assembly for being electrically connected to a conducting member (e.g., a printed circuit board) wherein the assembly includes a pair of substrates. The first substrate includes opposing circuit patterns, those on one surface being of higher density and thus adapted for having high density electronic devices mounted thereon. This high density pattern is electrically coupled to the lesser density second pattern which is connected to contacts of a second substrate. These contacts are of the lesser density also, and extend through a dielectric member for being coupled to conductors (e.g., copper circuit pads) on the conducting member. Ready separability of various parts of the assembly is thus assured.

대표청구항 ▼

[ What is claimed is:] [1.] An electronic package assembly for being electrically coupled to a conducting member having a plurality of first receiving conductors, said package assembly comprising:a first substrate including a first surface having an electrical pattern thereon of a first density, a s

[ What is claimed is:] [1.] An electronic package assembly for being electrically coupled to a conducting member having a plurality of first receiving conductors, said package assembly comprising:a first substrate including a first surface having an electrical pattern thereon of a first density, a second surface having an electrical pattern thereon of a second density less than said first density, said electrical patterns on said first and second surfaces being electrically interconnected, and at least one layer of dielectric material located substantially between said first and second surfaces;at least one electronic component electrically coupled to said electrical pattern on said first surface; anda second substrate including a dielectric member having a first surface and a plurality of second conductors therein and adapted for being positioned on said conducting member, said second conductors including a plurality of pins each including an enlarged head portion projecting above said first surface of said second substrate, said enlarged head portion having a downwardly facing shoulder abutting said first surface of said second substrate, selected ones of said head portions of said pins of said second substrate being directly coupled to said electrical pattern on said second surface of said first substrate and of a similar density as said second density, said second substrate assisting in the maintenance of a uniform height of the to surfaces of said head portions whereby connection to said electrical pattern on said second surface of said first substrate is aided, said pins further including projecting tail portions adapted for being positioned within and electrically coupled to respective ones of said first receiving conductors of said conducting member in a separable manner when said second substrate is positioned thereon, said second substrate assisting in the maintenance of a uniform spacing of said tail portions whereby connection to said first receiving conductors is assured, the dielectric material of said dielectric member and the dielectric material of said first substrate having substantially similar thermal coefficients of expansion.