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Evaporator for use in an extended air cooling system for electronic components 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • F25D-023/12
  • F28D-015/00
출원번호 US-0052416 (1998-03-31)
발명자 / 주소
  • Chu Richard C.
  • Chrysler Gregory M.
출원인 / 주소
  • International Business Machines Corporation
대리인 / 주소
    Cutter
인용정보 피인용 횟수 : 47  인용 특허 : 11

초록

A thermosyphon system employs a flat evaporator which is matched to its function of cooling vertically oriented electronic circuit modules. The evaporator is connected in a thermosyphon system which facilitates air cooling and the closer spacing of electronic components whose immediate volume region

대표청구항

[ The invention claimed is:] [1.] An evaporator plate for use in a thermosyphon cooling system, said plate comprising:a substantially flat, sealable housing having an inlet port disposed on a lower portion thereof and an outlet port disposed on an upper portion thereof; and also including a thermall

이 특허에 인용된 특허 (11)

  1. Edelstein Fred (Hauppauge NY) Haslett Robert A. (Dix Hills NY) Kosson Robert L. (Massapequa NY) Harwell William (Coram NY), Capillary-pumped heat transfer panel and system.
  2. Phillips Richard J. (Alachua FL) Larson Ralph I. (Bolton MA), Computer cooling system operable under the force of gravity in first orientation and against the force of gravity in sec.
  3. Kondou Yoshihiro (Ibaraki JPX) Matsushima Hitoshi (Ryugasaki JPX) Hatada Toshio (Tsuchiura JPX) Inouye Hiroshi (Ibaraki JPX) Komatsu Toshihiro (Ibaraki JPX) Ohba Takao (Hadano JPX) Yamagiwa Akira (Ha, Cooling apparatus of electronic equipment.
  4. Osakabe Hiroyuki (Chita-gun JPX) Kawaguchi Kiyoshi (Toyota JPX) Suzuki Masahiko (Hoi-gun JPX), Cooling apparatus using boiling and condensing refrigerant.
  5. Iversen Arthur H. (Saratoga CA), Cooling of large high power semi-conductors.
  6. Leyssens Francois J. C. (Mortsel BEX) Rombouts Hendrikus M. J. (Zoersel BEX), Cooling system.
  7. Hatada Toshio (Tsuchiura JPX) Atarashi Takayuki (Tsuchiura JPX) Daikoku Takahiro (Ushiku NY JPX) Kobayashi Satomi (New York NY) Zushi Shizuo (Hadano JPX) Kobayashi Fumiyuki (Sagamihara JPX) Iwai Susu, Cooling system for cooling an electronic device and heat radiation fin for use in the cooling system.
  8. LaViolette Kerry D. (Liverpool NY) Uhl Robert F. (Manlius NY) Vinkenvleugel Lucius T. (Eindhoven NLX), Electronics housing with improved heat rejection.
  9. Lynes Kenneth W. (Lindsay CAX) Nepovim Zdenek (Lindsay CAX), Finned housing.
  10. Balan Albert L. (Endwell NY), Multileveled electronic assembly with cooling means.
  11. Diggelmann Hans (Neuenegg CHX) Ulrich Bohdan (Kehrsatz CHX), Process and apparatus for dissipating the heat loss of at least one assembly of electrical elements.

이 특허를 인용한 특허 (47)

  1. VanGilder, James William; Healey, Christopher M.; Zhang, Xuanhang, Analysis of effect of transient events on temperature in a data center.
  2. Rockenfeller,Uwe, Apparatus and method for cooling electronics and computer components with managed and prioritized directional air flow heat rejection.
  3. Tsai,Ming Kun, CPU cooler.
  4. Tavassoli,Kamran; Porreca,Paul J.; Sullivan,Robert C., Card cage with parallel flow paths having substantially similar lengths.
  5. Luo, Chin Kuang, Computer module.
  6. Konstad, Rolf A.; Gwin, Paul J., Computer system that can be operated without a cooling fan.
  7. Sharp, Anthony C.; Hudz, Andrew; Jeffery, Peter, Cooling airflow distribution device.
  8. Sharp, Anthony C.; Hudz, Andrew; Jeffery, Peter, Cooling airflow distribution device.
  9. Sharp, Anthony C.; Hudz, Andrew; Jeffery, Peter, Cooling airflow distribution device.
  10. Sharp,Anthony C.; Hudz,Andrew; Jeffery,Peter, Cooling airflow distribution device.
  11. Sharp,Anthony C.; Hudz,Andrew; Jeffery,Peter, Cooling airflow distribution device.
  12. Jochim, Jayson Michael; Chen, Angela; Farshchian, Soheil; Leung, Winnie; Lau, Michael Chi Kin, Cooling electronic devices in a data center with cooling units mounted in bays of a server rack frame assembly.
  13. Rasmussen, Neil; Bean, John H.; Uhrhan, Greg R.; Buell, Scott D., Cooling system and method.
  14. Rasmussen, Neil; Bean, Jr., John H.; Uhrhan, Greg R.; Buell, Scott D., Cooling system and method.
  15. Day, Tony, Data center cooling.
  16. Day, Tony, Data center cooling.
  17. Day, Tony, Data center cooling.
  18. Day, Tony, Data center cooling.
  19. Day, Tony, Data center cooling.
  20. Bilski, W. John, Electronics cabinet and rack cooling system and method.
  21. Broome, John P., Equipment rack with integral HVAC and power distribution features.
  22. Chu Richard C. ; Chrysler Gregory M., Extended air cooling with heat loop for dense or compact configurations of electronic components.
  23. Lai, Cheng-Tien; Lee, Tsung-Lung; Wang, Shenghua, Heat dissipation device.
  24. Wexler, Peter, In-row air containment and cooling system and method.
  25. L. Ronald Hoover ; Jon Zuo ; A. L. Phillips, Integrated thermal architecture for thermal management of high power electronics.
  26. Alex,Belits; Valeriy,Belits, Low-profile thermosyphon-based cooling system for computers and other electronic devices.
  27. Yazawa, Kazuaki; Bar-Cohen, Avram, Method and apparatus for converting dissipated heat to work energy.
  28. Tutunoglu, Ozan, Method and apparatus for cooling.
  29. Tutunoglu, Ozan; Bean, Jr., John H., Method and apparatus for cooling.
  30. Tutunoglu, Ozan; Lingrey, David James, Method and apparatus for cooling.
  31. Tutunoglu, Ozan; Bean, Jr., John H., Method of operating a cooling system having one or more cooling units.
  32. Bean, Jr., John H., Modular ice storage for uninterruptible chilled water.
  33. Bean, Jr., John H., Modular ice storage for uninterruptible chilled water.
  34. Joshi, Yogendra; Murthy, Sunil S.; Nakayama, Wataru, Orientation-independent thermosyphon heat spreader.
  35. Frank,Michael; van Hasselt,Peter, Refrigeration plant for parts of installation, which are to be chilled.
  36. DiPaolo, Frank E., Spiral copper tube and aluminum fin thermosyphon heat exchanger.
  37. Shrivastava, Saurabh K.; VanGilder, James W., System and method for arranging equipment in a data center.
  38. VanGilder, James William, System and method for prediction of temperature values in an electronics system.
  39. Healey, Christopher M.; Zhang, Xuanhang, System and method for sequential placement of cooling resources within data center layouts.
  40. Sishtla Vishnu M. ; Stark Michael A., System for removing parasitic losses in a refrigeration unit.
  41. Khrustalev, Dmitry; Zuo, Jon, Thermal bus for cabinets housing high power electronics equipment.
  42. Garner, Scott D., Thermal management system and method for electronics system.
  43. Garner, Scott D., Thermal management system and method for electronics system.
  44. Garner,Scott D., Thermal management system and method for electronics system.
  45. Kazuya Sone JP, Thermosiphon for refrigerating machine.
  46. Dixit, Abhinav; Singhal, Atul; Woolard, David Glenn; Malik, Tarun, Thermosyphon cooling apparatus with isolation of cooled components.
  47. Carlson, Andrew B.; Clidaras, Jimmy; Hamburgen, William, Warm floor data center.
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