초록 ▼

A semiconductor package and method for preparing same to obtain improved die adhesion to organic chip carriers has been developed. A copper die bond pad is coated with a passivation material and attached to an organic card with the same passivation material. A semiconductor die may be adhered to the

A semiconductor package and method for preparing same to obtain improved die adhesion to organic chip carriers has been developed. A copper die bond pad is coated with a passivation material and attached to an organic card with the same passivation material. A semiconductor die may be adhered to the coated die bond pad with either the same passivation material or a common die bond adhesive. Alternatively, the passivation material is coated only on the portion of the die bond pad where the die is attached, and common die bond adhesive attaches the die bond pad to the organic card.

대표청구항 ▼

[ What is claimed is:] [1.] A semiconductor package, comprising:a semiconductor die;a die bond pad having a copper core with a passivaton coating on a surface of said die bond pad, wherein the passivation coating includes a cured epoxy based material, the cured epoxy based material further including

[ What is claimed is:] [1.] A semiconductor package, comprising:a semiconductor die;a die bond pad having a copper core with a passivaton coating on a surface of said die bond pad, wherein the passivation coating includes a cured epoxy based material, the cured epoxy based material further including an electrically and thermally conductive material, further wherein said semiconductor die is attached to said die bond pad at the passivation coating with a die bond adhesive thereby forming a passivation coating/die bond adhesive interface having an adhesion value of the interface of the passivation coating and the die bond adhesive which is greater than an adhesion value provided by an interface of a noble metal passivation coating and a die bond adhesive by an amount on the order of 2-5 times greater; andan organic card attached to said die bond pad at the passivation coating in a region other than where said semiconductor die is attached.