[특허]Vibration damped and stiffened circuit articles

[미국특허] Vibration damped and stiffened circuit articles 원문보기

IPC분류정보
국가/구분	United States(US) Patent 등록
국제특허분류(IPC7판)	B32B-003/28
출원번호	US-0769987 (1996-12-19)
발명자 / 주소	McCutcheon Jeffrey W.
출원인 / 주소	Minnesota Mining and Manufacturing Company
인용정보	피인용 횟수 : 34 인용 특허 : 8

초록 ▼

The present invention provides circuit articles which are damped and stiffened relative to resonant vibrations and shock. At least one vibration damping and stiffening member comprising a constraining member comprising a base having at least one projection and a layer(s) of vibration damping material is attached to the circuit article. These member(s) act to stiffen the circuit article and also add significant damping to the circuit article while potentially taking up only a relatively small circuit article surface area.

대표청구항 ▼

[ I claim:] [1.] A damped and stiffened circuit article comprising:(a) a circuit article having at least one substantially flat surface;(b) a vibration damping and stiffening member(s) attached to at least one substantially flat surface of the circuit article, wherein each vibration damping and stiffening member independently comprises:(I) a constraining member, wherein the constraining member comprises:(i) a base, wherein the base has an upper surface, a lower surface, and at least one side; and(ii) at least one projection attached to and extending away from the base in a manner such that at least one of the following is true: (A) at least one projection is attached to and extends away from an upper surface of the base, (B) at least one projection is attached to and extends away from a lower surface of the base, (C) at least one projection is attached to and extends away from an upper surface of the base and at least one projection is attached to and extends away from a lower surface of the base; rein the height of at least one projection is at least about 10% of the average thickness of the base; wherein the average thickness of the base of at least one vibration damping and stiffening member falls within the range of about 0.0254 to about 7.62 mm: wherein the width of the base of at least one vibration damping and stiffening member falls within the range of about 1.27 to about 76.2 mm; and wherein the height of at least one projection of at least one vibration damping and stiffening member ranges from about 0.0254 to about 76.2 mm;(II) a vibration damping material layer(s) comprising a viscoelastic material(s) wherein the vibration damping material layer(s) have a loss factor of at least about 0.01 and a Young's modulus of at least about 3.times.10.sup.3 Pascals at 25 degrees C., wherein the vibration damping material layer(s) is bonded to at least a portion of the lower surface of the base;(III) optionally an intermediate connecting member attached to the vibration damping material layer(s) on a side opposite the constraining member, wherein the intermediate connecting member has a Young's modulus greater than the Young's modulus of the vibration damping material layer(s); rein the constraining member has a Young's modulus greater than the Young's modulus of the vibration damping material layer(s); rein the vibration damping and stiffening member(s) is attached to at least one substantially flat surface of the circuit article in a manner such that the circuit article is stiffened and vibrationally damped; and rein about 0.005 to about 20 percent of the total area of the circuit article has vibration damping and stiffening member(s) attached thereto such that the damping of the circuit article is improved by at least about 10% in at least one vibrational mode compared to a same circuit article subjected to a same static or dynamic input without any vibration damping and stiffening members attached.

이 특허에 인용된 특허 (8) 인용/피인용 타임라인 분석

Isaacs Phillip (Rochester MN) Swain Miles (Hayfield MN), Circuit card having a large module strain relief and heat sink support.
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Bschorr Oskar (Munich DEX) Albrecht Helmut (Weyarn DEX), Damper for sound conducted in solids.
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Ko Chan U. (Woodbury MN) Purgett Mark D. (Oakdale MN) Melancon Kurt C. (St. Paul MN) Lucast Donald H. (North St. Paul MN) McIntyre Daniel K. (St. Paul MN), Pressure-sensitive adhesives.
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Jamieson John A. (Downey CA), Printed circuit board stiffener.
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Galvin Lee Robert (Scottsdale AZ), Technique for damping electronic module printed wiring board.
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Wilfong Debra L. (Lake Elmo MN) Drath David J. (St. Paul MN) Palazzotto Michael C. (St. Paul MN) Willett Peggy S. (Stillwater MN) Clark ; III Henry B. (Roseville MN), Vibration damping constructions using acrylate-containing damping materials.
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Konsevich Francis X. (Federal Way WA), Vibration damping stiffener.
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Nakamura Masanori (Shiga JPX) Hirakouchi Hiroshi (Shiga JPX) Yatsuka Takeshi (Shiga JPX) Kadowaki Nobuo (Chiba JPX) Endoh Hiroshi (Chiba JPX), Viscoelastic resin composition for vibration-damping material.
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이 특허를 인용한 특허 (34) 인용/피인용 타임라인 분석

Huston,Dryver R.; Esser,Brian; Plumpton,James O., Active vibration damping system.
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Brodsky, William L.; Questad, David L., Apparatus and method for mechanical coupling of land grid array applications.
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Anderson, Donald A.; Cao, Tuan Quang; Leggett, Michael L.; Kyriakides, Anne E., Automated placement of vibration damping materials.
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Anderson, Donald A.; Parsons, Anne E.; Cao, Tuan Q.; Leggett, Michael L., Automated placement of vibration damping materials.
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Lin, Wen-Yi; Lin, Po-Yao, Board-level package with tuned mass damping structure.
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Tracy, Mark S.; Moore, Earl W., Card connector dampening assembly.
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Chengalva,Suresh K.; Ihms,David W.; Myers,Bruce A., Circuit board with localized stiffener for enhanced circuit component reliability.
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Montgomery, Joshua M.; Liguore, Salvatore L.; Cao, Tuan Q., Composite laminate having a damping interlayer and method of making the same.
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Melack, John; Muniz, Thomas Paul; Brey, Colin Charles, Damping and isolating vibration during ultrasonic welding.
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Dauvergne, Jean; Barat, Didier; Nash, Andrew, Device for controlling an actuator in particular for a vehicle.
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Callahan, Daniel L.; Iannuzzelli, Raymond J., Dynamic isolating mount for processor packages.
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Choi, Soo Yong; Joo, Jae Man; Lee, Seok Yeong; Kang, Jung Hun; Oh, Sang Kyoung, Heat sink for electronic devices, and circuit board and plasma display panel assembly each equipped with the heat sink.
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Messenger Thomas R. ; Whiting Ian Mark, Heat spreader.
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Tom E. Pearson ; Arjang Fartash ; Christopher Combs ; Raiyomand F. Aspandiar, Heatsink mounting with shock absorbers.
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Rassaian, Mostafa; Twigg, David W.; Lee, Jung Chuan, Method and apparatus for integrated hierarchical electronics analysis.
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Augustin,Thomas J.; Malone,Christopher G., Method of a supporting a CGA integrated package on a circuit board with improved shock and vibration isolation.
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Grieu, Marc; Massiot, Gregor, Method of evaluating the ageing of an electronic assembly.
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Boss, Daniel, Method of making a damper component.
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Barsun,Stephan K.; Bolich,Bryan D.; Sandoval,Alisa C.; Meyer,Gregory S.; Miner,Richard A., Offset compensation system.
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Brodsky, William L., Printed wiring board thickness control for compression connectors used in electronic packaging.
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Hart, Martin B., Quick response particle damper for printed circuit boards and planar surfaces.
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Varon-Weinryb, Abraham, Reliability simulation method and system.
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Varon-Weinryb, Abraham, Reliability simulation method for a PCB assembly.
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Neumann, Matthew D.; Bolich, Bryan, Sequencer.
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Boss,Daniel, Sheet molding compound damper component, and methods for making and using the same.
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Boss,Daniel, Sheet molding compound damper component, and methods for making and using the same.
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Echigo Masashi,JPX ; Nomoto Kaoru,JPX ; Aoyama Masayuki,JPX ; Suzuki Tadao,JPX, Shock-resistive printed circuit board and electronic device including the same.
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Ireland, John A., Stiffener for stiffening a circuit board.
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Ochoa, Carlos M., Stiffeners for utility trailer structural panels.
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Liguore, Salvatore L.; Montgomery, Joshua M., Systems and methods for reducing noise in aircraft fuselages and other structures.
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Liguore, Salvatore L.; Montgomery, Joshua M., Systems and methods for reducing noise in aircraft fuselages and other structures.
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Liguore, Salvatore L.; Montgomery, Joshua M., Systems and methods for reducing noise in aircraft fuselages and other structures.
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Brown, Paul James; Chan, Alex L., Warp reactive IC package.
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Barsun,Stephan K.; Cromwell,S. Daniel; Bolich,Bryan D., Wedge lock.
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IPC	Description
A	생활필수품
A62	인명구조; 소방(사다리 E06C)
A62B	인명구조용의 기구, 장치 또는 방법(특히 의료용에 사용되는 밸브 A61M 39/00; 특히 물에서 쓰이는 인명구조 장치 또는 방법 B63C 9/00; 잠수장비 B63C 11/00; 특히 항공기에 쓰는 것, 예. 낙하산, 투출좌석 B64D; 특히 광산에서 쓰이는 구조장치 E21F 11/00)
A62B-1/08	.. 윈치 또는 풀리에 제동기구가 있는 것

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[미국특허] Vibration damped and stiffened circuit articles 원문보기