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Method of modifying an exposed surface of a semiconductor wafer 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • H01L-021/302
출원번호 US-0694014 (1996-08-08)
발명자 / 주소
  • Bruxvoort Wesley J.
  • Culler Scott R.
  • Ho Kwok-Lun
  • Kaisaki David A.
  • Kessel Carl R.
  • Klun Thomas P.
  • Kranz Heather K.
  • Messner Robert P.
  • Webb Richard J.
  • Williams Julia P.
출원인 / 주소
  • Minnesota Mining and Manufacturing Company
대리인 / 주소
    Pastirik
인용정보 피인용 횟수 : 306  인용 특허 : 95

초록

A method of modifying an exposed surface of a semiconductor wafer that includes the steps of:

대표청구항 ▼

[ What is claimed is:] [1.] A method of modifying a processed semiconductor wafer containing topographical features comprising the steps of:(a) contacting an exposed surface of the processed semiconductor wafer with a three-dimensional, textured, fixed abrasive article comprising a plurality of abra

이 특허에 인용된 특허 (95)

  1. Bilkadi Zayn (Mahtomedi MN), Abrasion resistant coatings comprising silicon dioxide dispersions.
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    상세보기
  4. Bruxvoort Wesley J. (Woodbury MN) Calhoun Clyde D. (Stillwater MN) Webb Richard J. (Inver Grove Heights MN), Abrasive article having abrasive composite members positioned in recesses.
    상세보기
  5. Calhoun Clyde D. (Stilwater MN), Abrasive article having precise lateral spacing between abrasive composite members.
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  6. Buchanan Scott J. (Minneapolis) Morrison Eric D. (West St. Paul) Boston David R. (Woodbury) Hedrick Steven T. (Cottage Grove) Kausch William L. (Cottage Grove) Larson Wayne K. (Maplewood MN), Abrasive article having vanadium oxide incorporated therein.
    상세보기
  7. Harmer Walter L. (Arden Hills MN) Christensen Leif (St. Paul MN) Drtina Gary J. (Woodbury MN) Helmin Harvey J. (Golden Valley MN), Abrasive article with conductive, doped, conjugated, polymer coat and method of making same.
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  8. Haas John D. (Woodbury MN) Christianson Todd J. (Oakdale MN) Bruxvoort Wesley J. (Woodbury MN), Abrasive article, a process for its manufacture, and a method of using it to reduce a workpiece surface.
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  9. Hibbard Louis D. (Eagan MN) Collins Stanley B. (White Bear Lake MN) Haas John D. (Woodbury MN), Abrasive article, a process of making same, and a method of using same to finish a workpiece surface.
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  12. Holmes Gary L. (Vadnais Heights MN) Culler Scott R. (Burnsville MN) Hardy David H. (New Richmond WI) Hendrickson William A. (St. Joseph WI) Klun Thomas P. (Lakeland MN) Harmon Kimberly K. (Hudson WI), Abrasive articles comprising precisely shaped particles.
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  21. Buchanan Scott J. (St. Paul MN) Chang Kwo-Dong A. (St. Paul MN), Abrasive printed with an electrically conductive ink.
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  22. Kirk Alan R. (St. Paul MN) Larson Eric G. (St. Paul MN), Abrasive product having a binder comprising an aminoplast binder.
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  32. Beyer Klaus D. (Poughkeepsie NY) Guthrie William L. (Poughkeepsie NY) Makarewicz Stanley R. (New Windsor NY) Mendel Eric (Poughkeepsie NY) Patrick William J. (Newburgh NY) Perry Kathleen A. (Lagrange, Chem-mech polishing method for producing coplanar metal/insulator films on a substrate.
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  33. Harmer Walter L. (Arden Hills MN) DeVoe Robert J. (Oakdale MN) Larson Eric G. (Lake Elmo MN) Kincaid Don H. (Hudson WI) Willett Peggy S. (Stillwater MN) Williams Jerry W. (Cottage Grove MN), Coated abrasive article and method of making same.
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  34. Oxman Joel D. (Minneapolis MN) Ubel ; III F. Andrew (St. Paul MN) Larson Eric G. (White Bear Lake MN), Coated abrasive binder containing ternary photoinitiator system.
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  64. Markhoff-Matheny Carole J. (Leicester MA) Hay John (Shrewsbury MA) Rostoker David (Sturbridge MA), Nitrified bonded sol gel sintered aluminous abrasive bodies.
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  66. Budinger William D. (Kennett Square PA) Jensen Elmer W. (Wilmington DE), Pad material for grinding, lapping and polishing.
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  68. Graves Gordon C. (2764 Nipoma St. San Diego CA 92106), Penetration and fixture freeing agent.
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  69. Bilkadi Zayn (Mahtomedi MN), Photocurable abrasion resistant coatings comprising silicon dioxide dispersions.
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  72. Baldy Andr (Seyssins FRX) Barrois Grard (Le Fontanil FRX) Blanc Henri (Saint Julien de Ratz FRX) Dominiak Marcel (Grenoble FRX), Polishing machine having a taut microabrasive strip and an improved wafer support head.
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  73. Takizawa Gisaburo (Aichi JPX) Senda Tetsushi (Aichi JPX) Miura Shiro (Aichi JPX), Polishing method of goods and abrasive pad therefor.
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  74. Tuttle Mark E. (Boise ID), Polishing pad.
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  76. Yu Tat-Kwan (Austin TX) Yu Chris C. (Austin TX), Polishing pad for chemical-mechanical polishing of a semiconductor substrate.
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  77. Thomas Michael E. (Milpitas CA), Polishing pad for planarization.
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  79. Wilson Stuart M. (Tangmere ; 192 Hurricane Way Woodley ; Berkshire GB2) Sexton John S. (Bobcat ; West Street Odiham ; Hampshire GB2) Wright Derek N. (5 Eagle Close Heathlake ; Crowthorne ; Bershire G, Polishing tool component.
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  80. Bonk Thomas J. (Stillwater MN) Simpson J. Thomas (Lake Elmo MN), Polyolefin substrate coated with acrylic-type normally tacky and pressure-sensitive adhesive and a method of making same.
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  81. Wood Leigh E. (Woodbury MN) Noreen Allen L. (Lake Elmo MN), Pressure-sensitive adhesive tape fastener for releasably attaching an object to a fabric.
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이 특허를 인용한 특허 (306)

  1. Kazuo Sunahara JP; Sumihisa Yamaguchi JP, Abrasive.
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  2. Fletcher,Timothy D.; Lugg,Paul S.; Romero,Vincent D., Abrasive agglomerate polishing method.
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  3. Woo, Edward J.; Munoz, Juan A.; Fedorova, Nataliya V.; Orlando, Mark W.; Studiner, IV, Charles J.; Manor, Nicholas B., Abrasive article.
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  4. Lugg, Paul S.; Fletcher, Timothy D., Abrasive article and method of modifying the surface of a workpiece.
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  5. David, Moses M.; Culler, Scott R.; Boden, John T., Abrasive article having a plurality of precisely-shaped abrasive composites.
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  6. Goers, Brian D.; Peterson, Scott W.; Woo, Edward J., Abrasive article suitable for abrading glass and glass ceramic workpieces.
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  7. Bruxvoort, Wesley J., Abrasive article suitable for modifying a semiconductor wafer.
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  8. Adefris, Negus B.; Erickson, Carl P.; Niccum, Brent D.; Sager, Thomas A.; Schroeder, Craig F.; Testen, Theodore J., Abrasive article with agglomerates and method of use.
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  9. Schwappach, Karl G.; Boutaghou, Zine-Eddine, Abrasive article with array of composite polishing pads.
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  10. Schwappach, Karl G.; Boutaghou, Zine-Eddine, Abrasive article with array of composite polishing pads.
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  11. Messner Robert P. ; Kessel Carl R. ; Moore George G., Abrasive articles comprising a fluorochemical agent for wafer surface modification.
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  12. Kollodge,Jeffrey S., Abrasive articles with nanoparticulate fillers and method for making and using them.
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  13. Annen, Michael John; Felipe, Sr., Peter Atanacio, Abrasive articles, rotationally reciprocating tools, and methods.
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  14. Jacquinot,Eric; Letourneau,Pascal; Rivoire,Maurice, Abrasive composition for the integrated circuit electronics industry.
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  18. Uchida, Takeshi; Matsuzawa, Jun; Hoshino, Tetsuya; Kamigata, Yasuo; Terazaki, Hiroki; Honma, Yoshio; Kondoh, Seiichi, Abrasive liquid for metal and method for polishing.
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  19. Uchida, Takeshi; Matsuzawa, Jun; Hoshino, Tetsuya; Kamigata, Yasuo; Terazaki, Hiroki; Honma, Yoshio; Kondoh, Seiichi, Abrasive liquid for metal and method for polishing.
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  20. Amano, Takashi; Watase, Toshihiko; Imamura, Kengo, Abrasive pad for CMP.
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  22. Schwappach, Karl G.; Boutaghou, Zine-Eddine, Abrasive slurry and dressing bar for embedding abrasive particles into substrates.
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  24. Wang, Yuchun; Bajaj, Rajeev; Redeker, Fred C., Additives to CMP slurry to polish dielectric films.
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  25. Lower, Nathan P.; Boone, Alan P.; Wilcoxon, Ross K., Adhesive applications using alkali silicate glass for electronics.
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  26. Wood, William P.; McArdle, James L., Agglomerate abrasive grain and a method of making the same.
    상세보기
  27. Lower, Nathan P.; Boone, Alan P.; Wilcoxon, Ross K.; Hillman, David D., Alkali silicate glass based coating and method for applying.
    상세보기
  28. Lower, Nathan P.; Boone, Alan P.; Wilcoxon, Ross K.; Hillman, David D., Alkali silicate glass based coating and method for applying.
    상세보기
  29. Sampica, James D.; Barnidge, Tracy J.; Tchon, Joseph L.; Lower, Nathan P.; Wilcoxon, Ross K.; Dudley, Sandra S., Alkali silicate glass for displays.
    상세보기
  30. Chelle,Philippe H., Alumina abrasive for chemical mechanical polishing.
    상세보기
  31. Cherian, Isaac K.; Carter, Phillip; Chamberlain, Jeffrey P.; Moeggenborg, Kevin; Boldridge, David W., Anionic abrasive particles treated with positively charged polyelectrolytes for CMP.
    상세보기
  32. Cherian,Isaac K; Carter,Phillip; Chamberlain,Jeffrey P.; Moeggenborg,Kevin; Boldridge,David W., Anionic abrasive particles treated with positively charged polyelectrolytes for CMP.
    상세보기
  33. Lower, Nathan P.; Nemeth, Paul R.; Wilcoxon, Ross K., Antiglare treatment for glass.
    상세보기
  34. Mike Ravkin ; Katrina Mikhaylich ; Don E. Anderson, Apparatus and method for conditioning a fixed abrasive polishing pad in a chemical mechanical planarization process.
    상세보기
  35. Walters, Joseph W.; Kneer, Emil; Cooper, Eric; Grizzard, Richard, Apparatus and method for conditioning polishing pad in a chemical mechanical planarization process.
    상세보기
  36. Khoury, Raymond M.; Ocasio, Jose M.; Ziemins, Uldis A., Apparatus and method for front side chemical mechanical planarization (CMP) of semiconductor workpieces.
    상세보기
  37. Boyd, John M.; Mikhaylich, Katrina; Ravkin, Mike, Apparatus and method for qualifying a chemical mechanical planarization process.
    상세보기
  38. John M. Boyd ; Katrina Mikhaylich ; Mike Ravkin, Apparatus and method for qualifying a chemical mechanical planarization process.
    상세보기
  39. Blalock,Guy T., Apparatus and method for removing material from microfeature workpieces.
    상세보기
  40. Michael A. Walker, Apparatus for releasably attaching polishing pads to planarizing machines in mechanical and/or chemical-mechanical planarization of microelectronic-device substrate assemblies.
    상세보기
  41. Schwappach, Karl G.; Boutaghou, Zine-Eddine, Array of abrasive members with resilient support.
    상세보기
  42. Tietz,James V.; Li,Shijian; Birang,Manoocher; White,John M.; Rosenberg, legal representative,Sandra L.; Scales,Marty; Emami,Ramin; Rosenberg, deceased,Lawrence M., Article for polishing semiconductor substrates.
    상세보기
  43. Kollodge, Jeffrey S.; Messner, Robert P., Article suitable for chemical mechanical planarization processes.
    상세보기
  44. Craig, Gordon S. W.; Hadley, Mark A.; Swindlehurst, Susan; Tootoonchi, Ali A.; Kanemoto, Eric; Snyder, Eric Jonathan; Herrmann, Scott; Gengel, Glenn; Liong, Lily, Assembly comprising functional block deposited therein.
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  45. Braunschweig, Ehrich J.; Syverson, Daidre L.; Woo, Edward J.; Annen, Michael J., Backing and abrasive product made with the backing and method of making and using the backing and abrasive product.
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  46. Sankaranarayanan, Ramaswamy, Backingless abrasive article.
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  47. Engler, Martin; Uibel, Krishna; Eichler, Jens, Boron nitride agglomerates, method of production and use thereof.
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  48. Engler, Martin; Uibel, Krishna; Eichler, Jens, Boron nitride agglomerates, method of production thereof and use thereof.
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  49. de Rege Thesauro, Francesco; Bayer, Benjamin P., CMP composition with a polymer additive for polishing noble metals.
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  50. Sun, Tao, CMP compositions containing iodine and an iodine vapor-trapping agent.
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  51. Sun, Tao, CMP compositions containing silver salts.
    상세보기
  52. Moeggenborg, Kevin J.; Chou, Homer; Hawkins, Joseph D.; Chamberlain, Jeffrey P., CMP compositions for low-k dielectric materials.
    상세보기
  53. Reiss, Brian; Whitener, Glenn, CMP compositions selective for oxide and nitride with high removal rate and low defectivity.
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  54. Reiss, Brian; Willhoff, Michael; Mateja, Daniel, CMP compositions selective for oxide and nitride with high removal rate and low defectivity.
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  55. Brusic, Vlasta; De Rege, Francesco M.; Moeggenborg, Kevin J.; Cherian, Isaac K.; Zhou, Renjie, CMP method for noble metals.
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  56. DeRege Thesauro,Francesco; Brusic,Vlasta; Bayer,Benjamin P., CMP method for noble metals.
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  57. Schroeder, David J.; Moeggenborg, Kevin J.; Chou, Homer; Chamberlain, Jeffrey P.; Hawkins, Joseph D.; Carter, Phillip, CMP method utilizing amphiphilic nonionic surfactants.
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  58. Dornfeld,David; Lee,Sunghoon, CMP pad with designed surface features.
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  59. Suzuki Keisuke,JPX, CMP polish pad and CMP processing apparatus using the same.
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  60. Costas, Wesley D.; Lack, Craig D.; Saucy, Daniel A., CMP polishing composition for semiconductor devices containing organic polymer particles.
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  61. Brian L. Mueller ; Shumin Wang, CMP polishing pad including a solid catalyst.
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  62. Wang Shumin ; Mueller Brian L., CMP slurry containing a solid catalyst.
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  63. Paik, Un Gyu; Park, Jea Gun; Kim, Sang Kyun; Kim, Ye Hwan; Suh, Myoung Won; Kim, Dae Hyeong, CMP slurry, preparation method thereof and method of polishing substrate using the same.
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  64. Chopra, Dinesh, COPPER CHEMICAL-MECHANICAL POLISHING PROCESS USING A FIXED ABRASIVE POLISHING PAD AND A COPPER LAYER CHEMICAL-MECHANICAL POLISHING SOLUTION SPECIFICALLY ADAPTED FOR CHEMICAL-MECHANICAL POLISHING WITH.
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  65. Slutz,David E.; Finke,Steven J., CVD diamond-coated composite substrate containing a carbide-forming material and ceramic phases and method for making same.
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  66. Grumbine, Steven K., Catalyst/oxidizer-based CMP system for organic polymer films.
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  67. Small,Robert J.; Scott,Brandon S., Catalytic composition for chemical-mechanical polishing, method of using same, and substrate treated with same.
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  68. McArdle, James L.; Culler, Scott R.; Wood, William P., Ceramic aggregate particles.
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  69. Gagliardi, John J.; Savu, Patricia M., Chemical mechanical planarization composition, system, and method of use.
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  70. Lee, Jae-dong; Yoon, Bo-un; Han, Yong-pil, Chemical mechanical polishing slurry and chemical mechanical polishing method using the same.
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  71. Farrar,Paul A., Chemical mechanical polishing system and process.
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  72. Hampden Smith,Mark J.; Kodas,Toivo T.; Caruso,James; Skamser,Daniel J.; Powell,Quint H., Chemical-mechanical planarization slurries and powders and methods for using same.
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  73. Hampden-Smith, Mark J.; Kodas, Toivo T.; Caruso, James; Skamser, Daniel J.; Powell, Quint H., Chemical-mechanical planarization slurries and powders and methods for using same.
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  74. Hampden-Smith, Mark J.; Kodas, Toivo T.; Caruso, James; Skamser, Daniel J.; Powell, Quint H., Chemical-mechanical planarization slurries and powders and methods for using same.
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  75. Fang,Mingming; Ianiro,Michael R.; Eisenhour,Don, Chemical-mechanical polishing (CMP) slurry and method of planarizing computer memory disk surfaces.
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  76. Fang,Mingming; Ianiro,Michael R.; Eisenhour,Don D., Chemical-mechanical polishing (CMP) slurry and method of planarizing surfaces.
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  77. Fang,Mingming; Ianiro,Michael R.; Eisenhour,Don, Chemical-mechanical polishing (CMP) slurry containing clay and CeOabrasive particles and method of planarizing surfaces.
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  78. De Rege Thesauro,Francesco; Brusic,Vlasta; Bayer,Benjamin P., Chemical-mechanical polishing of metals in an oxidized form.
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  79. Lee, Jong-won; Lee, Jae-dong; Yoon, Bo-an; Hah, Sang-rok, Chemical/mechanical polishing slurry, and chemical mechanical polishing process and shallow trench isolation process employing the same.
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  80. Lee, Jong-won; Lee, Jae-dong; Yoon, Bo-un; Hah, Sang-rok, Chemical/mechanical polishing slurry, and chemical mechanical polishing process and shallow trench isolation process employing the same.
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  81. Avanzino Steven C. ; Erb Darrell M. ; Schonauer Diana M. ; Yang Kai, Chemically removable Cu CMP slurry abrasive.
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  82. Adefris, Negus B.; Joseph, William D.; Wagle-Peterson, Kathleen A., Composite abrasive particles and method of manufacture.
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  83. De Rege Thesauro, Francesco; Grumbine, Steven; Carter, Phillip; Li, Shoutian; Zhang, Jian; Schroeder, David; Tsai, Ming-Shih, Compositions and methods for CMP of semiconductor materials.
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  84. Hardy, L. Charles; Kranz, Heather K.; Wood, Thomas E.; Kaisaki, David A.; Gagliardi, John J.; Clark, John C.; Savu, Patricia M.; Clark, Philip G., Compositions and methods for modifying a surface suited for semiconductor fabrication.
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  85. Chelle, Philippe H.; Small, Robert J., Compositions and methods for rapidly removing overfilled substrates.
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  86. Chelle,Philippe H.; Small,Robert J., Compositions and methods for rapidly removing overfilled substrates.
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  87. Carter,Phillip W.; Zhang,Jian; Grumbine,Steven K.; De Rege Thesauro,Francesco, Compositions and methods for tantalum CMP.
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  88. De Rege Thesauro, Francesco; Grumbine, Steven; Carter, Phillip; Li, Shoutian; Zhang, Jian; Schroeder, David; Tsai, Ming-Shih, Compositions for CMP of semiconductor materials.
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  89. Costas, Wesley D.; Shen, James; Mandigo, Glenn C.; Thomas, Terence M.; Lack, Craig D.; Barker, II, Ross E., Compositions for insulator and metal CMP and methods relating thereto.
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  90. Vaartstra,Brian A., Compositions for planarization of metal-containing surfaces using halogens and halide salts.
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  91. Uchiyama Shinzo,JPX, Conditioning apparatus and conditioning method.
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  92. Felipe, Sr., Peter A.; Schutz, James W.; Koehnle, Gregory A.; Annen, Michael J.; Everaerts, Albert I., Conformable abrasive articles and methods of making and using the same.
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  93. Steckenrider,J. Scott; Snider,Gary W., Continuous contour polishing of a multi-material surface.
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  94. Molnar, Charles J., Controlled lubricated finishing.
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  95. Chopra Dinesh, Copper chemical-mechanical polishing process using a fixed abrasive polishing pad and a copper layer chemical-mechanical polishing solution specifically adapted for chemical-mechanical polishing with.
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  96. Sun,Lizhong; Li,Shijian; Redeker,Fred C., Cu CMP polishing pad cleaning.
    상세보기
  97. Bui,Hoa T.; Kolb,Brant U.; Mitra,Sumita B., Dental fillers, pastes, and compositions prepared therefrom.
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  98. Krishnashree Achuthan ; Steven C. Avanzino ; Kashmir S. Sahota, Dielectric protected chemical-mechanical polishing in integrated circuit interconnects.
    상세보기
  99. Wakabayashi, Satoshi; Yamaguchi, Kuniaki; Togawa, Tetsuji; Takada, Nobuyuki; Nabeya, Osamu, Dressing apparatus and polishing apparatus.
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  100. Kendall, Philip E.; Park, Soon C.; Bruxvoort, Wesley J.; Culler, Scott R.; Williams, Jerry W., Dual cured abrasive articles.
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  101. Wang,You; Tsai,Stan D.; Karuppiah,Lakshmanan; Diao,Jie; Jia,Renhe; Yilmaz,Alpay, Electrochemical method for Ecmp polishing pad conditioning.
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  102. Sun, Lizhong; Li, Shijian, Electrochemically assisted chemical polish.
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  103. Lower, Nathan P.; Wilcoxon, Ross K.; Wooldridge, James R.; Dlouhy, David W., Fabrication process for a flexible, thin thermal spreader.
    상세보기
  104. Molnar, Charles J., Finishing components and elements.
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  105. Molnar, Charles J, Finishing element using finishing aids.
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  106. Charles J Molnar, Finishing element with finishing aids.
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  107. Molnar, Charles J, Finishing method for semiconductor wafers using a lubricating boundary layer.
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  108. Charles J Molnar, Finishing semiconductor wafers with a fixed abrasive finishing element.
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  109. Charles J. Molnar, Finishing with partial organic boundary layer.
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  110. Goetz, Douglas P., Fixed abrasive article for use in modifying a semiconductor wafer.
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  111. Goetz,Douglas P., Fixed abrasive article for use in modifying a semiconductor wafer.
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  112. Molnar Charles J, Fixed abrasive finishing element having aids finishing method.
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  113. Molnar Charles J, Fixed abrasive finishing method using lubricants.
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  114. Schutz, James W.; Royce, Stacee L.; Annen, Michael J., Flexible abrasive product and method of making and using the same.
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  115. Schutz, James W.; Royce, Stacee L.; Annen, Michael J.; Pieper, Jon R.; Sheely, Jeffrey D., Flexible abrasive product and method of making and using the same.
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  116. Hunt,William J.; Kendall,Philip E.; Dahlke,Gregg D., Formulations for coated diamond abrasive slurries.
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  117. Scott,Brandon Shane; Small,Robert J., Free radical-forming activator attached to solid and used to enhance CMP formulations.
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  118. Siddiqui, Junaid Ahmed; Small, Robert J.; Castillo, Daniel Hernandez, Free radical-forming activator attached to solid and used to enhance CMP formulations.
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  119. Lower, Nathan P.; Wilcoxon, Ross K.; Boone, Alan P.; Wyckoff, Nathaniel P.; Hamilton, Brandon C., Glass thick film embedded passive material.
    상세보기
  120. Lower, Nathan P.; Wilcoxon, Ross K.; Boone, Alan P.; Wyckoff, Nathaniel P.; Hamilton, Brandon C., Glass thick film embedded passive material.
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  121. Brusic,Vlasta; Zhou,Renjie; Thompson,Christopher, Gold CMP composition and method.
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  122. Osterheld, Thomas H., Grid relief in CMP polishing pad to accurately measure pad wear, pad profile and pad wear profile.
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  123. Rouse Michael W. ; Deeb Victor M., Grinding stones.
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  124. Chou, Jui-Lin; Chiu, Chia-Feng; Liao, Wen-Jen; Su, Xue-Shen, Grinding tool and method of manufacturing the same.
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  125. Kotha, Sanjay; Sudarshan, Tirumalai S., Hemostatic composition.
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  126. Kamboj, Sumant, Homogeneous fixed abrasive polishing pad.
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  127. Gagliardi,John J.; Rueb,Chris J., In situ activation of a three-dimensional fixed abrasive article.
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  128. Molnar, Charles J., In situ control with lubricant and tracking.
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  129. Molnar,Charles J, In situ finishing control.
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  130. Molnar, Charles J, In situ friction detector method and apparatus.
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  131. Lower, Nathan P.; Wilcoxon, Ross K.; Boone, Alan P., Integrated circuit protection and ruggedization coatings and methods.
    상세보기
  132. Lower, Nathan P.; Wilcoxon, Ross K.; Boone, Alan P., Integrated circuit protection and ruggedization coatings and methods.
    상세보기
  133. Lower, Nathan P.; Boone, Alan P.; Wilcoxon, Ross K., Integrated circuit tampering protection and reverse engineering prevention coatings and methods.
    상세보기
  134. Wrschka, Peter; Robl, Werner; Goebel, Thomas, Integration scheme for metal gap fill, with fixed abrasive CMP.
    상세보기
  135. Gagliardi, John J.; Romero, Vincent D.; Coad, Eric C., Interrupted structured abrasive article and methods of polishing a workpiece.
    상세보기
  136. Wang, Yuchun; Tsai, Stan D.; Wijekoon, Kapila; Bajaj, Rajeev; Redeker, Fred C., Ion exchange materials for chemical mechanical polishing.
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  137. Dunham, Ronald; Goubau, Wolfgang; Patel, Bhargav; Wong, Marvin; Yang, John Jaekoyun, Lapping of gold pads in a liquid medium for work hardening the surface of the pads.
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  138. Kazuya Orii JP; Isao Saito JP; Yasutoshi Fujita JP; Toshimichi Sakurada JP; Masao Yamaguchi JP, Lapping oil composition for finish-grinding.
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  139. Krusell, Wilbur; Travis, Glenn; Engdahl, Erik; Bagley, James, Linear reciprocating disposable belt polishing method and apparatus.
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  140. Wilbur Krusell ; Glenn Travis ; Erik Engdahl ; James Bagley, Linear reciprocating disposable belt polishing method and apparatus.
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  141. Ko,Sen Hou; Song,Kevin H., Low cost and low dishing slurry for polysilicon CMP.
    상세보기
  142. Kotha,Sanjay; Sudarshan,Tirumalai S., Magnetic fluid cushioning device for a footwear or shoe.
    상세보기
  143. Kotha,Sanjay; Sudarshan,Tirumalai S.; Radhakrishnan,Ramachandran, Magnetic fluid power generator device and method for generating power.
    상세보기
  144. Tolles, Robert D., Material for use in carrier and polishing pads.
    상세보기
  145. Wilcoxon, Ross K.; Lower, Nathan P.; Wooldridge, James R.; Dlouhy, David W.; Strzelczyk, Anthony J., Mechanically compliant thermal spreader with an embedded cooling loop for containing and circulating electrically-conductive liquid.
    상세보기
  146. Vacassy, Robert, Methanol-containing silica-based CMP compositions.
    상세보기
  147. Radhakrishnan,Ramachandran; Kotha,Sanjay; Sudarshan,Tirumalai S., Method and airbag inflation apparatus employing magnetic fluid.
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  148. Ben Mooring ; Wilbur Krusell ; Glenn Travis ; Erik Engdahl, Method and apparatus for chemical mechanical planarization and polishing of semiconductor wafers using a continuous polishing member feed.
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  149. Travis Glenn ; Pena Christopher, Method and apparatus for chemically-mechanically polishing semiconductor wafers.
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  150. Boyd, John M., Method and apparatus for conditioning a polishing pad.
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  151. Lacy, Michael S., Method and apparatus for conditioning a polishing pad with sonic energy.
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  152. Radman, Allan M.; Jensen, Alan J.; Treichel, Helmuth; Boehm, Robert G.; Lacy, Michael S.; Dunton, Eric A., Method and apparatus for conditioning a polishing pad with sonic energy.
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  153. Renteln, Peter; Jensen, Alan J.; Lamb, David S., Method and apparatus for conditioning fixed-abrasive polishing pads.
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  154. Jensen, Alan J.; Stella, Mario; Zhao, Eugene; Renteln, Peter; Farber, Jeffrey, Method and apparatus for controlling CMP pad surface finish.
    상세보기
  155. Jensen, Alan J.; Stella, Mario; Zhao, Eugene; Renteln, Peter; Farber, Jeffrey, Method and apparatus for controlling CMP pad surface finish.
    상세보기
  156. Boyd, John M.; Lacy, Michael S., Method and apparatus for fixed abrasive substrate preparation and use in a cluster CMP tool.
    상세보기
  157. Boyd, John M.; Lacy, Michael S., Method and apparatus for fixed abrasive substrate preparation and use in a cluster CMP tool.
    상세보기
  158. John M. Boyd ; Michael S. Lacy, Method and apparatus for fixed abrasive substrate preparation and use in a cluster CMP tool.
    상세보기
  159. Boyd, John M., Method and apparatus for fixed-abrasive substrate manufacturing and wafer polishing in a single process path.
    상세보기
  160. Moon,Yongsik; Wijekoon,Kapila, Method and apparatus for polishing substrates.
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  161. Schwappach, Karl; Boutaghou, Zine-Eddine, Method and apparatus for polishing with abrasive charged polymer substrates.
    상세보기
  162. Schwappach, Karl; Boutaghou, Zine-Eddine, Method and apparatus for processing sliders for disk drives, and to various processing media for the same.
    상세보기
  163. Wang,Yan; Tsai,Stan D.; Hu,Yongqi; Liu,Feng Q.; Chen,Liang Yuh; Mao,Daxin; Tran,Huyen Karen; Wohlert,Martin S.; Jia,Renhe; Tian,Yuan A., Method and apparatus for reduced wear polishing pad conditioning.
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  164. Michael A. Walker, Method and apparatus for releasably attaching polishing pads to planarizing machines in mechanical and/or chemical-mechanical planarization of microelectronic-device substrate assemblies.
    상세보기
  165. Walker Michael A., Method and apparatus for releasably attaching polishing pads to planarizing machines in mechanical and/or chemical-mechanical planarization of microelectronic-device substrate assemblies.
    상세보기
  166. Pietsch, Georg; Kerstan, Michael, Method and apparatus for trimming the working layers of a double-side grinding apparatus.
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  167. Sabde, Gundu M.; Lee, Whonchee, Method and apparatuses for planarizing microelectronic substrate assemblies.
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  168. Sun,Lizhong; Tsai,Stan; Li,Shijian, Method and composition for the removal of residual materials during substrate planarization.
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  169. Tsai, Stan; Sun, Lizhong; Li, Shijian, Method and composition for the selective removal of residual materials and barrier materials during substrate planarization.
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  170. Kotha,Sanjay; Sudarshan,Tirumalai S., Method and kit for inducing hypoxia in tumors through the use of a magnetic fluid.
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  171. Fang,Mingming; Ianiro,Michael R.; Eisenhour,Don, Method chemical-mechanical polishing and planarizing corundum, GaAs, GaP and GaAs/GaP alloy surfaces.
    상세보기
  172. Lizhong Sun ; Shijian Li ; Fritz Redeker, Method for abrasive-free metal CMP in passivation domain.
    상세보기
  173. Lo Yung-Tsun,TWX ; Li Kam-Tung,TWX ; Huang Kuan-Chieh,TWX, Method for actually measuring misalignment of via.
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  174. Schroeder, David J.; Carter, Phillip; Chamberlain, Jeffrey P.; Miller, Kyle; Cherian, Isaac K., Method for copper CMP using polymeric complexing agents.
    상세보기
  175. Coppeta,Jonathan R., Method for fabricating micro optical elements using CMP.
    상세보기
  176. Visser, Robert G., Method for grinding glass.
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  177. Kessel, Carl R.; Boardman, Larry D.; Webb, Richard J., Method for manufacturing thin substrate using a laminate body.
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  178. Lin Chi-Fa,TWX ; Tseng Wen-Tsu,TWX ; Feng Min-Shinn,TWX, Method for mapping and adjusting pressure distribution of CMP processes.
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  179. Roettger, Klaus; Heilmaier, Alexander; Mistur, Leszek; Tabata, Makoto; Dutschke, Vladimir; Olbrich, Torsten, Method for polishing a semiconductor wafer.
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  180. Schwandner, Juergen; Koppert, Roland, Method for polishing a semiconductor wafer with a strained-relaxed Si1−xGex layer.
    상세보기
  181. Pietsch, Georg, Method for providing a respective flat working layer on each of the two working disks of a double-side processing apparatus.
    상세보기
  182. Boone, Alan P.; Lower, Nathan P.; Wilcoxon, Ross K., Method for providing near-hermetically coated integrated circuit assemblies.
    상세보기
  183. Boone, Alan P.; Lower, Nathan P.; Wilcoxon, Ross K., Method for providing near-hermetically coated integrated circuit assemblies.
    상세보기
  184. Wilcoxon, Ross K.; Lower, Nathan P.; Boone, Alan P., Method for providing near-hermetically coated, thermally protected integrated circuit assemblies.
    상세보기
  185. Petroski, Angela; Cooper, Richard D.; Fathauer, Paul; Perry, David; Macey, James, Method for securing a polishing pad to a platen for use in chemical-mechanical polishing of wafers.
    상세보기
  186. Pietsch, Georg, Method for the simultaneous double-side material-removing processing of at least three workpieces.
    상세보기
  187. Kerstan, Michael; Pietsch, Georg; Runkel, Frank; Bechtolsheim, Conrad von; Moeller, Helge, Method for the simultaneous double-sided material removal processing of a plurality of semiconductor wafers.
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  188. Pietsch, Georg; Kerstan, Michael, Method for trimming the working layers of a double-side grinding apparatus.
    상세보기
  189. Pietsch, Georg; Kerstan, Michael, Method for trimming the working layers of a double-side grinding apparatus.
    상세보기
  190. Woo,Edward J.; Bange,Donna W.; Lamphere,Craig F., Method of abrading a workpiece.
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  191. Sventek, Bruce A.; Lamphere, Craig F.; Graf, Timothy L.; Barry, John L., Method of cleaning glass.
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