|국가/구분||United States(US) Patent 등록|
|미국특허분류(USC)||361/687 ; 361/694 ; 361/696|
|발명자 / 주소|
|출원인 / 주소|
|대리인 / 주소||
|인용정보||피인용 횟수 : 36 인용 특허 : 20|
An air flow heat exchanger for a computing device and a docking station. The heat exchanger includes a first heat exchange duct configured to thermally couple to an electronic component. The first heat exchange duct may be brought into and removed from a mated position with a forced air mechanism. When mated with the forced air mechanism, the forced air mechanism is positioned so as to increase airflow through the first heat exchange duct.
[ What is claimed is:] [1.] A heat exchange apparatus comprising:a first heat exchange duct;a heat transfer element having a first portion thermally engaging an electronic component and a second portion connected to the first heat exchange duct; anda forced air mechanism removably positioned to increase airflow through the first heat exchange duct when the heat exchange apparatus is in a mated position.