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[미국특허] Methods for the in-process detection of workpieces with a monochromatic light source 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • B24B-049/00
출원번호 US-0090666 (1998-06-04)
발명자 / 주소
  • Bartels Anthony L.
  • Allen Robert F.
  • Holzapfel Paul
  • Lin Warren
출원인 / 주소
  • SpeedFam-IPEC Corp.
대리인 / 주소
    Snell & Wilmer
인용정보 피인용 횟수 : 52  인용 특허 : 24

초록 ▼

A method for use with a chemical mechanical planarization (CMP) system includes an infrared LED emitter that generates an interrogation signal and directs the interrogation signal toward a polishing pad configured to process a workpiece during the CMP procedure. A reflected signal produced in respon

대표청구항 ▼

[ What is claimed is:] [1.] In a workpiece processing system having a processing element and a carrier element configured to hold a workpiece against said processing element, a method for detecting the presence of extraneous material on said processing element during operation of said workpiece proc

이 특허에 인용된 특허 (24) 인용/피인용 타임라인 분석

  1. Kakubo Yuji (Shizuoka JPX) Sotome Hiromi (Shizuoka JPX), Analog-to-digital converting unit with broad dynamic range.
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  2. Lund Douglas E. (13304 Purple Sage Dallas TX 75240), Automatic chemical and mechanical polishing system for semiconductor wafers.
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  3. Uomoto Yasutomo (Tokyo JPX), Electric field level detecting apparatus.
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  4. Arai Hatsuyuki (Zama JPX) Nagahashi Isao (Fujisawa JPX) Maeda Seiichi (Ayase JPX) Yasuda Kazumi (Zama JPX) Furusawa Shiro (Fujisawa JPX) Hirata Kazuhiko (Sagamihara JPX) Nagao Kastunori (Ayase JPX) K, Flat lapping machine.
    상세보기
  5. Arai Hatsuyuki (Zama JPX) Sugiyama Misuo (Hadano JPX), Flat lapping machine with sizing mechanism.
    상세보기
  6. Piwonka-Corle Timothy R. (Portland OR) Scoffone Karen F. (Redwood City CA) Chen Xing (San Jose CA) Lacomb ; Jr. Lloyd J. (Santa Clara CA) Stehle Jean-Louis (Colombes FRX) Zahorski Dorian (Vanves FRX), Focused beam spectroscopic ellipsometry method and system.
    상세보기
  7. Casey Harry B. (Covington VA), Measuring the surface of a roller by glossmeter.
    상세보기
  8. Sandhu Gurtej Singh (Boise ID), Method and apparatus for detecting the endpoint in chemical-mechanical polishing of semiconductor wafers.
    상세보기
  9. Schultz Laurence D. (Boise ID), Method and apparatus for mechanical planarization and endpoint detection of a semiconductor wafer.
    상세보기
  10. Pileri David (Fairport NY) Hannon John (Rochester NY) Gildner Donald A. (Rochester NY) Baumler Mark (Rochester NY), Method and apparatus for realtime monitoring and feedback control of the shape of a continuous planetary polishing surfa.
    상세보기
  11. Chen Xing (San Jose CA) Flanner ; III Philip D. (Union City CA) Malwankar Kiron B. (Sunnyvale CA) Chen Jennming (Campbell CA), Method and system for calibrating an ellipsometer.
    상세보기
  12. Aspnes David E. (Watchung NJ) Bagley Brian G. (Watchung NJ), Method for optical monitoring in materials fabrication.
    상세보기
  13. Winebarger Paul (Austin TX), Method for polishing a substrate.
    상세보기
  14. Canteloup Jean (Monthlery FRX) Mathias Jacky (Jargeau FRX), Method of and device for in situ real time quantification of the morphology and thickness of a localized area of a surfa.
    상세보기
  15. Pan Yang (Singaporee SGX), New chemical mechanical planarization (CMP) end point detection apparatus.
    상세보기
  16. Koos Daniel A. (Boise ID) Meikle Scott (Boise ID), Optical end point detection methods in semiconductor planarizing polishing processes.
    상세보기
  17. Litvak Herbert E. (Cupertino CA), Optical techniques of measuring endpoint during the processing of material layers in an optically hostile environment.
    상세보기
  18. Takahashi Tsutomu (Yokohama JPX) Tohyama Keiichi (Kawasaki JPX) Takahashi Tamami (Yamato JPX), Polishing apparatus having endpoint detection device.
    상세보기
  19. Roberts John V. H. (Newark DE), Polishing pads.
    상세보기
  20. Sandhu Gurtej S. (Boise ID) Doan Trung T. (Boise ID), System and method for real-time control of semiconductor a wafer polishing, and a polishing head.
    상세보기
  21. Neer Harold M. (Bartlesville OK), Voltage offset network.
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  22. Karlsrud Chris E. (Chandler AZ) Van Woerkom Anthony G. (Chandler AZ) Odagiri Shigeru (Yokohama JPX) Nagahashi Isao (Fujisawa AZ JPX) Preston Spencer (Chandler AZ), Wafer polishing method and apparatus.
    상세보기
  23. Karlsrud Chris E. (Chandler AZ) Van Woerkom Anthony G. (Chandler AZ) Odagiri Shigeru (Yokohama JPX) Nagahashi Isao (Fujisawa JPX), Wafer polishing method and apparatus.
    상세보기
  24. Karlsrud Chris E. (Chandler AZ) Van Woerkom Anthony G. (Chandler AZ) Odagiri Shigeru (Yokohama JPX) Nagahashi Isao (Fujisawa JPX), Wafer polishing method and apparatus.
    상세보기

이 특허를 인용한 특허 (52) 인용/피인용 타임라인 분석

  1. Paik,Young J., Adjusting manufacturing process control parameter using updated process threshold derived from uncontrollable error.
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  2. Damon Vincent Williams, Apparatus and methods for controlling pad conditioning head tilt for chemical mechanical polishing.
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  3. Satou Yuuichi,JPX, Apparatus for accurately measuring local thickness of insulating layer on semiconductor wafer during polishing and polishing system using the same.
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  4. Williams, Damon Vincent, Apparatus for controlling retaining ring and wafer head tilt for chemical mechanical polishing.
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  5. Schwarm,Alexander T., Automated design and execution of experiments with integrated model creation for semiconductor manufacturing tools.
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  6. Saldana, Miguel A.; Williams, Damon Vincent, Chemical mechanical polishing apparatus and methods with central control of polishing pressure applied by polishing head.
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  7. Richard J. Lebel ; Rock Nadeau ; Martin P. O'Boyle ; Paul H. Smith, Jr. ; Theodore G. van Kessel ; Hemantha K. Wickramasinghe, Chemical mechanical polishing in-situ end point system.
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  8. Acholla, Francis V.; Wank, Andrew; Gazze, Mark; Chang, Scott; Tsai, Jeff; Heeschen, William A.; Tate, James David; Chiang, Leo H.; Chin, Swee-Teng, Chemical mechanical polishing pad, polishing layer analyzer and method.
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  9. Lebel Richard J. ; Maurer Frederic ; Nadeau Rock ; Smith ; Jr. Paul H. ; Wickramasinghe Hemantha K. ; van Kessel Theodore G., Chemical-mechanical polishing system and method for integrated spin dry-film thickness measurement.
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  10. Arackaparambil,John F.; Chi,Tom; Chow,Billy; D'Souza,Patrick M.; Hawkins,Parris; Huang,Charles; Jensen,Jett; Krishnamurthy,Badri N.; Kulkarni,Pradeep M.; Kulkarni,Prakash M.; Lin,Wen Fong; Mohan,Shan, Computer integrated manufacturing techniques.
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  11. Arackaparambil,John F.; Chi,Tom; Chow,Billy; D'Souza,Patrick M.; Hawkins,Parris; Huang,Charles; Jensen,Jett; Krishnamurthy,Badri N.; Kulkarni,Pradeep M.; Kulkarni,Prakash M.; Lin,Wen Fong; Mohan,Shan, Computer integrated manufacturing techniques.
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  12. Paik, Young Joseph, Control of chemical mechanical polishing pad conditioner directional velocity to improve pad life.
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  13. Shanmugasundram, Arulkumar; Parikh, Suketu A., Copper wiring module control.
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  14. Shanmugasundram, Arulkumar P.; Schwarm, Alexander T., Dynamic metrology schemes and sampling schemes for advanced process control in semiconductor processing.
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  15. Shanmugasundram, Arulkumar P.; Schwarm, Alexander T., Dynamic metrology schemes and sampling schemes for advanced process control in semiconductor processing.
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  16. Shanmugasundram, Arulkumar P.; Schwarm, Alexander T., Dynamic metrology schemes and sampling schemes for advanced process control in semiconductor processing.
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  17. Paik, Young Jeen, Dynamic offset and feedback threshold.
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  18. Chi, Yueh-Shian; Hawkins, Parris C M; Huang, Charles Q., Dynamic subject information generation in message services of distributed object systems.
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  19. Chi,Yueh shian T.; Hawkins,Parris C. M.; Huang,Charles Q., Dynamic subject information generation in message services of distributed object systems in a semiconductor assembly line facility.
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  20. Krishnamurthy,Badri N.; Hawkins,Parris C. M., Experiment management system, method and medium.
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  21. Shanmugasundram, Arulkumar P.; Schwarm, Alexander T.; Prabhu, Gopalakrishna B., Feedback control of a chemical mechanical polishing device providing manipulation of removal rate profiles.
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  22. Shanmugasundram,Arulkumar P.; Schwarm,Alexander T.; Prabhu,Gopalakrishna B., Feedback control of a chemical mechanical polishing device providing manipulation of removal rate profiles.
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  23. Shanmugasundram, Arulkumar P.; Schwarm, Alexander T.; Iliopoulos, Ilias; Parkhomovsky, Alexander; Seamons, Martin J., Feedback control of plasma-enhanced chemical vapor deposition processes.
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  24. Paik,Young Joseph, Feedforward and feedback control for conditioning of chemical mechanical polishing pad.
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  25. Chi, Yuehshian T.; Hawkins, Parris C. M.; Jin, Qiaolin, Generic interface builder.
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  26. Shanmugasundram,Arulkumar P.; Schwarm,Alexander T., Integrating tool, module, and fab level control.
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  27. Reiss,Terry P.; Shanmugasundram,Arulkumar P.; Schwarm,Alexander T., Integration of fault detection with run-to-run control.
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  28. Timothy J. Donohue, Method and apparatus for detecting wafer slipouts.
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  29. Jun, Chung-Sam; Kim, Kye-Weon; Yang, Yu-Sin; Kim, Hyo-Hoo, Method for inspecting a polishing pad in a semiconductor manufacturing process, an apparatus for performing the method, and a polishing device adopting the apparatus.
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  30. Schwarm,Alexander T.; Shanmugasundram,Arulkumar P.; Pan,Rong; Hernandez,Manuel; Mohammad,Amna, Method of feedback control of sub-atmospheric chemical vapor deposition processes.
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  31. Acholla, Francis V.; Wank, Andrew; Gazze, Mark; Chang, Scott; Tsai, Jeff; Heeschen, William A.; Tate, James David; Chiang, Leo H.; Chin, Swee-Teng, Method of manufacturing chemical mechanical polishing pads.
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  32. Hikita, Junichi; Yoshida, Ikuo; Ino, Kazuhide, Method of producing a semiconductor device by dividing a semiconductor wafer into separate pieces of semiconductor chips.
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  33. Hikita,Junichi; Yoshida,Ikuo; Ino,Kazuhide, Method of producing a semiconductor device by dividing a semiconductor wafer into separate pieces of semiconductor chips.
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  34. Kokotov,Yuri; Entin,Efim; Seror,Jacques; Fisher,Yossi; Sarel,Shalomo; Shanmugasundram,Arulkumar P.; Schwarm,Alexander T.; Paik,Young Jeen, Method, system and medium for controlling manufacture process having multivariate input parameters.
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  35. Al Bayati,Amir; Adibi,Babak; Foad,Majeed; Somekh,Sasson, Method, system and medium for controlling semiconductor wafer processes using critical dimension measurements.
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  36. Shanmugasundram,Arulkumar P.; Armer,Helen; Schwarm,Alexander T., Method, system and medium for process control for the matching of tools, chambers and/or other semiconductor-related entities.
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  37. Schwarm,Alexander T.; Shanmugasundram,Arulkumar P.; Seror,Jacques; Kokotov,Yuri; Entin,Efim, Method, system, and medium for handling misrepresentative metrology data within an advanced process control system.
    상세보기
  38. Williams, Damon Vincent, Methods for controlling retaining ring and wafer head tilt for chemical mechanical polishing.
    상세보기
  39. Somekh, Sasson; Grunes, Howard E., Multi-tool control system, method and medium.
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  40. Nabeya,Osamu; Togawa,Tetsuji, Polishing apparatus and method for detecting foreign matter on polishing surface.
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  41. Saldana,Miguel A.; Williams,Damon Vincent, Polishing apparatus and methods having high processing workload for controlling polishing pressure applied by polishing head.
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  42. Tanaka, Hideaki; Sano, Satoshi, Probe polishing method, program therefor, and probe apparatus.
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  43. Paik,Young J., Process control by distinguishing a white noise component of a process variance.
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  44. Paik,Young Jeen, Process control by distinguishing a white noise component of a process variance.
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  45. Katrina A. Mikhaylich ; John M. Boyd, Sacrificial retaining ring CMP system and methods for implementing the same.
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  46. Padhi,Deenesh; Gandikota,Srinivas; Naik,Mehul; Parikh,Suketu A.; Dixit,Girish A., Selective metal encapsulation schemes.
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  47. Saldana, Miguel A.; Boyd, John M.; Gotkis, Yehiel; Owczarz, Aleksander A., Subaperture chemical mechanical polishing system.
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  48. Lebel, Richard J.; Maurer, Frederic; Nadeau, Rock; Smith, Jr., Paul H.; Wickramasinghe, Hemantha K.; van Kessel, Theodore G., Support and alignment device for enabling chemical mechanical polishing rinse and film measurements.
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  49. Hobbs, Philip Charles Danby; Lebel, Richard John; O'Boyle, Martin Patrick; van Kessel, Theodore Gerard; Wickramasinghe, Hemantha Kumar, System and multipass probe for optical interference measurements.
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  50. Zutshi, Ajoy; Surana, Rahul; Dixit, Girish, System, method, and medium for an endpoint detection scheme for copper low-dielectric damascene structures for improved dielectric and copper loss.
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  51. Schwarm,Alexander T., System, method, and medium for monitoring performance of an advanced process control system.
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  52. Surana,Rahul; Zutshi,Ajoy, Technique for process-qualifying a semiconductor manufacturing tool using metrology data.
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