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특허 상세정보

Encapsulating method of substrate based electronic device

국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판) B29C-070/70    B29C-045/02   
미국특허분류(USC) 264/272.15 ; 264/272.17 ; 264/276 ; 264/328.4
출원번호 US-0986934 (1997-12-08)
우선권정보 TW-86113569 (1997-09-18)
발명자 / 주소
출원인 / 주소
대리인 / 주소
    Bacon & Thomas PLLC.
인용정보 피인용 횟수 : 23  인용 특허 : 8

An encapsulating method of a substrate-based electronic device of the present invention comprises:


[ What is claimed is:] [1.] In a method of encapsulating a substrate-based electronic device which comprises placing the device in an encapsulating mold, said mold including a cavity, a runner, a gate and a pot; supplying an encapsulant to the pot, liquidizing the encapsulant in the pot and causing the liquidized encapsulant to flow into the cavity through the runner and gate to fill the cavity containing the semiconductor device to cause encapsulation, allowing the encapsulant to substantially solidify, opening said mold and removing the encapsulated su...

이 특허를 인용한 특허 피인용횟수: 23

  1. Toh Kok Seng SG; Liang C. Tay SG; Kay Kit-Tan SG. Apparatus for molding semiconductor components. USP2002086439869.
  2. Briar, John. Disposable mold runner gate for substrate based electronic packages. USP2004086770962.
  3. John Briar SG. Disposable mold runner gate for substrate based electronic packages. USP2002046372553.
  4. Chua Kok Hua,SGX ; Fang Ching Meng,SGX ; Tan Kim Hwee,SGX. Encapsulated circuit using vented mold. USP2001116319450.
  5. Rasmussen, Nikki; Condit, Reston A. Energetic potting materials, electronic devices potted with the energetic potting materials, and related methods. USP20180810042397.
  6. Biery, Ethan Charles; Hash, Michael; D'Urbano, Marc; Jacoby, Elliot G.; Altonen, Gregory; Mayo, Noel. Lamp control module. USP201002D610090.
  7. Williams,Vernon M.; Gifford,Michael D.. Leadframe and method for reducing mold compound adhesion problems. USP2007097264456.
  8. Williams,Vernon M.; Gifford,Michael D.. Leadframe and method for removing cleaning compound flash from mold vents. USP2006047029256.
  9. LoBianco, Anthony; Greenwood, Jonathon. Method and apparatus for increasing thickness of molded body on semiconductor package. USP2003076596212.
  10. Lin Wen-Yen,TWX ; Lee Ting-Chuan,TWX. Method and structure for packaging an integrated circuit with readily removed excess encapsulant on degating region. USP2000056057179.
  11. Murugan,Selvarajan. Method for integrated circuit packaging. USP2007017169345.
  12. Seng, Toh Kok; Tay, Liang C.; Kit-Tan, Kay. Method for molding semiconductor components. USP2003116652799.
  13. Williams, Vernon M.; Gifford, Michael D.. Method for removing cleaning compound flash from mold vents. USP2003126666997.
  14. Huang Chien Ping,TWX ; Huang Yang Chun,TWX ; Yu Kevin,TWX ; Chen Sheng-Fang,TWX. Method of encapsulating a chip. USP2000076083775.
  15. Shyh-Ing Wu TW; Shin Hua Chao TW; Yao Shin Fang TW. Method of making ball grid array package. USP2002036355499.
  16. Cho,Chang Ho. Mold die for molding chip array, molding equipment including the same, and method for molding chip array. USP2008077393489.
  17. Kao-Yu Hsu TW; Chun Hung Lin TW; Tao-Yu Chen TW. Molding method for BGA semiconductor chip package. USP2002016338813.
  18. Jonathan L. McFarland ; Steve W. Greathouse ; Eric Gelvin. Paper substrates for use in integrated circuit packaging molding processes. USP2002086436318.
  19. Chen Shih-Li,TWX. Process for releasing a runner from an electronic device package on a laminate plate. USP2000086096250.
  20. Hiroshi Haji JP. Resin mold electric part and producing method therefor. USP2002086432751.
  21. Hsu Kao-Yu,TWX ; Lee Shih Chang,TWX ; Kung Wei-Chun,TWX. Substrate strip for use in packaging semiconductor chips. USP2001076262490.
  22. Kao-Yu Hsu TW; Shih Chang Lee TW; Wei-Chun Kung TW. Substrate strip for use in packaging semiconductor chips and method for making the substrate strip. USP2002116482675.
  23. Wensel, Richard W.. Use of an oxide surface to facilitate gate break on a carrier substrate for a semiconductor device. USP2003046545368.