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Combined air and refrigeration cooling for computer systems 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • H05K-007/20
출원번호 US-0976062 (1997-11-21)
발명자 / 주소
  • Chrysler Gregory M.
  • Chu Richard C.
  • Goth Gary F.
  • Simons Robert E.
출원인 / 주소
  • International Business Machines Corporation
대리인 / 주소
    Cutter
인용정보 피인용 횟수 : 65  인용 특허 : 14

초록

A cabinet with air inlet and exhaust openings includes one or more air-moving devices for the air cooling of circuit cards contained within the cabinet. The circuit cards are insertable into a board (back plane) which also contains an electronic circuit module which is cooled by at least one refrige

대표청구항

[ The invention claimed is:] [1.] A redundantly cooled electronic system comprising:a cabinet having an air intake opening and an air exhaust opening;a planar circuit board disposed within said cabinet;an electronic module disposed on said planar circuit board;an air moving mechanism for moving air,

이 특허에 인용된 특허 (14)

  1. Neuenfeldt, Douglas L.; Thielman, David E., Air conditioner having improved structure for cooling electronics.
  2. Lndqvist Gsta B. (Johanneshov SEX), Apparatus for cooling telecommunications equipment in a rack.
  3. Leeb Karl-Erik (Djurhamn SEX), Arrangement for cooling electronic equipment by radiation transfer.
  4. Porter Warren W. (Escandido CA), Computer component cooling system with local evaporation of refrigerant.
  5. Morrison Robert A. (Long Beach CA), Cooling system for electronic modules.
  6. Ohashi Shigeo (Tsuchiura JPX) Hatada Toshio (Tsuchiura JPX) Tanaka Takeo (Minori-machi JPX) Iwai Susumu (Hadano JPX), Electronic equipment and lap-top type electronic equipment.
  7. Jean Amigo (No. 18 ; Alley S ; Lane 19 ; Nu-Chung Rd. I-Lan City TWX), Flexible heat transfer device.
  8. Budelman Gerald A. (Aloha OR), High efficiency heat removal system for electric devices and the like.
  9. Fox Leslie (Boxboro MA) Wade Paul C. (Shirley MA), Hybird cooling system for electronic components.
  10. Green Peter J. (Huntington WV), Low headroom ventilating apparatus for cooling an electrical enclosure.
  11. Thielman David E. (Hennepin County MN) Welch Dennis E. (Anoka County MN) Bezat Theodore P. (Hennepin County MN), Method and apparatus for electromechanical air conditioning of industrial electronics.
  12. Chrysler Gregory Martin ; Chu Richard Chao-Fan, Method for field upgrading of air cooling capacity.
  13. Diggelmann Hans (Neuenegg CHX) Ulrich Bohdan (Kehrsatz CHX), Process and apparatus for dissipating the heat loss of at least one assembly of electrical elements.
  14. Cowans Kenneth W. (Fullerton CA), Refrigeration system and method for very large scale integrated circuits.

이 특허를 인용한 특허 (65)

  1. VanGilder, James William; Healey, Christopher M.; Zhang, Xuanhang, Analysis of effect of transient events on temperature in a data center.
  2. Campbell, Levi A.; Chu, Richard C.; Ellsworth, Jr., Michael J.; Iyengar, Madhusudan K.; Simons, Robert E., Apparatus and method for facilitating pumped immersion-cooling of an electronic subsystem.
  3. Campbell, Levi A.; Chu, Richard C.; Ellsworth, Jr., Michael J.; Iyengar, Madhusudan K.; Simons, Robert E., Apparatus and method for immersion-cooling of an electronic system utilizing coolant jet impingement and coolant wash flow.
  4. Cruz, Ethan E.; Scanlon, Michael F., Apparatus to cool a computing device.
  5. Craddock, David; Gregg, Thomas A.; Lais, Eric N., Associating input/output device requests with memory associated with a logical partition.
  6. Manole, Dan M., Compact refrigeration system and power supply unit including dynamic insulation.
  7. Manole,Dan M.; Coffey,Donald L.; Moore,Michael J., Compact refrigeration system for providing multiple levels of cooling.
  8. Campbell, Levi A.; Chu, Richard C.; Ellsworth, Jr., Michael J.; Iyengar, Madhusudan K.; Simons, Robert E., Condenser block structures with cavities facilitating vapor condensation cooling of coolant.
  9. Campbell, Levi A.; Chu, Richard C.; Ellsworth, Jr., Michael J.; Iyengar, Madhusudan K.; Simons, Robert E., Condenser fin structures facilitating vapor condensation cooling of coolant.
  10. Campbell, Levi A.; Chu, Richard C.; Ellsworth, Jr., Michael J.; Iyengar, Madhusudan K.; Simons, Robert E., Condenser fin structures facilitating vapor condensation cooling of coolant.
  11. Campbell, Levi A.; Chu, Richard C.; Ellsworth, Jr., Michael J.; Iyengar, Madhusudan K.; Simons, Robert E., Condenser structures with fin cavities facilitating vapor condensation cooling of coolant.
  12. Sullivan, Thomas, Console cooler.
  13. Walter Nicolai DE; Adam Pawlowski DE; Harald Perlitz DE, Control cabinet with air conditioning device.
  14. Campbell, Levi A.; Chu, Richard C.; Ellsworth, Jr., Michael J.; Iyengar, Madhusudan K.; Simons, Robert E., Cooled electronic module with pump-enhanced, dielectric fluid immersion-cooling.
  15. Chandrakant D. Patel, Cooling arrangement for high performance electronic components.
  16. Tanaka, Shigeaki; Kasahara, Yoshikatsu, Cooling structure for rackmount-type control device and rack-type storage control device.
  17. Rasmussen, Neil; Bean, John H.; Uhrhan, Greg R.; Buell, Scott D., Cooling system and method.
  18. Rasmussen, Neil; Bean, Jr., John H.; Uhrhan, Greg R.; Buell, Scott D., Cooling system and method.
  19. Campbell, Levi A.; Chu, Richard C.; Ellsworth, Jr., Michael J.; Iyengar, Madhusudan K.; Simons, Robert E., Direct jet impingement-assisted thermosyphon cooling apparatus and method.
  20. Carlson, Scott M.; Casper, Daniel F.; Compton, Scott B.; Driever, Patricia G.; Flanagan, John R.; Hathorn, Roger G.; Ricci, Louis W.; Riedy, Dale F.; Yudenfriend, Harry M., Discovery of logical images at storage area network endpoints.
  21. Monfarad, Ali Heydari, Field replaceable packaged refrigeration heat sink module for cooling electronic components.
  22. Ellsworth, Jr., Michael J.; Lehman, Bret W.; Matteson, Jason A.; Schmidt, Roger R., Frame level partial cooling boost for drawer and/or node level processors.
  23. Lin, Pei-Hsi, Frame-type computer cooling device.
  24. Pal, Debabrata, Heat exchanger for motor controller.
  25. W. John Bilski ; Matthew D. Nissley ; Erik Mallett, Heat management system.
  26. Jacques,Joseph; Nguyen,Hiep; Garcia,Osvalso, High efficiency counter-flow shelf cooling system.
  27. Campbell, Levi A.; Chu, Richard C.; Ellsworth, Jr., Michael J.; Iyengar, Madhusudan K.; Simons, Robert E., Hybrid immersion cooled server with integral spot and bath cooling.
  28. Campbell, Levi A.; Chu, Richard C.; Ellsworth, Jr., Michael J.; Iyengar, Madhusudan K.; Simons, Robert E., Immersion-cooling apparatus and method for an electronic subsystem of an electronics rack.
  29. Wexler, Peter, In-row air containment and cooling system and method.
  30. Gregg, Thomas A.; Craddock, David F.; Lais, Eric N., Input/output (I/O) expansion response processing in a peripheral component interconnect express (PCIE) environment.
  31. Gregg, Thomas A.; Craddock, David F.; Lais, Eric N., Input/output (I/O) expansion response processing in a peripheral component interconnect express (PCIe) environment.
  32. Gregg, Thomas A.; Craddock, David F.; Lais, Eric N., Input/output (I/O) expansion response processing in a peripheral component interconnect express (PCIe) environment.
  33. Campbell, Levi A.; Chu, Richard C.; Ellsworth, Jr., Michael J.; Iyengar, Madhusudan K.; Simons, Robert E., Interleaved, immersion-cooling apparatus and method for an electronic subsystem of an electronics rack.
  34. Campbell, Levi A.; Chu, Richard C.; Ellsworth, Jr., Michael J.; Iyengar, Madhusudan K.; Simons, Robert E., Interleaved, immersion-cooling apparatuses and methods for cooling electronic subsystems.
  35. Campbell, Levi A.; Chu, Richard C.; Crippen, Martin J.; Ellsworth, Jr., Michael J.; Iyengar, Madhusudan K.; Kamath, Vinod; Matteson, Jason A.; Schmidt, Roger R.; Simons, Robert E., Liquid cooling apparatus and method for facilitating cooling of an electronics system.
  36. Campbell, Levi A.; Chu, Richard C.; Ellsworth, Jr., Michael J.; Iyengar, Madhusudan K.; Simons, Robert E., Liquid-cooled electronics rack with immersion-cooled electronic subsystems.
  37. Campbell, Levi A.; Chu, Richard C.; Ellsworth, Jr., Michael J.; Iyengar, Madhusudan K.; Simons, Robert E., Liquid-cooled electronics rack with immersion-cooled electronic subsystems and vertically-mounted, vapor-condensing unit.
  38. Check, Mark A.; Craddock, David F.; Gregg, Thomas A.; Mak, Pak-kin; Strait, Gary E., Memory error isolation and recovery in a multiprocessor computer system.
  39. Tutunoglu, Ozan, Method and apparatus for cooling.
  40. Tutunoglu, Ozan; Bean, Jr., John H., Method and apparatus for cooling.
  41. Tutunoglu, Ozan; Lingrey, David James, Method and apparatus for cooling.
  42. Tutunoglu, Ozan; Bean, Jr., John H., Method of operating a cooling system having one or more cooling units.
  43. Bean, Jr., John H., Modular ice storage for uninterruptible chilled water.
  44. Bean, Jr., John H., Modular ice storage for uninterruptible chilled water.
  45. Monfarad, Ali Heydari, Multiple compressor refrigeration heat sink module for cooling electronic components.
  46. Gregg, Thomas A.; Bayer, Gerd K.; Craddock, David F.; Jung, Michael; Lais, Eric N.; Nass, Elke G., Non-standard I/O adapters in a standardized I/O architecture.
  47. Bena, Maire-Pierre; Lebourgeois, Mickael; Robin, Laurent, Printed circuit board with ground conductor for electric motor, and electric motor.
  48. DeCusatis, Casimer M.; Krishnamurthy, Rajaram B.; Onghena, Michael; Rao, Anuradha, Redundant power supply configuration for a data center.
  49. DeCusatis, Casimer M.; Krishnamurthy, Rajaram B.; Onghena, Michael; Rao, Anuradha, Redundant power supply configuration for a data center.
  50. Monfarad, Ali Heydari, Refrigeration cooling assisted MEMS-based micro-channel cooling system.
  51. Mainers, Larry D.; Goyen, Mark J.; Lake, Vince, Retractable computer rack aisle roof.
  52. Mainers, Larry D.; Goyen, Mark J.; Lake, Vincent M., Retractable computer rack aisle roof.
  53. Craddock, David F.; Gregg, Thomas A.; Lais, Eric N., Scalable I/O adapter function level error detection, isolation, and reporting.
  54. Craddock, David F.; Gregg, Thomas A.; Lais, Eric N., Scalable I/O adapter function level error detection, isolation, and reporting.
  55. Bear, Daniel B., Single or dual buss thermal transfer system.
  56. DeCusatis, Casimer M.; Krishnamurthy, Rajaram B.; Onghena, Michael; Rao, Anuradha; Neugebauer, Brian J., Spread spectrum wireless communication code for data center environments.
  57. DeCusatis, Casimer M.; Krishnamurthy, Rajaram B.; Onghena, Michael; Rao, Anuradha; Neugebauer, Brian J., Spread spectrum wireless communication code for data center environments.
  58. Bayer, Gerd K.; Craddock, David F.; Gregg, Thomas A.; Jung, Michael; Kohler, Andreas; Nass, Elke G.; Schlag, Oliver G.; Szwed, Peter K., Switch failover control in a multiprocessor computer system.
  59. Shrivastava, Saurabh K.; VanGilder, James W., System and method for arranging equipment in a data center.
  60. VanGilder, James William, System and method for prediction of temperature values in an electronics system.
  61. Lais, Eric N.; Craddock, David F.; Gregg, Thomas A., System and method for routing I/O expansion requests and responses in a PCIE architecture.
  62. Healey, Christopher M.; Zhang, Xuanhang, System and method for sequential placement of cooling resources within data center layouts.
  63. Gregg, Thomas A.; Craddock, David F.; Lais, Eric N., Upbound input/output expansion request and response processing in a PCIe architecture.
  64. Gregg, Thomas A.; Craddock, David F.; Lais, Eric N., Upbound input/output expansion request and response processing in a PCIe architecture.
  65. Belady, Christian L.; Peterson, Eric C., Upgradeable, modular data center cooling apparatus.
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