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특허 상세정보

Method for integrating microelectromechanical devices with electronic circuitry

특허상세정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판) H01L-021/00   
미국특허분류(USC) 438/048 ; 438/050 ; 438/053 ; 148/DIG.105
출원번호 US-0974586 (1997-11-19)
발명자 / 주소
  • Barron Carole C.
  • Fleming James G.
  • Montague Stephen
출원인 / 주소
  • Sandia Corporation
대리인 / 주소
    Hohimer
인용정보 피인용 횟수 : 189  인용 특허 : 21
초록

A method is disclosed for integrating one or more microelectromechanical (MEM) devices with electronic circuitry on a common substrate. The MEM device can be fabricated within a substrate cavity and encapsulated with a sacrificial material. This allows the MEM device to be annealed and the substrate planarized prior to forming electronic circuitry on the substrate using a series of standard processing steps. After fabrication of the electronic circuitry, the electronic circuitry can be protected by a two-ply protection layer of titanium nitride (TiN) and...

대표
청구항

[ What is claimed is:] [1.] A method for integrating a microelectromechanical (MEM) device with electronic circuitry on a substrate comprising steps for:(a) etching a cavity within a first portion of the substrate;(b) fabricating the MEM device within the cavity, and filling the cavity with a sacrificial material;(c) fabricating the electronic circuitry comprising a plurality of transistors within a second portion of the substrate proximate to the first portion, and interconnecting the electronic circuitry to the MEM device;(d) protecting the electronic ...

인용문헌 (21)

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