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Cooler for electronic devices 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • F28D-015/00
출원번호 US-0020896 (1998-02-09)
우선권정보 JP-0231839 (1997-08-13)
발명자 / 주소
  • Mochizuki Masataka,JPX
  • Mashiko Koichi,JPX
  • Goto Kazuhiko,JPX
  • Saito Yuji,JPX
  • Eguchi Katsuo,JPX
  • Nagaki Yoshihiro,JPX
  • Takamiya Akihiro,JPX
  • Nguyen Thang Toan,JPX
출원인 / 주소
  • Fujikura Ltd., JPX
대리인 / 주소
    Oblon, Spivak, McClelland, Maier & Neustadt, P.C.
인용정보 피인용 횟수 : 30  인용 특허 : 14

초록

An electronic device cooler for cooling an exothermic member arranged in a case, including an air compressor configured to compress adiabatically air in the case to an elevated temperature. Also included is a heat pipe configured to discharge heat from the air adiabatically compressed to the elevate

대표청구항

[ What is claimed is:] [1.] An electronic device cooler for cooling an exothermic member arranged in a case, comprising:an air compressor configured to compress adiabatically air in said case to an elevated temperature;a heat pipe configured to discharge heat from the air adiabatically compressed to

이 특허에 인용된 특허 (14)

  1. Kinsell Robert C. (Los Angeles CA) Noe James C. (Canoga Park CA) Byrne John P. (Westminster CA), Air cycle air conditioning system for vehicles.
  2. Gourdine Meredith C. (Houston TX), Apparatus and method for cooling heat generating electronic components in a cabinet.
  3. Altoz Frank E. (Baltimore MD) McClure John D. (Annapolis MD), Apparatus for cooling electronic components in aircraft.
  4. Renninger Stanton W. (Cincinnati OH) Giffin ; III Rollin G. (Cincinnati OH), Auxiliary refrigerated air system employing input air from turbine engine compressor after bypassing and conditioning wi.
  5. Novotny Shlomo D. (Wayland MA), Closed-cycle expansion-valve impingement cooling system.
  6. Bailey Douglas A. (Concord MA), Cooling system for computers.
  7. Hiratsuka Yoshiaki (Kawasaki JPX), Electronic apparatus having cooling system.
  8. Ohmori Akimitsu (Tokyo JPX) Kinjo Morishige (Tokyo JPX), Electronic equipment having integrated circuit device and temperature sensor.
  9. Lee Richard (7F ; No. 152-1 ; Sec. 7 ; Chung Shan N. Rd. Taipei TWX), Heat dissipating apparatus.
  10. Mecredy ; III Henry E., Heat dissipating lid hinge structure with laterally offset heat pipe end portions.
  11. Mochizuki Masataka (Tokyo JPX) Ono Motoyuki (Tokyo JPX) Mashiko Koichi (Tokyo JPX) Saito Yuji (Tokyo JPX) Hasegawa Masashi (Tokyo JPX) Nagata Masakatsu (Tokyo JPX), Heat pipe and process for manufacturing the same.
  12. Nelson Daryl (Beaverton OR), Multiple-fan microprocessor cooling through a finned heat pipe.
  13. Larson Ralph I. (Bolton MA) Phillips Richard L. (Alachua FL) Beane Alan F. (Gilford NH), Two-phase cooling system for laptop computers.
  14. Hara Shinichi (Yokohama JPX) Ebinuma Ryuichi (Machida JPX), Wafer cooling device.

이 특허를 인용한 특허 (30)

  1. Sasaki, Chiyoshi, Apparatus for cooling a box with heat generating elements received therein and a method for cooling same.
  2. Broder Damon ; Hood ; III Charles D., Apparatus for cooling a heat generating component in a computer.
  3. Hoermandinger, Klaus; Klink, Achim, Battery arrangement.
  4. Sagal, E. Mikhail; McCullough, Kevin A.; Miller, James D., Composite overmolded heat pipe construction.
  5. DiFonzo,John; Zadesky,Stephen; Prichard,Michael, Computer component protection.
  6. Merz,Nick; DiFonzo,John; Prichard,Michael, Computer component protection.
  7. Cheon Kioan, Cooling apparatus for electronic devices.
  8. Kim,Ye Yong; Ko,Ki Tak, Cooling apparatus for portable computer.
  9. Van Lear,Brian T.; Whitaker,Jerad D., Cooling devices and systems.
  10. Bhatia Rakesh, Cooling fan for computing devices with split motor and fan blades.
  11. Maeda, Tomohiro, Cooling medium circulating apparatus, air conditioning apparatus for vehicle, and method for controlling cooling medium circulating apparatus.
  12. Anazawa Makoto,JPX ; Aitaka Kazuhiko,JPX ; Watanabe Kazunori,JPX, Cooling structure an electric vehicle.
  13. Wei, Jie, Cooling system and electronic apparatus having the same.
  14. Kuo,Yi Lung, Fan for cooling a computer.
  15. Merz, Nicholas G.; DiFonzo, John C.; Zadesky, Stephen P.; Prichard, Michael J., Heat dissipation in computing device.
  16. Merz, Nicholas G.; Difonzo, John C.; Zadesky, Stephen P.; Prichard, Michael J., Heat dissipation in computing device.
  17. Merz, Nick; DiFonzo, John; Zadesky, Stephen; Prichard, Michael, Heat dissipation in computing device.
  18. Merz, Nick; DiFonzo, John; Zadesky, Stephen; Prichard, Michael, Heat dissipation in computing device.
  19. Venkataramani, Kattalaicheri Srinivasan; Moniz, Thomas Ory; Stephenson, Justin P.; Bailey, William Andrew, Heat pipe-based cooling apparatus and method for turbine engine.
  20. Katsui, Tadashi, Heat sink and information processor using heat sink.
  21. Tadashi Katsui JP, Heat sink and information processor using heat sink.
  22. Tadashi Katsui JP, Heat sink and information processor using heat sink.
  23. Goodman Lloyd Jack ; Chiu Chai-Pin ; Watwe Abhay W. ; Viswanath Ram, Heat sink with a heat pipe for spreading of heat.
  24. Venkataramani, Kattalaicheri Srinivasan; Moniz, Thomas Ory; Stephenson, Justin P.; Bailey, William Andrew, Heat transfer system and method for turbine engine using heat pipes.
  25. Stephenson, Justin P.; Moniz, Thomas Ory; Venkataramani, Kattalaicheri Srinivasan, Heat transfer system for turbine engine using heat pipes.
  26. Herman W. Chu ; Rakesh Bhatia, High performance notebook PC cooling system.
  27. Sagal, E. Mikhail; McCullough, Kevin A.; Miller, James D., Method of manufacturing a composite overmolded heat pipe.
  28. Yi Lung,Kuo, Placement structure of an integrated motherboard for small form factor computer.
  29. Becker, Craig Henry; Hsu, Jimmy Ming-Der; Vicknair, Wayne Elmo, Portable device for cooling a laptop computer.
  30. James Carl Canfield ; Michael L. Dougherty, Sr. ; James Allen Beyer ; Dale Linwood Sleep, Thermal management system for positive crankcase ventilation system.
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