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Carrier head with a flexible membrane for a chemical mechanical polishing system 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • B24B-005/00
  • B24B-029/00
출원번호 US-0891548 (1997-07-11)
발명자 / 주소
  • Perlov Ilya
  • Gantvarg Eugene
  • Ko Sen-Hou
출원인 / 주소
  • Applied Materials, Inc.
대리인 / 주소
    Fish & Richardson
인용정보 피인용 횟수 : 115  인용 특허 : 26

초록

A carrier head with a flexible member connected to a base to define a first chamber, a second chamber and a third chamber. A lower surface of the flexible member provides a substrate receiving surface with an inner portion associated with the first chamber, a substantially annular middle portion sur

대표청구항

[ What is claimed is:] [1.] A carrier head for use in a chemical mechanical polishing system, comprising:a base; anda flexible member connected to the base to define a first chamber, a second chamber and a third chamber, a lower surface of the flexible member providing a substrate receiving surface

이 특허에 인용된 특허 (26)

  1. Jennings Bernard A. (Plot 53 Laezonia ; Transvaal ZAX), Abrasive tools.
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  4. Zuniga Steven M. ; Blumenkranz Stephen J., Carrier head design for a chemical mechanical polishing apparatus.
  5. Shendon Norman (San Carlos CA), Chemical mechanical polishing apparatus with improved carrier and method of use.
  6. Shendon Norm (San Carlos CA), Chemical mechanical polishing apparatus with improved polishing control.
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  8. Kimura Norio (Fujisawa JPX) Kawamoto Takayoshi (Chigasaki JPX) Ishii You (Fujisawa JPX) Aoki Katsuyuki (Yokohama JPX) Tateishi Kunio (Fujisawa JPX) Yasuda Hozumi (Fujisawa JPX) Namiki Keisuke (Fujisa, Method and apparatus for polishing workpiece.
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  10. Kitta Satoru (Nagano JPX), Method for lapping a wafer material and an apparatus therefor.
  11. Banks Edward L. (Willingboro Township ; Burlington County NJ), Methods and apparatus for polishing a semiconductor wafer.
  12. Jackson Paul David (Scottsdale AZ) Schultz Stephen Charles (Gilbert AZ), Pneumatic polishing head for CMP apparatus.
  13. Hirose Masayoshi (Tokyo JPX) Tsujimura Manabu (Tokyo JPX) Ishikawa Seiji (Tokyo JPX) Kimura Norio (Tokyo JPX) Ishii You (Tokyo JPX), Polishing apparatus.
  14. Tanaka Kouichi (Takasaki JPX) Uchiyama Isao (Nishigo JPX), Polishing apparatus.
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  17. Volodarsky Konstantine (San Francisco CA) Kajiwara Jiro (Foster City CA) Owens ; Jr. Herbert W. (San Jose CA) King Jan H. (Sunnyvale CA), Rotary union for coupling fluids in a wafer polishing apparatus.
  18. Koeth Joe E. (Mesa AZ) Hoffman Melvin J. (Scottsdale AZ) Jackson Paul D. (Scottsdale AZ), Semiconductor wafer carrier and method.
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  23. Kobayashi Hiroyuki (Omiya JPX) Miyairi Hiroo (Omiya JPX) Endo Osamu (Omiya JPX), Wafer polishing apparatus.
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이 특허를 인용한 특허 (115)

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