초록 ▼

An apparatus for thermally conditioning a semiconductor unit is provided which includes a surface plate for receiving the semiconductor unit thereon which is connected to a thermoelectric device and a closed loop heat exchanger. At least one temperature sensor is disposed adjacent the surface plate

An apparatus for thermally conditioning a semiconductor unit is provided which includes a surface plate for receiving the semiconductor unit thereon which is connected to a thermoelectric device and a closed loop heat exchanger. At least one temperature sensor is disposed adjacent the surface plate for sensing the temperature of the surface plate. The thermoelectric device has first and second sides with the first side disposed against the surface plate. The closed loop heat exchanger is coupled to the second side of the thermoelectric device. The closed loop heat exchanger includes a chamber or cavity having an inlet and an outlet with the chamber disposed adjacent the second side of the thermoelectric device. The closed loop heat exchanger further includes conduit connected to the inlet and outlet of the chamber and a heat transfer unit connected to the conduit opposite the chamber. Heat transfer fluid is contained within the closed loop heat exchanger and a pump is provided for pumping the heat transfer fluid through the closed loop heat exchanger wherein the heat transfer unit transfers heat to or from the heat transfer fluid to control the temperature of the heat transfer fluid. The thermoelectric device transfers heat to or from the surface plate to thermally condition the semiconductor unit disposed on the surface plate while the closed loop heat exchanger transfers heat to or from the second side of the thermoelectric device which increases the range of temperature under which the semiconductor unit may be thermally conditioned.

대표청구항 ▼

[ What is claimed is:] [1.] An apparatus for thermal conditioning of a semiconductor unit comprising:a surface plate for receiving the semiconductor unit thereon;at least one temperature sensor for sensing the temperature of the surface plate;a thermoelectric device having first and second sides wit

[ What is claimed is:] [1.] An apparatus for thermal conditioning of a semiconductor unit comprising:a surface plate for receiving the semiconductor unit thereon;at least one temperature sensor for sensing the temperature of the surface plate;a thermoelectric device having first and second sides with the first side disposed against the surface plate;a closed loop heat exchanger coupled to the second side of the thermoelectric device including:a chamber having an inlet and an outlet, the chamber disposed to and in connection with the second side of the thermoelectric device, conduit connected to the inlet and outlet of the chamber, a heat transfer unit connected to the conduit opposite the chamber, a heat transfer fluid contained within the chamber, conduit and heat transfer unit, and a pump connected to the conduit for pumping the heat transfer fluid through the closed loop heat exchanger, wherein the heat transfer unit transfers heat to or from the heat transfer fluid to control the temperature of the heat transfer fluid,wherein the thermoelectric device transfers heat to or from the surface plate to thermally condition the semiconductor device disposed on the surface plate and the closed loop heat exchanger transfers heat to or from the second side of the thermoelectric device to increase the range of temperature under which the semiconductor unit may be thermally conditioned by the surface plate.