초록 ▼

An apparatus for performing a global planarization of a surface of a deformable layer of a wafer on a production scale. The apparatus includes a chamber having a pressing surface and containing a rigid plate and a flexible pressing member or "puck" disposed between the rigid plate and the pressing s

An apparatus for performing a global planarization of a surface of a deformable layer of a wafer on a production scale. The apparatus includes a chamber having a pressing surface and containing a rigid plate and a flexible pressing member or "puck" disposed between the rigid plate and the pressing surface. A wafer having a deformable outermost layer is placed on the flexible pressing member so the deformable layer of the wafer is directly opposite and substantially parallel to the pressing surface. Force is applied to the rigid plate which propagates through the flexible pressing member to press the deformable layer of the wafer against the pressing surface. Preferably, a bellows arrangement is used to ensure a uniformly applied force to the rigid plate. The flexible puck serves to provide a self adjusting mode of uniformly distributing the applied force to the wafer ensuring the formation of a high quality planar surface. The surface of the wafer assumes the shape of the pressing surface and is hardened in a suitable manner while under pressure to produce a globally planarized surface on the wafer. After the force is removed from the rigid plate, lift pins are slidably inserted through the rigid plate and the flexible pressing member to lift the wafer off of the surface of the flexible pressing member.

대표청구항 ▼

[ What is claimed is:] [1.] An apparatus for performing global planarization of a deformable surface of a wafer comprising:a chamber body having an interior surface and first and second ends;a base plate attached to and closing said first end of said chamber body, said base plate having an inner sur

[ What is claimed is:] [1.] An apparatus for performing global planarization of a deformable surface of a wafer comprising:a chamber body having an interior surface and first and second ends;a base plate attached to and closing said first end of said chamber body, said base plate having an inner surface;a press plate attached to and closing said second end of said chamber body, said press plate having a pressing surface, said pressing surface, said inner surface and said interior surface defining a chamber;a rigid plate having a top surface and a bottom surface disposed within said chamber, said top surface being substantially parallel to said pressing surface, said rigid plate distributing an applied force to said wafer;a flexible pressing puck member having substantially parallel upper and lower surfaces, said lower surface of said flexible pressing puck member being seated on said top surface of said rigid plate, said upper surface of said flexible pressing puck member being directly opposite and substantially parallel to said pressing surface, said flexible pressing puck member distributing an applied force thereto by said rigid plate to said wafer; anda drive for uniformly applying force to said bottom surface of said rigid plate to drive said rigid plate and said flexible pressing puck member toward said pressing surface.