초록 ▼

There is provided a leadframe assembly for encapsulation in a polymer resin which prevents post-assembly fracture or swelling of the resin. The leadframe is coated with an adhesion enhancing layer that increases the shear stress required for delamination to in excess of about 3.4 MPa. In combination

There is provided a leadframe assembly for encapsulation in a polymer resin which prevents post-assembly fracture or swelling of the resin. The leadframe is coated with an adhesion enhancing layer that increases the shear stress required for delamination to in excess of about 3.4 MPa. In combination with this adhesion enhancing layer is a compliant die attach adhesive bonding an integrated circuit device to a central die attach paddle. This compliant die attach adhesive has a compliancy factor, E.multidot.a of less than 1.5 MPa/.degree.C. and a thickness of from about 0.01 mm to about 0.08 mm.

대표청구항 ▼

[ We claim:] [1.] A leadframe assembly, comprising:a metallic leadframe having a plurality of leads, each said lead having an inner lead portion and an outer lead portion, said inner lead portions defining a central aperture;a metallic heat spreader disposed within said central aperture;an adhesion

[ We claim:] [1.] A leadframe assembly, comprising:a metallic leadframe having a plurality of leads, each said lead having an inner lead portion and an outer lead portion, said inner lead portions defining a central aperture;a metallic heat spreader disposed within said central aperture;an adhesion enhancing layer coating at least a portion of said inner lead portion and of said heat spreader;a compliant die attach adhesive adjacent to one side of said metallic heat spreader, said compliant die attach adhesive having a thickness of from about 0.01 mm to about 0.08 mm and a compliancy factor, E.multidot.a, of less than about 1.5 MPa/.degree.C.; anda molding resin encapsulating said inner lead portion and partially encapsulating said heat spreader.