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Methods of fixturing flexible circuit substrates and a processing carrier, processing a flexible circuit and processing 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • H05K-003/00
출원번호 US-0858021 (1997-05-16)
발명자 / 주소
  • Lake Rickie C.
  • Tuttle Mark E.
  • Mousseau Joseph P.
  • Cirino Clay L.
출원인 / 주소
  • Micron Communications, Inc.
대리인 / 주소
    Wells, St. John, Roberts, Gregory & Matkin P.S.
인용정보 피인용 횟수 : 87  인용 특허 : 7

초록 ▼

Methods of fixturing a flexible circuit substrate to a processing carrier are disclosed. In one implementation, the flexible circuit substrate and processing carrier are attached with an adhesive film provided therebetween. The adhesive film comprises acrylic, silicone or a silicone acrylic blend in

대표청구항 ▼

[ We claim:] [1.] A method of fixturing a flexible circuit substrate and a processing carrier, comprising:providing plural adhesive films;providing a flexible circuit substrate;providing a processing carrier; andattaching the flexible circuit substrate and the processing carrier together with the ad

이 특허에 인용된 특허 (7)

  1. Walton ; Tommy L., Cover layer for flexible circuits.
    상세보기
  2. Muramatsu Eiji (Suwa JPX) Kamimura Masaru (Suwa JPX), Electronic component mounting structures for FPC tape carrier and methods of separation and application.
    상세보기
  3. Kasubuchi Takeshi (Nara JPX) Ozawa Kaoru (Yamatokoriyama JPX) Hara Takeo (Ikoma JPX), Electronic control assembly mounted on a flexible carrier and manufacture thereof.
    상세보기
  4. Clementi Robert J. (Binghamton NY) Gazdik Charles E. (Endicott NY) Lafer William (Chenango Bridge NY) Lovesky Roy L. (Vestal NY) McBride Donald G. (Binghamton NY) Munson Joel V. (Port Crane NY) Skarv, Flexible film semiconductor chip carrier.
    상세보기
  5. Lam Ken (Colorado Springs CO), Method of forming integrated leadouts for a chip carrier.
    상세보기
  6. Dixon Herbert S. (Derry NH) Weller Jonathan W. (Amherst NH) Boyer Ivon (Merrimack NH) McKenney Darryl J. (Milford NH), Multilayer combined rigid and flex printed circuits.
    상세보기
  7. Sakamoto Kazunori (Yokohama JPX) Umemoto Kazuhiro (Kusatsu JPX), Tape carrier for LCD driver package with anchor holes on either side of and spaced 0.2 mm to 10 mm from the chip mountin.
    상세보기

이 특허를 인용한 특허 (87)

  1. Tsukagoshi, Isao; Kobayashi, Kouji; Matsuda, Kazuya; Fukushima, Naoki; Koide, Jyunichi, Adhesive-coated electronic parts on a connection sheet.
    상세보기
  2. Salmon,Peter C., Apparatus and method for testing electronic systems.
    상세보기
  3. Forster, Ian J.; King, Patrick F., Apparatus for forming a wireless communication device.
    상세보기
  4. Forster, Ian J.; King, Patrick F., Apparatus for preparing an antenna for use with a wireless communication device.
    상세보기
  5. Adib, Kaveh; Bellman, Robert Alan; Bookbinder, Dana Craig; Chang, Theresa; Liu, Shiwen; Manley, Robert George; Mazumder, Prantik, Articles and methods for controlled bonding of thin sheets with carriers.
    상세보기
  6. Bellman, Robert Alan; Bookbinder, Dana Craig; Manley, Robert George; Mazumder, Prantik; Chang, Theresa; Domey, Jeffrey John; Stephens, II, Alan Thomas, Bulk annealing of glass sheets.
    상세보기
  7. Carre, Alain R. E.; Francois, Eric J. P.; Waku-Nsimba, Jean; Wondraczek, Katrin, Carrier for glass substrates.
    상세보기
  8. Chung, Kevin Kwong-Tai, Carrier tape.
    상세보기
  9. Akamatsu,Takayoshi; Okuyama,Futoshi; Kuroki,Nobuyuki; Enomoto,Hiroshi; Hayashi,Tetsuya; Matsuda,Yoshio; Shinba,Yoichi; Oguni,Masahiro, Circuit board, laminated member for circuit board, and method for making laminated member for circuit board.
    상세보기
  10. Salmon, Peter C., Component connections using bumps and wells.
    상세보기
  11. Tai,Tomishige; Takahashi,Seiya, Electric connecting part.
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  12. Salmon, Peter C., Electronic assembly with electronic compontent and interconnection assembly connected via conductive bump and mating well.
    상세보기
  13. Tuttle, Mark E., Electronic communication devices, methods of forming electrical communication devices, and communications methods.
    상세보기
  14. Salmon, Peter C., Electronic system modules and method of fabrication.
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  15. Salmon, Peter C., Electronic system modules and method of fabrication.
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  16. Salmon, Peter C., Electronic system modules and method of fabrication.
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  17. Salmon, Peter C., Electronic system modules and method of fabrication.
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  18. Salmon, Peter C., Electronic system modules and method of fabrication.
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  19. Forster, Ian J.; King, Patrick F.; Ginn, Michael G., Energy source communication employing slot antenna.
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  20. Forster,Ian J.; King,Patrick F.; Ginn,Michael G., Energy source communication employing slot antenna.
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  21. Forster,Ian J.; King,Patrick F.; Ginn,Michael G., Energy source communication employing slot antenna.
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  22. Forster,Ian J; King,Patrick F; Ginn,Michael G, Energy source communication employing slot antenna.
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  23. Salmon, Peter C., Fabrication method for electronic system modules.
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  24. Salmon,Peter C., Fabrication method for electronic system modules.
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  25. Bellman, Robert Alan; Bookbinder, Dana Craig; Manley, Robert George; Mazumder, Prantik, Facilitated processing for controlling bonding between sheet and carrier.
    상세보기
  26. Chou, Bruce C. S., Fingerprint sensing device having flexible printed circuit board serving as signal transmission structure and the method of manufacturing the same.
    상세보기
  27. Moore, Kevin D., Flexible circuit board having electrical resistance heater trace.
    상세보기
  28. Bellman, Robert Alan; Bookbinder, Dana Craig; Manley, Robert George; Mazumder, Prantik; Chang, Theresa; Domey, Jeffrey John; Enicks, Darwin Gene; Ravichandran, Vasudha; Stephens, II, Alan Thomas; Thomas, John Christopher, Glass articles and methods for controlled bonding of glass sheets with carriers.
    상세보기
  29. King,Patrick F.; Forster,Ian J., Grounded antenna for a wireless communication device and method.
    상세보기
  30. King,Patrick F.; Forster,Ian J., Grounded antenna for a wireless communication device and method.
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  31. King,Patrick F; Forster,Ian J, Grounded antenna for a wireless communication device and method.
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  32. Munn, Jason D., High-speed RFID circuit placement device.
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  33. Munn, Jason, High-speed RFID circuit placement method.
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  34. Munn,Jason, High-speed RFID circuit placement method.
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  35. Ferguson, Scott Wayne; Linkmann, Ralf; Kiehne, Werner, High-speed RFID circuit placement method and device.
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  36. Ferguson, Scott Wayne; Linkmann, Ralf; Kiehne, Werner, High-speed RFID circuit placement method and device.
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  37. Salmon,Peter C., Interconnection circuit and electronic module utilizing same.
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  38. Forster, Ian J; King, Patrick F, Manufacturing method for a wireless communication device and manufacturing apparatus.
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  39. Gramse, Leonard J.; Sang, Houn; Waskosky, Dean A.; Toyli, Matthew D., Method and apparatus for carrying circuit assemblies.
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  40. Gramse,Leonard J.; Sang,Houn; Waskosky,Dean A.; Toyli,Matthew D., Method and apparatus for carrying circuit assemblies.
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  41. Forster, Ian J; King, Patrick F, Method and system for manufacturing a wireless communication device.
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  42. Forster, Ian J.; King, Patrick F., Method and system for preparing wireless communication chips for later processing.
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  43. Morris, Francis J., Method for fabricating electrical circuitry on ultra-thin plastic films.
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  44. Coleman, James P.; Edwards, David N.; Forster, Ian J.; Iyer, Pradeep; Licon, Mark A., Method of making conductive patterns.
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  45. Armijo, Edward A.; Hughen, John F.; Kennedy, Steven C.; Linder, Samuel A.; Munn, Jason D., Method of manufacturing RFID devices.
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  46. Armijo, Edward A.; Hughen, John F.; Kennedy, Steven C.; Linder, Samuel A.; Munn, Jason D., Method of manufacturing RFID devices.
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  47. Accardi, Corrado; Loverso, Stella; Ravesi, Sebastiano; Sparta, Noemi Graziana, Method of manufacturing an electronic device having a plastic substrate and corresponding carrier.
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  48. Mark E. Tuttle ; John R. Tuttle ; Rickie C. Lake, Method of manufacturing an enclosed transceiver.
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  49. Forster, Ian J.; King, Patrick F., Method of preparing an antenna.
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  50. Forster,Ian J.; King,Patrick F., Method of producing a wireless communication device.
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  51. Forster, Ian J; King, Patrick F, Method of producing antenna elements for a wireless communication device.
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  52. Kim, Gi Heon; Kim, Yong Hae; Park, Dong Jin; Kim, Chul Am; Suh, Kyung Soo, Method of stacking flexible substrate.
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  54. Akamatsu, Takayoshi; Okuyama, Futoshi; Kuroki, Nobuyuki; Enomoto, Hiroshi; Hayashi, Tetsuya; Matsuda, Yoshio; Shinba, Yoichi; Oguni, Masahiro, Methods for making laminated member for circuit board, making circuit board and laminating flexible film.
    상세보기
  55. Bellman, Robert Alan; Bookbinder, Dana Craig; Manley, Robert George; Mazumder, Prantik; Chang, Theresa; Domey, Jeffrey John; Enicks, Darwin Gene; Ravichandran, Vasudha; Stephens, II, Alan Thomas; Thomas, John Christopher, Methods for processing electronic devices.
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  56. Rickie C. Lake ; Mark E. Tuttle ; Joseph P. Mousseau ; Clay L. Cirino, Methods of fixturing a flexible substrate and a processing carrier and methods of processing a flexible substrate.
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  57. Bigelow, Donald Orrin; Kang, Kiat Chyai; Lewis, Sue Camille; Natarajan, Govindarajan; Park, Eungsik, Methods of processing a glass substrate and glass apparatus.
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  58. Forster, Ian J, Multi-band wireless communication device and method.
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  59. Forster, Ian J, Multi-band wireless communication device and method.
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  75. Chen, Michael A., System and method for providing digital content.
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  76. Tuttle, John R., System and method to track articles at a point of origin and at a point of destination using RFID.
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  77. Tsai, Pao-Ming; Jiang, Liang-You; Chang, Yu-Yang; Li, Hung-Yuan, Transferring structure for flexible electronic device and method for fabricating flexible electronic device.
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  82. King, Patrick F.; Forster, Ian J., Wireless communication device and method for discs.
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  83. King, Patrick F.; Forster, Ian J., Wireless communication device and method for discs.
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  84. Tuttle, Mark E., Wireless identification device, RFID device with push-on/push off switch, and method of manufacturing wireless identification device.
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