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[미국특허] Single in-line memory module 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • G11C-013/00
출원번호 US-0878705 (1997-06-19)
발명자 / 주소
  • Bechtolsheim Andreas
  • Frank Edward
  • Testa James
  • Storm Shawn
출원인 / 주소
  • Sun Microsystems, Inc.
대리인 / 주소
    Conley, Rose & Tayon, PCKivlin
인용정보 피인용 횟수 : 180  인용 특허 : 82

초록

A single in-line memory module (SIMM) for memory expansion in a computer system. The SIMM includes a plurality of memory chips surface-mounted on a printed circuit board. The printed circuit board includes a dual read-out connector edge adapted for insertion within a socket of the computer system. O

대표청구항

[ We claim:] [1.] A single in-line memory module for memory expansion in a computer system, the single in-line memory module comprising:a printed circuit board having a first side and a second side, wherein the printed circuit board includes a connector edge adapted for insertion within a socket of

이 특허에 인용된 특허 (82) 인용/피인용 타임라인 분석

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  5. Cobaugh ; Robert Franklin ; Coller ; James Ray, Circuit board connector.
  6. Billman Timothy B. (King NC) Thrush Roger L. (Clemmons NC), Circuit panel socket with cloverleaf contact.
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  10. Saito Masaaki (Tokyo JPX), Connector for a printed circuit board.
  11. Corbett Tim J. (Boise ID) Wood Alan G. (Boise ID), Directly bonded board multiple integrated circuit module.
  12. Corbett Tim J. (Boise ID) Wood Alan G. (Boise ID), Directly bonded simm module.
  13. Billman Timothy B. (King NC) Thrush Roger L. (Clemmons NC), Dual read-out SIMM socket for high electrical speed applications.
  14. Billman Timothy B. (King NC) Thrush Roger L. (Clemmons NC), Dual readout SIMM socket.
  15. Billman Timothy B. (King NC) Thrush Roger L. (Clemmons NC), Dual readout extended socket.
  16. Billman Timothy B. (King NC) Thrush Roger L. (Clemmons NC) Zutaut Donald J. (Winston-Salem NC), Dual row connector for low profile package.
  17. Choy Conrad Y. (San Francisco CA) Yu Jack (Sunnyvale CA), Durable latch for memory module board.
  18. Yang Lee Su-Lan (4th Floor ; No. 506-2 ; Yuan-San Road Chung-Ho City ; Taipei Hsien TWX), Durable latch with mounting peg of memory module socket.
  19. Coller, James R.; Thrush, Roger L., Edge connector for chip carrier.
  20. Long Frank T. (1351 Rambling Rd. Simi Valley CA 93065), Ejecting SIMM socket.
  21. Billman Timothy B. (King NC) Thrush Roger L. (Clemmons NC), Electrical connector with module extraction apparatus.
  22. McGinley William J. (Barrington IL), Electrical edge connector.
  23. Krehbiel Fred L. (Lake Forest IL), Electrical socket assembly for single in-line circuit package.
  24. Angleton Joseph L. (Canoga Park CA) Gutgsell Jeffery L. (Simi Valley CA), Gate array with bidirectional symmetry.
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  28. Testa James (Mountain View CA), High speed electrical signal interconnect structure.
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  30. Ellis Wayne F. (Jericho VT) Klink Erich (Schoenaich DEX) Najmann Knut (Gaertringen DEX), Input signal redriver for semiconductor modules.
  31. Adachi Takao (Tokyo JPX), Integrated circuit having wiring strips for propagating in-phase signals.
  32. Fortuna Jon A. (Mechanicsburg PA), Integrated circuit module connector assembly.
  33. Penzel Hans-Joerg (Wolfratshausen DEX), Integrated memory module having selectable operating functions.
  34. Kajimoto Takeshi (Tokyo JPX) Kobayashi Mitsuteru (Saitama JPX) Sato Katsuyuki (Tokyo JPX) Shimbo Yutaka (Tokyo JPX), Large-scale semiconductor integrated circuit device and method for relieving the faults thereof.
  35. Kawai Hideki (Nara JPX) Fujii Masaru (Takatsuki JPX) Ohta Kiyoto (Takatsuki JPX) Maeyama Yoshikazu (Kyoto JPX), Layout for stable high speed semiconductor memory device.
  36. Noschese Rocco J. (Wilton CT), Low insertion force circuit board connector assembly.
  37. Billman Timothy B. (King NC) McHugh Robert G. (Lewisville NC) Thrush Roger L. (Clemmons NC), Low insertion force circuit panel socket.
  38. Georgopulos ; Thomas, Low insertion force connector.
  39. Takeda Takashi (Tokyo JPX) Ushida Youichi (Tokyo JPX), Memory module.
  40. Neal Joseph H. (Missouri City TX) Poteet Kenneth A. (Houston TX), Memory module arranged for data and parity bits.
  41. Protigal Stanley N. (Boise ID) Chern Web-Foo (Boise ID) Parkinson Ward D. (Boise ID) Nevill Leland R. (Boise ID) Johnson Gary M. (Boise ID) Trent Thomas M. (Boise ID) Duesman Kevin G. (Boise ID), Memory module having on-chip surge capacitors.
  42. Walkup William B. (Barrington RI) D\Amico Richard J. (Cranston RI), Memory module socket.
  43. Bakke Patrick D. (Naperville IL) DiViesti Anthony M. (Park Ridge IL) Regnier Kent E. (Lombard IL) Yagi Masanori (Sagamihara JPX) Yamada Shoji (Adachi IL JPX) Walse Alan (LaGrange IL), Metal latch for SIMM socket.
  44. Bakke Patrick D. (Naperville IL) DiViesti Anthony M. (Park Ridge IL) Regnier Kent E. (Lombard IL) Yagi Masanori (Sagamihara JPX) Yamada Shoji (Adachi IL JPX) Walse Alan (LaGrange IL), Metal latch for SIMM socket.
  45. Davis ; Jr. Donald J. (Rocky Point NY) Insetta Victor (Jacksonville FL), Miniature monolithic ceramic coupler for electronic circuits.
  46. Windsor James A. (Tomball TX) Hamid Mustafa A. (Houston TX) Thoma Roy E. (Houston TX) Paschal James P. (Spring TX) Felcman Francis A. (Rosenberg TX), Modular computer memory circuit board.
  47. Ohno Kenichi (Tokyo JPX) Hosomizu Tohru (Yokohama JPX) Ogawa Rokutaro (Tokyo JPX), Multilevel masterslice LSI with second metal level programming.
  48. Hvezda Jaroslav M. (Nepean CAX) Velsher Benne (Ottawa CAX) Middlehurst Richard J. (Kanata CAX), Multiple contact connector having a low insertion force.
  49. Hamsher ; Jr. Wilbur A. (Carlisle PA) Weber Robert N. (Hummelstown PA), One piece zif connector.
  50. Wood Alan G. (Boise ID) Corbett Tim J. (Boise ID), Packaging for semiconductor logic devices.
  51. Anzelone Thomas A. (Ft. Lauderdale FL) Cheung Samuel T. (Boca Raton FL) Cohen Mark E. (Boca Raton FL) Cooke Kevin K. (Delray Beach FL) Dewitt John R. (Boca Raton FL) Miller Michael S. (Delray Beach F, Personal computer processor card interconnect system.
  52. Durkos Larry G. (Lebanon IN) Taylor Duaine O. (Carmel IN) Franklin Timothy E. (Zionsville IN), Portable computer.
  53. Robertson, John A., Printed circuit board edge connectors.
  54. DePaul Albert D. (413 W. 52nd St. New York NY 10019), Printed circuits.
  55. Hawkins George W. (Mesa AZ), Rail bonded multi-chip leadframe, method and package.
  56. Toshio Sugano (Kokubunji JPX) Seiichirou Tsukui (Komoro JPX) Shigeru Suzuki (Kokubunji JPX), Semiconductor device.
  57. Uemura Shunichi (Itami JPX) Murasawa Yashuhiro (Itami JPX), Semiconductor device.
  58. Arakawa Ryutaro (Ibaraki JPX) Fukutake Sunao (Ibaraki JPX), Semiconductor device and the manufacture thereof.
  59. Akasaki Hidehiko (Aizuwakamatsu JPX) Tsujimura Takehisa (Kawasaki JPX), Semiconductor device including leadless packages and a base plate for mounting the leadless packages.
  60. Sudo Toshio (Kawasaki JPX) Saito Kazutaka (Kawasaki JPX) Takubo Chiaki (Yokohama JPX), Semiconductor integrated circuit apparatus.
  61. Ohsawa Takashi (Kawasaki JPX), Semiconductor memory device.
  62. Sasaki Nobuo (Kawasaki JPX) Kobayashi Yasuo (Kawasaki JPX) Iwai Takashi (Kawasaki JPX) Nakano Motoo (Yokohama JPX), Semiconductor memory device.
  63. Takagi Yuichi (Kanagawa JPX), Semiconductor memory module.
  64. Kosugi Ryuichi (Hyogo JPX) Tabaru Tsugio (Hyogo JPX), Semiconductor pseudo memory module.
  65. Johnson Gary M. (Boise ID) Nevill Leland R. (Boise ID), Short-resistant decoupling capacitor system for semiconductor circuits.
  66. Clayton James E. (Londonderry NH), Signal in-line memory module.
  67. Bechtolsheim Andreas (Stanford CA) Frank Edward (Portola Valley CA) Testa James (Mountain View CA) Storm Shawn (Mt. View CA), Single in-line memory module.
  68. Bechtolsheim Andreas (Stanford CA) Frank Edward (Portola Valley CA) Testa James (Mountain View CA) Storm Shawn (Mt. View CA), Single in-line memory module.
  69. Bechtolsheim Andreas (Stanford CA) Frank Edward (Portola Valley CA) Testa James (Mountain View CA) Storm Shawn (Mt. View CA), Single in-line memory module.
  70. Clayton James E. (Londonderry NH), Single in-line memory module.
  71. Schmidt Robert W. (Stafford TX), Sixteen bit microcomputer memory boards for use with eight bit standard connector bus.
  72. Thrush Roger L. (Clemmons NC), Socket for single in-line memory module.
  73. Kane Milburn H. (Austin TX) Roby John G. (Cedar Park TX) Schrottke Gustav (Austin TX), Stacked DCA memory chips.
  74. Mueller Wolfgang R. (Wappingers Falls NY) Spencer ; II Gwynne W. (Poughkeepsie NY), Stacked double density memory module using industry standard memory chips.
  75. Shaffer James M. (Boise) Mauritz Karl H. (Boise) Atkins Glen (Boise ID), Stacked printed circuit board device.
  76. Quattrini Victor L. (Westford MA) Fisher Edwin P. (Abington MA), Surface mounted multilayer memory printed circuit board.
  77. Mauritz Karl H. (Eagle ID) Leger Geary L. (Boise ID) Wicklund Joseph B. (Bothell WA) Herrud James E. (Boise ID) Laney Steven H. (Boise ID), Switched memory module.
  78. Iwamatsu Seiichi (Suwa JPX), Thin film metal interconnects in integrated circuit structures to reduce circuit operation speed delay.
  79. Hong Gary (Hsinchu TWX), Ulsi mask ROM structure and method of manufacture.
  80. Henle Robert A. (Clinton Corners NY) Johnson Alfred H. (Poughkeepsie NY), Vertical semiconductor integrated circuit chip packaging.
  81. Anhalt John W. (Orange CA) Curley James H. (Costa Mesa CA), Zero force printed circuit board connector.
  82. Grabbe Dimitry (Middletown PA) Korsunsky Iosif (Harrisburg PA) Klunk Thomas M. (Dover PA) DiOrazio Joseph S. (Harrisburg PA), Zero insertion force connector having wiping action.

이 특허를 인용한 특허 (180) 인용/피인용 타임라인 분석

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