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Reduction of switching noise in high-speed circuit boards 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • H05K-009/00
출원번호 US-0697710 (1996-08-28)
발명자 / 주소
  • Kroger Harry
출원인 / 주소
  • The Research Foundation of State University of New York
대리인 / 주소
    Salzman & Levy
인용정보 피인용 횟수 : 38  인용 특허 : 3

초록

The present invention features a method of noise reduction in both packaging structures and circuit boards, as well as articles of manufacture that result from this method. Both the method and the articles weaken and effectively reduce undesirable noise signals that propagate as waves to and from th

대표청구항

[ What is claimed is:] [1.] An electronic and electrical circuit structure having reduced switching noise, delta-I noise, LdI/dt noise, and simultaneous switching noise, comprising:at least three conducting planes defining said electronic and electrical circuit structure; andnoise-absorbent, lossy m

이 특허에 인용된 특허 (3)

  1. Diaz Rodolfo E. (Phoenix AZ) Squires Mark C. (Phoenix AZ) Miller Michael C. (Chandler AZ), Anechoic chamber absorber and method.
  2. Brown Michael J. (Durham NC) Radzik Leon C. (Raleigh NC) Williams Jack D. (Raleigh NC) Pitts Oliver D. (Spring Hope NC), Circuit board EMI suppressor including a lossy dielectric layer.
  3. Fogle ; Jr. Homer W. (15 Green Valley Rd. Wallingford PA 19086-6050), Hermetically-sealed electrically-absorptive low-pass radio frequency filters and electro-magnetically lossy ceramic mate.

이 특허를 인용한 특허 (38)

  1. Welbon,Edward Hugh; Moore,Roy Stuart, Circuit board including isolated signal transmission channels.
  2. Reynov, Boris; Siddhaye, Shreeram; Penmetsa, Venkata; Cleveland, John; Rajan, Madhavi; Tran, John, Circuit boards defining regions for controlling a dielectric constant of a dielectric material.
  3. Stoneham, Edward B.; Gaudette, Thomas M., Circuit structure with multifunction circuit cover.
  4. Provencher, Daniel B.; Gailus, Mark W.; Manter, David; Sivarajan, Vysakh, Compliant shield for very high speed, high density electrical interconnection.
  5. Kirk, Brian; Si, Jason; Pham, Ba; Kocsis, Sam; Chan, David; Wang, Wonder; Tang, Bob; Li, Martin; Wu, Smith, Connector configurable for high performance.
  6. Cartier, Jr., Marc B.; Gailus, Mark W.; Sivarajan, Vysakh, Differential electrical connector with improved skew control.
  7. Paniagua, Jose Ricardo, Electrical connector with hybrid shield.
  8. Paniagua, Jose Ricardo, Electrical connector with hybrid shield.
  9. Asterland, Richard, Electronic circuit.
  10. Atkinson, Prescott B.; Gailus, Mark W.; Hanrahan, Mark G., High bandwidth connector.
  11. Atkinson, Prescott B.; Kirk, Brian; Gailus, Mark W.; Manter, David; Cohen, Thomas S., High frequency electrical connector.
  12. Atkinson, Prescott B.; Kirk, Brian; Gailus, Mark W.; Manter, David; Cohen, Thomas S., High frequency electrical connector.
  13. Atkinson, Prescott B.; Kirk, Brian; Gailus, Mark W.; Manter, David; Cohen, Thomas S., High frequency electrical connector.
  14. Milbrand, Jr., Donald W.; Atkinson, Prescott B.; Kirk, Brian, High performance cable connector.
  15. Cartier, Jr., Marc B.; Manter, David; Atkinson, Prescott B.; Stokoe, Philip T.; Cohen, Thomas S.; Gailus, Mark W., High performance connector contact structure.
  16. Kirk, Brian; Kasturi, Vijay, High performance, small form factor connector.
  17. Kirk, Brian; Kasturi, Vijay, High performance, small form factor connector with common mode impedance control.
  18. Chan,Benson; Lauffer,John M., High speed circuitized substrate with reduced thru-hole stub, method for fabrication and information handling system utilizing same.
  19. Cartier, Jr., Marc B.; Dunham, John Robert; Gailus, Mark W.; Girard, Jr., Donald A.; Manter, David; Pitten, Tom; Sivarajan, Vysakh; Snyder, Michael Joseph, High speed, high density electrical connector with shielded signal paths.
  20. Cartier, Jr., Marc B.; Dunham, John Robert; Gailus, Mark W.; Girard, Jr., Donald A.; Manter, David; Pitten, Tom; Sivarajan, Vysakh; Snyder, Michael Joseph, High speed, high density electrical connector with shielded signal paths.
  21. Cartier, Jr., Marc B.; Dunham, John Robert; Gailus, Mark W.; Girard, Jr., Donald A.; Manter, David; Pitten, Tom; Sivarajan, Vysakh; Snyder, Michael Joseph, High speed, high density electrical connector with shielded signal paths.
  22. Cohen, Thomas S., High-frequency electrical connector.
  23. Cartier, Jr., Marc B.; Gailus, Mark W.; Cohen, Thomas S.; Dunham, John Robert; Sivarajan, Vysakh, Housing for a high speed electrical connector.
  24. Hartke, David J; Dibene, II, Joseph T.; Derian, Edward J.; Broder, James M., Integrated power delivery and cooling system for high power microprocessors.
  25. Cartier, Jr., Marc B.; Manter, David; Atkinson, Prescott B.; Stokoe, Philip T.; Cohen, Thomas S.; Gailus, Mark W., Low cost, high performance RF connector.
  26. DiBene, II, Joseph Ted; Hartke, David H., Method and apparatus for providing power to a microprocessor with integrated thermal and EMI management.
  27. DiBene, II,Joseph T.; Hartke,David H.; Kaskade,James J. Hjerpe; Hoge,Carl E., Method and apparatus for providing power to a microprocessor with integrated thermal and EMI management.
  28. Underwood,Jeffrey A.; Arledge,John K.; Swirbel,Thomas J.; Barreto,Joaquin, Method for shielding printed circuit board circuits.
  29. Underwood,Jeffrey A.; Arledge,John K.; Swirbel,Thomas J.; Barreto,Joaquin, Methods for shielding one or more circuit of a printed circuit board.
  30. McNamara, David M.; Kirk, Brian, Mezzanine connector.
  31. DiBene, II,Joseph T.; Derian,Edward J., Micro-spring interconnect systems for low impedance high power applications.
  32. Park, Hark Byeong; Seol, Byong Su; Kim, Hyung Geun; Park, Hyun Ho; Lee, Jong Sung; Lee, Hyung Seok; Moon, Young Jun, Multilayer printed circuit board having electromagnetic wave reduction member.
  33. Lee, Sang-Kyung; Lee, Hee-Kyoung; Lee, Dong-Hwan; Lim, Kyung-Sang, Printed circuit board.
  34. Underwood, Jeffrey A.; Arledge, John K.; Swirbel, Thomas J.; Barreto, Joaquin, Printed circuit board arrangement.
  35. Hartke, David H.; DiBene, II, J. Ted, Right-angle power interconnect electronic packaging assembly.
  36. Derian, Edward J.; DiBene, II, Joseph Ted; Hartke, David H., Separable power delivery connector.
  37. Dibene, II, Joseph Ted; Hartke, David H.; Hoge, Carl E.; Derian, Edward J., System and method for processor power delivery and thermal management.
  38. Dibene, II, Joseph Ted; Hartke, David H.; Hoge, Carl E.; Derian, Edward J., Ultra-low impedance power interconnection system for electronic packages.
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