초록 ▼

A copper diffusion barrier is formed on the side walls of vias connected to copper conductors to prevent copper diffusion into inter-level dielectric. A thin film of copper diffusion barrier material is deposited on the wafer post via etch. A sputter etch is performed to remove barrier material from

A copper diffusion barrier is formed on the side walls of vias connected to copper conductors to prevent copper diffusion into inter-level dielectric. A thin film of copper diffusion barrier material is deposited on the wafer post via etch. A sputter etch is performed to remove barrier material from the base of via and to remove copper oxide from the copper conductor. The barrier material is not removed from the sidewall during the sputter etch. Thus, a barrier to re-deposited copper is formed on the via sidewalls to prevent copper poisoning of the dielectric.

대표청구항 ▼

[ Having thus described our invention, what we claim as new and desire to secure by Letters Patent is as follows:] [1.] A method of preventing copper poisoning while fabricating an integrated circuit structure, comprising the steps of:etching a via through a dielectric layer to a copper conductor po

[ Having thus described our invention, what we claim as new and desire to secure by Letters Patent is as follows:] [1.] A method of preventing copper poisoning while fabricating an integrated circuit structure, comprising the steps of:etching a via through a dielectric layer to a copper conductor positioned in a substrate;depositing a barrier material over said dielectric layer and into said via over said copper conductor, said barrier material covering sidewalls of said via, said barrier material being selected to prevent diffusion of copper therethrough;directionally etching said substrate to remove said barrier material from a top of said dielectric layer and a bottom region of said via and leave said barrier material on said sidewalls of said via, said copper conductor being etched during said directionally etching step; andfilling said via with a conductor.