초록 ▼

A ball grid array (BGA) package incorporating a heat dissipating member which includes a thin die attach portion mounted between an integrated circuit chip (die) and a package substrate, a heat sink portion surrounding the die attach portion, and tie bars connected between the die attach portion and

A ball grid array (BGA) package incorporating a heat dissipating member which includes a thin die attach portion mounted between an integrated circuit chip (die) and a package substrate, a heat sink portion surrounding the die attach portion, and tie bars connected between the die attach portion and the heat sink portion. The die attach portion is thinner than the heat sink portion such that a recessed area is formed for receiving an integrated circuit die. Heat generated by a die mounted on the die attach portion is transmitted to the heat sink portion along the tie bars, thereby providing enhanced thermal characteristics. Inductive effects on signals passing between the integrated circuit die and a host printed circuit board are reduced by connecting the heat dissipating member to a ground potential. A Faraday cage is formed around the integrated circuit die by mounting a metal plate on the upper peripheral surface of the heat sink portion.

대표청구항 ▼

[ We claim:] [1.] An electronic device comprising:an integral heat dissipating member including:a flat die attach portion having an upper surface and a lower surface, a distance between the upper and lower surfaces defining a first thickness, the die attach portion having an outer peripheral edge,a

[ We claim:] [1.] An electronic device comprising:an integral heat dissipating member including:a flat die attach portion having an upper surface and a lower surface, a distance between the upper and lower surfaces defining a first thickness, the die attach portion having an outer peripheral edge,a heat sink portion surrounding the die attach portion, the heat sink portion having an upper surface which is parallel to the upper surface of the die attach portion, the heat sink portion having a lower surface which is parallel to the lower surface of the die attach portion, a distance between the upper and lower surfaces of the heat sink portion defining a second thickness, the heat sink portion also having an inner peripheral edge,a plurality of rod-like thermal conductors directly coupling the outer peripheral edge of the die attach portion to the inner peripheral edge of the heat sink portion; andan integrated circuit die mounted on the die attach portion, the integrated circuit die having a third thickness;wherein the first thickness of the die attach portion is less than the second thickness of the heat sink portion;wherein the third thickness of the integrated circuit die is less than a difference between the first thickness and the second thickness,wherein the lower surface of the die attach portion is co-planar with the lower surface of the heat sink portion; andwherein the integrated circuit die is located entirely between a first plane defined by the upper surface of the heat sink portion and a second plane defined by the lower surfaces of the die attach portion and the heat sink portion.