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Rigid/flex printed circuit board using angled prepreg 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • H05K-001/00
  • B32B-003/00
출원번호 US-0865888 (1997-05-30)
발명자 / 주소
  • Caron A. Roland
  • Jean Sandra L.
  • Keating James E.
  • Larmouth Robert S.
  • Millette Lee J.
출원인 / 주소
  • TeledyneIndustries, Inc.
대리인 / 주소
    Hayes Soloway Hennessey Grossman & Hage PC
인용정보 피인용 횟수 : 26  인용 특허 : 19

초록

A rigid flex printed circuit board wherein the flex section of said board comprises a basestock composite with edges formed by laminating a conductive layer to a flexible insulator layer, the conductor layer containing at least one conductive pathway and the flexible insulator layer comprises fibers

대표청구항

[ We claim:] [1.] A rigid flex printed circuit board wherein the flex section of said board comprisesa basestock composite with edges, formed by laminating a conductive layer to a flexible insulator layer, said conductor layer containing at least one conductive pathway and said flexible insulator la

이 특허에 인용된 특허 (19)

  1. Harpell G. A. (Morris Township ; Morris County NJ) Li H. L. (Parsippany NJ) Kwon Y. D. (Mendhem NJ) Prevorsek D. C. (Morris Township ; Morris County NJ), Composite and article using short length fibers at oblique angles.
  2. Sabee Reinhardt N. (Appleton WI), Composite fabrics comprising continuous filaments locked in place by intermingled melt blown fibers and methods and appa.
  3. Barrell David (Temple City CA) Kennedy Donald E. (Baldwin Park CA) Marino ; Jr. James J. (Monrovia CA) Rollen Donald C. (Railto CA), Copper-clad polyester-glass fiber laminates using zinc-coated copper.
  4. Holtzman Kenneth A. (Clifton NJ), Devices employing flexible substrates and method for making same.
  5. Nishimura Akira (Otsu JPX) Maeda Kunio (Omihachiman JPX) Kito Kazuo (Kyoto JPX), Fiber material for reinforcing plastics.
  6. Jex Edward R. (475 Hickory Lane Berwyn PA 19312), Fiber reinforced resin composites, method of manufacture and improved composite products.
  7. Haas Daniel P. (Houston TX), Flexible printed circuits.
  8. Gsell Rainer (Weissensberg AZ DEX) White Philip (Chandler AZ), Gripper rod for shuttleless looms and method for making the gripper rod.
  9. Spielau, Paul; Fassbender, Helmut; Weiss, Richard, Laminate based on epoxy resin for printed circuits.
  10. Miyadera Yasuo (Shimodate JPX) Fujioka Atsushi (Shimodate JPX) Kumazawa Tetsuo (Ibaraki JPX) Doi Hiroaki (Ibaraki JPX), Laminates comprising prepregs metal clad.
  11. Barton Robert W. (Cottage Grove MN) Groff Gaylord L. (North St. Paul MN), Metal-clad dielectric sheeting.
  12. Medwin Steven J. (Wilmington DE), Method for shaping fiber reinforced resin matrix materials.
  13. Lucas Gregory L. (Newark CA) Bryan Scott K. (San Jose CA), Method of making rigid-flex printed circuit boards.
  14. Doane ; Jr. Howard (Amesbury MA) Covino Alfred F. (Hudson NH) Waite John M. (Derry NH), Method of manufacturing a rigid flex printed circuit board.
  15. Dixon Herbert S. (Derry NH) Weller Jonathan W. (Amherst NH) Boyer Ivon (Merrimack NH) McKenney Darryl J. (Milford NH), Multilayer combined rigid and flex printed circuits.
  16. Peters Thomas E. (Boise ID) Logan James D. (Pullman WA) Bennett Eugene R. (Boise ID) Dieter Clarence L. (Boise ID) Henckel David J. (Boise ID), Oriented chopped fiber mats and method and apparatus for making same.
  17. Desai Jay (Corona CA), Rigid flex printed circuit configuration.
  18. Isayev Avraam (Akron OH), Self reinforced thermoplastic composite laminate.
  19. Palmer Raymond J. (Newport Beach CA) Micheaux Dominique (Villette d\Anthon FRX), Woven material and layered assembly thereof.

이 특허를 인용한 특허 (26)

  1. Hayashi, Katsura; Tsukada, Yutaka; Yamanaka, Kimihiro; Shirai, Masaharu; Kirikihira, Isamu, Circuit board and mounting structure.
  2. Martinez, Juan Jose Montiel; Cruz, Guillermo Armando Martinez; Ruiz, Mario Lopez, Driving board folding machine and method of using a driving board folding machine to fold a flexible circuit.
  3. Bergman, Mark; Vrtis, Joan K., Flexible circuit board and method of fabricating.
  4. Yasushi Watanabe JP; Kenichi Shinano JP, Flexible multilayer wiring board.
  5. Tsukada, Kiyotaka; Ninomaru, Terumasa; Kizaki, Masaki, Flexible printed wiring board.
  6. Tsukada,Kiyotaka; Ninomaru,Terumasa; Kizaki,Masaki, Flexible printed wiring board.
  7. Tanaka,Takashi; Nakajima,Hidenori; Tokuda,Yuichi, Hinge board and method for producing the same.
  8. Frater, Mark S., Laminated entry and exit material for drilling printed circuit boards.
  9. Alger, William O.; Long, Gary B.; Brist, Gary A.; Horine, Bryce D., Method of making a fiber reinforced printed circuit board panel and a fiber reinforced panel made according to the method.
  10. McCall, James A.; Shykind, David, Method of manufacturing a circuit board.
  11. McCall, James A.; Shykind, David, Method of manufacturing a circuit board.
  12. Shykind, David N.; McCall, James A., Method of manufacturing a circuit board.
  13. Farrell, Brian; Nguyen, Patricia Wilson; Teverovsky, Justyna; Slade, Jeremiah; Powell, Mara, Method of manufacturing a fabric article to include electronic circuitry and an electrically active textile article.
  14. Ai, Bing; Hu, Biao, PCB board, core for manufacturing the PCB board and method for manufacturing the PCB board.
  15. Ting, Joseph; Farrell, Brian; Bowman, Jeremy, Physiological monitoring garment.
  16. DeRemer, Matthew J.; Streeter, Richard B.; Mielcarz, Craig D.; Lewis, Gordon S.; McDonald, David, Physiological status monitoring system.
  17. McDonald, David; Mielcarz, Craig D.; Nikiforenko, Sergey; Gambetta, Vernon A., Physiological status monitoring system.
  18. Ahn Jung-Hyun,KRX ; Lee Jong-Hyun,KRX, Printed circuit board.
  19. Yoshimura, Hideaki; Iida, Kenji; Maehara, Yasutomo, Printed circuit board incorporating fibers.
  20. Streeter, Richard B., Respiration sensing system.
  21. Vrtis, Joan K.; Glickman, Michael James; Bergman, Mark; Shang, Shurui, Rigid to flexible PC transition.
  22. Hsieh, George; Dishongh, Terrance J.; Dixon, Scott, Selective PCB stiffening with preferentially oriented fibers.
  23. Hsieh,George; Dishongh,Terrance J.; Dixon,Scott, Selective PCB stiffening with preferentially oriented fibers.
  24. Mark S. Frater, Separator sheet laminate for use in the manufacture of printed circuit boards.
  25. Bergman, Mark; Glickman, Michael James, Stress relief for rigid components on flexible circuits.
  26. Wilson, Patricia; Teverovsky, Justyna; Farrell, Brian; Horowitz, Wendy B.; Winterhalter, Carole A.; Covel, Richard A.; Tierney, Edward Joseph, Wearable transmission device.
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