이 특허에 인용된 특허 (6) 인용/피인용 타임라인 분석

1. Hansen Keith J. (San Jose CA), Apparatus for performing in-situ etch of CVD chamber.

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2. Fujimura Shuzo (Tokyo JPX) Mihara Satoru (Kawasaki JPX) Kisa Toshimasa (Kawasaki JPX) Motoki Yasunari (Kawasaki JPX), Downstream microwave plasma processing apparatus having an improved coupling structure between microwave plasma.

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3. Moslehi Mehrdad M. (Dallas TX), Low-temperature in-situ dry cleaning process for semiconductor wafers.

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4. Pedder David J. (Warks) Wort Christopher J. (Northants) Pickering Kim L. (Northampton GBX), Metal surface cleaning processes.

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5. Ogawa Toshiaki (Hyogo JPX) Morita Hiroshi (Hyogo JPX) Ishida Tomoaki (Hyogo JPX) Kawai Kenji (Hyogo JPX) Akazawa Moriaki (Hyogo JPX), Method of treating semiconductor substrate surface and method of manufacturing semiconductor device including such treat.

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6. Fujimura Shuzo (Tokyo JPX) Shinagawa Keisuke (Kawasaki JPX) Hikazutani Kenichi (Kuwana JPX), Processing for stripping organic material.

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이 특허를 인용한 특허 (16) 인용/피인용 타임라인 분석

1. Sneh, Ofer, ALD method and apparatus.

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2. Sneh,Ofer, ALD method and apparatus.

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3. Abadeer Wagdi W. ; Cartier Eduard A. ; Stathis James H., Apparatus and method for non-contact stress evaluation of wafer gate dielectric reliability.

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4. Wood, Bingxi Sun; Kawaguchi, Mark N.; Papanu, James S.; Mosely, Roderick C.; Lai, Chiukun Steven; Kao, Chien Teh; Ai, Hua; Wang, Wei W., Cleaning of native oxide with hydrogen-containing radicals.

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5. Hosch, Jimmy W.; Goeckner, Matthew J.; Whelan, Mike; Kueny, Andrew Weeks; Harvey, Kenneth C.; Thamban, P.L. Stephan, Electron beam exciter for use in chemical analysis in processing systems.

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6. Weimer, Ronald A.; Hu, Yongjun Jeff; Pan, Pai Hung; Ratakonda, Deepa; Beck, James; Thakur, Randhir P. S., Forming a conductive structure in a semiconductor device.

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7. Umemoto, Hironobu; Masuda, Atsushi; Yoneyama, Koji; Ishibashi, Keiji; Ikemoto, Manabu, Hydrogen atom generation source in vacuum treatment apparatus, and hydrogen atom transportation method.

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8. Shepherd, Jr.,Robert A.; Caughran,James, Method and apparatus for plasma optimization in water processing.

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9. Sneh, Ofer, Method and apparatus for providing and integrating a general metal delivery source (GMDS) with atomic layer deposition (ALD).

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10. Freriks,Johannes Maria; Banine,Vadim Yevgenyevich; Ivanov,Vladimir Vitalevitch, Method for cleaning a lithographic apparatus module, a cleaning arrangement and a lithographic apparatus comprising the cleaning arrangement.

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11. Freriks,Johannes Maria; Banine,Vadim Yevgenyevich; Ivanov,Vladimir Vitalevitch; Klunder,Derk Jan Wilfred; Van Herpen,Maarten Marinus Johannes Wilhelmus, Method for cleaning a lithographic apparatus module, a cleaning arrangement and a lithographic apparatus comprising the cleaning arrangement.

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12. Abadeer, Wagdi W.; Cartier, Eduard A.; Stathis, James H., Method for non-contact stress evaluation of wafer gate dielectric reliability.

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13. Kawaguchi,Mark N.; Nguyen,Huong T.; Bekiaris,Nikolaos; Papanu,James S., Method of photoresist removal in the presence of a dielectric layer having a low k-value.

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14. Savas,Stephen E.; Helle,Wolfgang, System and method for removal of photoresist and residues following contact etch with a stop layer present.

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15. Savas, Stephen E.; Xu, Songlin; Dutton, David; Kadavanich, Andreas; George, Rene, System and method for removal of photoresist in transistor fabrication for integrated circuit manufacturing.

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16. Yu Mo-Chiun,TWX ; Jang Syun-Ming,TWX, Using high temperature H2 anneal to recrystallize S/D and remove native oxide simultaneously.

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