초록 ▼

A three-dimensional inductor coil is fabricated on top of a semiconductor substrate. The fabrication process includes the steps of depositing a first photoresist layer (406), forming a trench therein, and filling the trench with electroplated metal (404). A second photoresist layer (408) is deposite

A three-dimensional inductor coil is fabricated on top of a semiconductor substrate. The fabrication process includes the steps of depositing a first photoresist layer (406), forming a trench therein, and filling the trench with electroplated metal (404). A second photoresist layer (408) is deposited, and first and second trenches (410) are formed therein and filled with electroplated metal (412). A third photoresist layer (416) is deposited and a trench (418) formed therein, and then filled with electroplated metal (420). The first, second, and third photoresist layers (406, 408, 416) are then removed to expose a multi-loop inductor coil (500, 550).

대표청구항 ▼

[ What is claimed is:] [1.] A method of forming an integrated multi-turn inductor coil, comprising the steps of:providing a semiconductor substrate;forming the bottoms of the turns by:depositing, over the semiconductor substrate, a first photoresist layer and forming a trench therein;filling the tre

[ What is claimed is:] [1.] A method of forming an integrated multi-turn inductor coil, comprising the steps of:providing a semiconductor substrate;forming the bottoms of the turns by:depositing, over the semiconductor substrate, a first photoresist layer and forming a trench therein;filling the trench with electroplated metal, the first photoresist layer and electroplated trench forming a first layer;forming the sides of the turns by:depositing, over the first layer, a second photoresist layer and forming first and second trenches therein;filling the first and second trenches with electroplated metal, the second photoresist layer and first and second electroplated trenches forming a second layer;forming the tops of the turns by:depositing, over the second layer, a third photoresist layer and forming a trench therein;filling the trench of the third photoresist layer with electroplated metal; andremoving the first, second, and third photoresist layers to expose a three-dimensional multi-turn inductor coil.