초록 ▼

The present invention is directed to an electronic component assembly which cost effectively eliminates capacitive coupling while providing significant heat transfer. Exemplary embodiments ensure that the circuit ground of electrical circuits on printed wiring boards and the chassis ground remain se

The present invention is directed to an electronic component assembly which cost effectively eliminates capacitive coupling while providing significant heat transfer. Exemplary embodiments ensure that the circuit ground of electrical circuits on printed wiring boards and the chassis ground remain separate so that undesired ground loops are not created and so that a Faraday shield or "cage" can be established around all circuit elements to reduce EMI effects on the circuit.

대표청구항 ▼

[ What is claimed is:] [1.] An electronic component assembly comprising:at least one electrical circuit having a first ground; anda heat sink assembly connected to said electrical circuit, said heat sink assembly further comprising;an inner core;a dielectric material that covers at least a portion o

[ What is claimed is:] [1.] An electronic component assembly comprising:at least one electrical circuit having a first ground; anda heat sink assembly connected to said electrical circuit, said heat sink assembly further comprising;an inner core;a dielectric material that covers at least a portion of said inner core; anda conductive material having a second ground, formed on a conductive foil located on at least a portion of said dielectric material, said conductive material surrounding the periphery of said at least one electrical circuit for electromagnetically shielding said at least one electrical circuit.