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Heat exchange apparatus 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • F28F-007/00
출원번호 US-0080915 (1998-05-18)
발명자 / 주소
  • Batchelder John Samuel
인용정보 피인용 횟수 : 178  인용 특허 : 9

초록

An apparatus to transfer heat from a heat source to a heat absorber, the apparatus consisting of an active thermal spreader plate with internal flow channels, a recirculating heat transfer fluid, and a means to impel the heat transfer fluid using an external moving magnetic field. In the most prefer

대표청구항

[ The invention claimed is:] [32.] An apparatus for transferring heat from a heat producing component to the atmosphere, comprising:a) a composite substrate containing a closed interior channel for circulating a thermal transfer fluid, the composite substrate having a first and a second surface, the

이 특허에 인용된 특허 (9)

  1. Novotny Shlomo D. (Wayland MA), Closed-cycle expansion-valve impingement cooling system.
  2. Cheon Kioan, Cooling system for computer.
  3. Reichard Jeffrey A. (Menomonee Falls WI), Heat sink for electrical circuit components.
  4. Koizumi Hisao (Zushi JPX), Heat transfer apparatus.
  5. Budelman Gerald A. (Aloha OR), High efficiency heat removal system for electric devices and the like.
  6. Iversen Arthur H. (Saratoga CA), Multi-chip module cooling.
  7. Hamilton Robin E. ; Kennedy Paul G. ; Vale Christopher R., Non-mechanical magnetic pump for liquid cooling.
  8. Yamada Yasuo (Nagaokakyo JPX) Fujimoto Katsumi (Nagaokakyo JPX) Inoue Jiro (Nagaokakyo JPX), Piezoelectric fan.
  9. Wiech ; Jr. Raymond E. (San Diego CA), Substrate cooling.

이 특허를 인용한 특허 (178)

  1. Sanjay K. Roy, Active cold plate/heat sink.
  2. Hanson, George E., Active heat sink.
  3. Lower, Nathan P.; Boone, Alan P.; Wilcoxon, Ross K., Adhesive applications using alkali silicate glass for electronics.
  4. Caldwell, Barry, Adhesive pad having EMC shielding characteristics.
  5. Catalano, Anthony, Advanced cooling method and device for LED lighting.
  6. Catalano, Anthony, Advanced cooling method and device for LED lighting.
  7. Pal, Debabrata, Air cooled motor controllers.
  8. Lower, Nathan P.; Boone, Alan P.; Wilcoxon, Ross K.; Hillman, David D., Alkali silicate glass based coating and method for applying.
  9. Lower, Nathan P.; Boone, Alan P.; Wilcoxon, Ross K.; Hillman, David D., Alkali silicate glass based coating and method for applying.
  10. Sampica, James D.; Barnidge, Tracy J.; Tchon, Joseph L.; Lower, Nathan P.; Wilcoxon, Ross K.; Dudley, Sandra S., Alkali silicate glass for displays.
  11. Lower, Nathan P.; Nemeth, Paul R.; Wilcoxon, Ross K., Antiglare treatment for glass.
  12. Brewer,Richard Grant; Upadhya,Girish; Zhou,Peng; McMaster,Mark; Tsao,Paul, Apparatus and method of efficient fluid delivery for cooling a heat producing device.
  13. Kenny,Thomas; McMaster,Mark; Lovette,James, Apparatus and method of forming channels in a heat-exchanging device.
  14. Chang, Neng Chao, Apparatus of water-cooled heat sink.
  15. Datta, Madhav; McMaster, Mark, Bonded metal and ceramic plates for thermal management of optical and electronic devices.
  16. Hoover,David S.; Petkie,Ronald R., CVD diamond enhanced microprocessor cooling system.
  17. Wu, Chun-Ming, Condensing device and thermal module using same.
  18. Lopatinsky,Edward L.; Schaefer,Dan K.; Rosenfeld,Saveliy T.; Fedoseyev,Lev A., Cooler for electronic devices.
  19. Campbell,Levi A.; Chu,Richard C.; Ellsworth, Jr.,Michael J.; Iyengar,Madhusudan K.; Schmidt,Roger R.; Simons,Robert E., Cooling apparatus and method for an electronics module employing an integrated heat exchange assembly.
  20. Campbell,Levi A.; Chu,Richard C.; Ellsworth, Jr.,Michael J.; Iyengar,Madhusudan K.; Schmidt,Roger R.; Simons,Robert E., Cooling apparatus for an electronics subsystem employing a coolant flow drive apparatus between coolant flow paths.
  21. Campbell,Levi A.; Chu,Richard C.; Ellsworth, Jr.,Michael J.; Iyengar,Madhusudan K.; Schmidt,Roger R.; Simons,Robert E.; Singh,Prabjit, Cooling apparatus, cooled electronic module, and methods of fabrication thereof employing thermally conductive, wire-bonded pin fins.
  22. Campbell, Levi A.; Chu, Richard C.; Ellsworth, Jr., Michael J.; Iyengar, Madhusudan K.; Schmidt, Roger R.; Simons, Robert E., Cooling apparatuses with discrete cold plates compliantly coupled between a common manifold and electronics components of an assembly to be cooled.
  23. Hong,Alex; Masaharu,Miyahara, Cooling device.
  24. Koga,Shinya; Goto,Nobuyuki; Anami,Tetsuya; Matsuda,Toshihiko, Cooling device.
  25. Yoshikawa, Minoru, Cooling device.
  26. Koga,Shinya; Matsuda,Toshihiko; Niwatsukino,Kyo; Sakai,Toshisuke; Kubota,Toshiyuki; Hirose,Masashi; Narakino,Shigeru; Aizono,Yoshimitsu; Kasahara,Kazuyuki, Cooling device and an electronic apparatus including the same.
  27. Niwatsukino, Kyo; Hirose, Masashi; Narakino, Shigeru; Aizono, Yoshimitsu; Kasahara, Kazuyuki; Koga, Shinya; Sakai, Toshisuke; Kubota, Toshiyuki, Cooling device and an electronic apparatus including the same.
  28. Koga, Shinya; Sakai, Toshisuke; Niwatsukino, Kyou; Kubota, Toshiyuki, Cooling device and centrifugal pump to be used in the same device.
  29. Mikubo,Kazuyuki; Kitajo,Sakae; Sasaki,Yasuhiro; Ochi,Atsushi; Yamamoto,Mitsuru, Cooling device for electronic apparatus.
  30. Kobayashi,Shinichi, Cooling device of electronic device.
  31. Wei,Jie; Suzuki,Masahiro, Cooling module.
  32. Campbell, Levi A.; Chu, Richard C.; Ellsworth, Jr., Michael J.; Iyengar, Madhusudan K.; Schmidt, Roger R.; Simons, Robert E., Cooling system and method employing a closed loop coolant path and micro-scaled cooling structure within an electronics subsystem of an electronics rack.
  33. Eriksen, André Sloth, Cooling system for a computer system.
  34. Eriksen, André Sloth, Cooling system for a computer system.
  35. Eriksen, André Sloth, Cooling system for a computer system.
  36. Eriksen, André Sloth, Cooling system for a computer system.
  37. Eriksen, André Sloth, Cooling system for a computer system.
  38. Eriksen, André Sloth, Cooling system for a computer system.
  39. Eriksen, André Sloth, Cooling system for a computer system.
  40. Ali,Ihab, Cooling system with integrated passive and active components.
  41. Kenny, Thomas W.; Munch, Mark; Zhou, Peng; Shook, James Gill; Goodson, Kenneth; Corbin, Dave; McMaster, Mark; Lovette, James, Cooling systems incorporating heat exchangers and thermoelectric layers.
  42. Ouyang, Chien, Cooling technique using a heat sink containing swirling magneto-hydrodynamic fluid.
  43. Furuya, Keizo, Cooling unit for cooling heat generating component, circuit module including the cooling unit, and electronic apparatus mounted with the circuit module.
  44. Correa, Adrian; Lin, Tien Chih (Eric); Hom, James; Shiomoto, Gregory; Chow, Norman; Leong, Brandon; Brewer, Richard Grant; Werner, Douglas E.; McMaster, Mark, Device and methodology for the removal of heat from an equipment rack by means of heat exchangers mounted to a door.
  45. Correa, Adrian; Lin, Tien-Chieh (Eric); Hom, James; Shiomoto, Gregory; Chow, Norman; Leong, Brandon; Brewer, Richard Grant; Werner, Douglas E.; McMaster, Mark, Device and methodology for the removal of heat from an equipment rack by means of heat exchangers mounted to a door.
  46. Laing, Oliver, Device for the local cooling or heating of an object.
  47. Holahan, Maurice F.; Kline, Eric V.; Krystek, Paul N.; Rasmussen, Michael R.; Sinha, Arvind K.; Zins, Stephen M., Dual magnetically coupled rotor heat exchanger.
  48. Take,Koichiro, Ebullition cooling device for heat generating component.
  49. Rice,Bryan J., Electrode in a discharge produced plasma extreme ultraviolet source.
  50. Goodson, Kenneth E.; Chen, Chuan-Hua; Huber, David E.; Jiang, Linan; Kenny, Thomas W.; Koo, Jae-Mo; Laser, Daniel J.; Mikkelsen, James C.; Santiago, Juan G.; Wang, Evelyn Ning-Yi; Zeng, Shulin; Zhang, Electroosmotic microchannel cooling system.
  51. Goodson,Kenneth E.; Chen,Chuan Hua; Huber,David E.; Jiang,Linan; Kenny,Thomas W.; Koo,Jae Mo; Laser,Daniel J.; Mikkelsen,James C.; Santiago,Juan G.; Wang,Evelyn Ning Yi; Zeng,Shulin; Zhang,Lian, Electroosmotic microchannel cooling system.
  52. Goodson,Kenneth E.; Chen,Chuan Hua; Huber,David E.; Jiang,Linan; Kenny,Thomas W.; Koo,Jae Mo; Laser,Daniel J.; Mikkelsen,James C.; Santiago,Juan G.; Wang,Evelyn Ning Yi; Zeng,Shulin; Zhang,Lian, Electroosmotic microchannel cooling system.
  53. Goodson,Kenneth E.; Chen,Chuan Hua; Huber,David E.; Jiang,Linan; Kenny,Thomas W.; Koo,Jae Mo; Laser,Daniel J.; Mikkelsen,James C.; Santiago,Juan G.; Wang,Evelyn Ning Yi; Zeng,Shulin; Zhang,Lian, Electroosmotic microchannel cooling system.
  54. Ouyang, Chien, Enhanced heat pipe cooling with MHD fluid flow.
  55. Lower, Nathan P.; Wilcoxon, Ross K.; Wooldridge, James R.; Dlouhy, David W., Fabrication process for a flexible, thin thermal spreader.
  56. Hwang, Jer-Sheng; Chang, Teng-Kai, Finned cooling heat exchanger module with concave circular vortex generating area.
  57. Belady,Christian L., Fluid cooled integrated circuit module.
  58. Lyon, Geoff Sean, Fluid heat exchange systems.
  59. Lyon, Geoff Sean, Fluid heat exchange systems.
  60. Lyon, Geoff Sean, Fluid heat exchange systems.
  61. Lyon, Geoff Sean, Fluid heat exchanger configured to provide a split flow.
  62. Lyon, Geoff Sean, Fluid heat exchanger configured to provide a split flow.
  63. Munch, Mark; Werner, Douglas E., Gimballed attachment for multiple heat exchangers.
  64. Lower, Nathan P.; Wilcoxon, Ross K.; Boone, Alan P.; Wyckoff, Nathaniel P.; Hamilton, Brandon C., Glass thick film embedded passive material.
  65. Lower, Nathan P.; Wilcoxon, Ross K.; Boone, Alan P.; Wyckoff, Nathaniel P.; Hamilton, Brandon C., Glass thick film embedded passive material.
  66. Tien-Lai Wang TW, Heat dissipater for a central processing unit.
  67. Tsai, Mei-Nan; Tsai, Cheng-Lung, Heat dissipating device.
  68. Tsai, Chang-han; Tsai, Shui-Fa, Heat dissipating module, heat dissipating system and circuit module.
  69. Luo, Chin-Kuang; Kuo, Chin-Liang, Heat pipe having an elastic sealing member.
  70. Okamoto, Tomomi; Yamada, Hiroshi, Heat sink and electronic apparatus provided with heat sink.
  71. Gilliland, Don Alan; Holahan, Maurice Francis; Huettner, Cary Michael, Heat sink apparatus with extendable pin fins.
  72. Chen, Yun Lung, Heat sink assembly with fan-driven fluid circulation.
  73. Williams,Vernon M.; Street,Bret K., Heat sinks including nonlinear passageways.
  74. Zuo, Jon, Heat spreader with oscillating flow.
  75. Yang, Tai-Her, Heat-dissipating structure having suspended external tube and internally recycling heat transfer fluid and application apparatus.
  76. Chou,Chia Min; Tseng,Hsiang Chieh, Heat-dissipating structure with air-guiding device.
  77. Gektin, Vadim; Novotny, Shlomo; Vogel, Marlin R., Heatsink with active liquid base.
  78. Bhatti,Mohinder Singh; Reyzin,Ilya; Joshi,Shrikant Mukund, High performance thermosiphon with internally enhanced condensation.
  79. Li, Zhihua; Dhavaleswarapu, Hemanth K.; Petrini, Joseph B.; Devasenathipathy, Shankar; Roach, Steven B.; Sauciuc, Ioan; Desai, Pranav K.; Kostiew, George S.; Saha, Sanjoy K., High performance transient uniform cooling solution for thermal compression bonding process.
  80. Zoodsma,Randy J., Hybrid heat sink performance enhancement using recirculating fluid.
  81. Zoodsma, Randy J., Hybrid heat sink with recirculating fluid and interleaving fins.
  82. Roy,Sanjay K., Impeller driven active heat sink.
  83. Malone, Christopher G.; Vinson, Wade, Impingement cooling of components in an electronic system.
  84. Morris, Terrel L.; Belady, Christian L, Integrated EMI containment and spray cooling module utilizing a magnetically coupled pump.
  85. Chen Shiaw-Jong S. ; Hooey Roger J. ; Radke Robert E., Integrated active cooling device for board mounted electric components.
  86. Lower, Nathan P.; Wilcoxon, Ross K.; Boone, Alan P., Integrated circuit protection and ruggedization coatings and methods.
  87. Lower, Nathan P.; Wilcoxon, Ross K.; Boone, Alan P., Integrated circuit protection and ruggedization coatings and methods.
  88. Lower, Nathan P.; Boone, Alan P.; Wilcoxon, Ross K., Integrated circuit tampering protection and reverse engineering prevention coatings and methods.
  89. Rollins, Patrick; Lucas, George, Integrated fan drive system for air-cooled heat exchangers (ACHE).
  90. Rollins, Patrick; Lucas, George, Integrated fan drive system for cooling tower.
  91. Wu, Bo Jiu; Zhang, Jia Ju; Wu, Zhong Ming, Integrated fluid cooling system for electronic components.
  92. Yeh,Yun Yu; Tung,Chia Ming; Lin,Chien Kai, Integrated heat dissipating assembly.
  93. Khanna,Vijayeshwar D.; Lohia,Alok K.; McVicker,Gerard; Sri Jayantha,Sri M., Integrated heat spreader and exchanger.
  94. Symons,Robert S., Integrated liquid cooling device for electronic components.
  95. Symons,Robert S., Integrated liquid cooling device with immersed electronic components.
  96. Liu,Tay Jian; Tung,Chao Nien; Hou,Chuen Shu, Integrated liquid cooling system.
  97. Lee,Hsieh Kun; Lai,Cheng Tien; Zhou,Shi Wen, Integrated liquid cooling system for electrical components.
  98. Lee,Hsieh Kun; Lai,Cheng Tien; Zhou,Zhi Yong, Integrated liquid cooling system for electrical components.
  99. Lee,Hsieh Kun; Lai,Cheng tien; Zhou,Shi Wen, Integrated liquid cooling system for electronic components.
  100. Liu,Tay Jian; Yang,Chih Hao; Tung,Chao Nien; Hou,Chuen Shu, Integrated liquid cooling system for electronic components.
  101. Hom, James; Upadhya, Girish; Werner, Douglas E.; Munch, Mark; Tsao, Paul; Conway, Bruce; Zhou, Peng; Brewer, Richard, Integrated liquid to air conduction module.
  102. Upadhya,Girish; Kenny,Thomas W.; Zhou,Peng; Munch,Mark; Shook,James Gill; Goodson,Kenneth; Corbin,David, Interwoven manifolds for pressure drop reduction in microchannel heat exchangers.
  103. Hu,Jen Lu; Lin,Hao Hui; Sun,Tsung Ching, Liquid cooled heat sink.
  104. Lee,Hsieh Kun; Lai,Cheng Tien; Zhou,Zhi Yong; Wen,Jiang Jian, Liquid cooling device.
  105. Chow, Norman; Tsao, Paul; Werner, Douglas E.; McMaster, Mark; Upadhya, Girish; Landry, Frederic; Spearing, Ian; Schrader, Tim, Liquid cooling loops for server applications.
  106. Upadhya, Girish; Munch, Mark; Chow, Norman; Tsao, Paul; Werner, Douglas E.; McMaster, Mark; Landry, Frederic; Spearing, Ian; Schrader, Tim, Liquid cooling loops for server applications.
  107. Mou, Hao Jan; Hsueh, Ta Wei; Chang, Ying Lun; Yu, Rong Ho; Chen, Shih Chang, Liquid heat-dissipating module.
  108. Huang,Jung Fong; Huang,Chih Chien, Liquid-cooled heat radiator kit.
  109. Duan,Qiang Fei; Lo,Lieh Feng, Liquid-cooling heat dissipation apparatus.
  110. Dede, Ercan Mehmet; Lee, Jaewook; Nomura, Tsuyoshi, Magnetic fluid cooling devices and power electronics assemblies.
  111. Tillotson,Brian J., Magnetically enhanced convection heat sink.
  112. Lyon, Geoff Sean; Holden, Mike; Gierl, Brydon, Manifolded heat exchangers and related systems.
  113. Wilcoxon, Ross K.; Lower, Nathan P.; Wooldridge, James R.; Dlouhy, David W.; Strzelczyk, Anthony J., Mechanically compliant thermal spreader with an embedded cooling loop for containing and circulating electrically-conductive liquid.
  114. Goodson,Kenneth; Kenny,Thomas; Zhou,Peng; Upadhya,Girish; Munch,Mark; McMaster,Mark; Horn,James, Method and apparatus for achieving temperature uniformity and hot spot cooling in a heat producing device.
  115. Wilkinson, David; Botticelli, Peter; Drumm, Donald; Landino, Darren; Zenowich, Brian; Townsend, William, Method and apparatus for connecting an ultracompact, high-performance motor controller to an ultracompact, high-performance brushless DC motor.
  116. Upadhya,Girish; Brewer,Richard Grant; McMaster,Mark, Method and apparatus for controlling freezing nucleation and propagation.
  117. Ali, Ihab, Method and apparatus for dissipating heat in a computer system.
  118. Kenny,Thomas W.; Munch,Mark; Zhou,Peng; Shook,James Gill; Upadhya,Girish; Goodson,Kenneth; Corbin,Dave; McMaster,Mark; Lovette,James, Method and apparatus for efficient vertical fluid delivery for cooling a heat producing device.
  119. Kenny,Thomas W.; Munch,Mark; Zhou,Peng; Shook,James Gill; Upadhya,Girish; Goodson,Kenneth; Corbin,David, Method and apparatus for flexible fluid delivery for cooling desired hot spots in a heat producing device.
  120. Tsao, Pei Haw; Pan, Hsin Yu, Method and apparatus for increasing heat dissipation of high performance integrated circuits (IC).
  121. Boone, Alan P.; Lower, Nathan P.; Wilcoxon, Ross K., Method for providing near-hermetically coated integrated circuit assemblies.
  122. Boone, Alan P.; Lower, Nathan P.; Wilcoxon, Ross K., Method for providing near-hermetically coated integrated circuit assemblies.
  123. Wilcoxon, Ross K.; Lower, Nathan P.; Boone, Alan P., Method for providing near-hermetically coated, thermally protected integrated circuit assemblies.
  124. Datta, Madhav; McMaster, Mark; Brewer, Rick; Zhou, Peng; Tsao, Paul; Upadhaya, Girish; Munch, Mark, Method of fabricating high surface to volume ratio structures and their integration in microheat exchangers for liquid cooling system.
  125. Lower, Nathan P.; Brower, David M.; Wilcoxon, Ross K., Method of reinforcing a hermetic seal of a module.
  126. Brewer, Richard Grant; Chow, Norman; Hom, James, Methodology of cooling multiple heat sources in a personal computer through the use of multiple fluid-based heat exchanging loops coupled via modular bus-type heat exchangers.
  127. Chou,Der Jeou; Nelson,Daniel Todd, Methods and apparatus for an integrated fan pump cooling module.
  128. Corbin,David; Goodson,Kenneth; Kenny,Thomas; Santiago,Juan; Zeng,Shulin, Micro-fabricated electrokinetic pump.
  129. Wong,Shwin Chung, Microchannel flat-plate heat pipe with parallel grooves for recycling coolant.
  130. Wong,Shwin Chung, Microchannel heat pipe with parallel grooves for recycling coolant.
  131. Datta, Madhav; Leong, Brandon; McMaster, Mark, Microheat exchanger for laser diode cooling.
  132. Farrow, Timothy Samuel; June, Michael Sean; Makley, Albert Vincent, Minimal fluid forced convective heat sink for high power computers.
  133. Lyon, Geoff Sean; Holden, Mike; Gierl, Brydon, Modular heat-transfer systems.
  134. Lovette,James; Zhou,Peng; Shook,James Gill, Multi-level microchannel heat exchangers.
  135. Short, Jr., Byron Elliott; Francis, Nathan R.; Brandt, David B., Multi-level oscillating heat pipe implementation in an electronic circuit card module.
  136. Upadhya, Girish; Herms, Richard; Zhou, Peng; Goodson, Kenneth; Hom, James, Optimal spreader system, device and method for fluid cooled micro-scaled heat exchange.
  137. Rusch, David P; Bhatti, Mohinder Singh; Reyzin, Ilya, Orientation insensitive compact thermosiphon with a remote auxiliary condenser.
  138. Edwards, Jesse W.; June, M. Sean; Therrien, Robert Joseph; Yadav, Abhishek, Parallel thermoelectric heat exchange systems.
  139. Loewen, Eric Paul; Cundiff, Weston Matthew; Strege, Seth, Passive system of powering and cooling with liquid metal and method thereof.
  140. Edwards, Jesse W.; Therrien, Robert Joseph; June, M. Sean, Physically separated hot side and cold side heat sinks in a thermoelectric refrigeration system.
  141. Campini, Edoardo; Leija, Javier; Handley, William, Piezoelectric cooling of a semiconductor package.
  142. Williams,Vernon M.; Street,Bret K., Programmed material consolidation methods for fabricating heat sinks.
  143. Lenehan, Daniel J.; Goodson, Kenneth; Kenny, Thomas W.; Munch, Mark; Sahu, Saroj, Pump and fan control concepts in a cooling system.
  144. Pais Martin R. ; Sehmbey Maninder S. ; Cathey Jim, Pump and motor unit and method for pumping fluids.
  145. Khanna, Vijayeshwar D.; McVicker, Gerard; Sri-Jayantha, Sri M., Pump structures integral to a fluid filled heat transfer apparatus.
  146. Bingler, Douglas J., Pump system for use in a heat exchange application.
  147. Mounioloux, Stephen, Radiator with integrated pump for actively cooling electronic devices.
  148. Mounioloux, Stephen, Radiator with integrated pump for actively cooling electronic devices.
  149. Munch,Mark; Goodson,Kenneth; Corbin,David; Zeng,Shulin; Kenny,Thomas W.; Shook,James Gill, Remedies to prevent cracking in a liquid system.
  150. Munch,Mark; Goodson,Kenneth; Corbin,David; Zeng,Shulin; Kenny,Thomas W.; Shook,James Gill, Remedies to prevent cracking in a liquid system.
  151. Munch,Mark; Goodson,Kenneth; Corbin,David; Zeng,Shulin; Kenny,Thomas W.; Shook,James Gill, Remedies to prevent cracking in a liquid system.
  152. Munch,Mark; Goodson,Kenneth; Corbin,David; Zeng,Shulin; Kenny,Thomas W.; Shook,James Gill, Remedies to prevent cracking in a liquid system.
  153. Munch,Mark; Goodson,Kenneth; Corbin,David; Zeng,Shulin; Kenny,Thomas W.; Shook,James Gill, Remedies to prevent cracking in a liquid system.
  154. Schuette, Franz Michael, Sealed self-contained fluidic cooling device.
  155. Borkowski Michael T. ; Sikina Thomas V. ; Roman John W., Solid interface module.
  156. Lower, Nathan P.; Wilcoxon, Ross K.; Yao, Qizhou; Dlouhy, David W.; Chihak, John A., System and method for a substrate with internal pumped liquid metal for thermal spreading and cooling.
  157. Cripe, David W.; McCoy, Bryan S.; Lower, Nathan P.; Wilcoxon, Ross K., System and method for proportional cooling with liquid metal.
  158. Stanley, Marshall; Barus, Daniel, Systems and methods for operating a thermoelectric module to increase efficiency.
  159. Edwards, Jesse W.; June, M. Sean; Therrien, Robert Joseph; Yadav, Abhishek, Systems and methods to mitigate heat leak back in a thermoelectric refrigeration system.
  160. Crocker,Michael T.; Carter,Daniel P.; Kozyra,Kazimierz L., Systems for integrated pump and cold plate.
  161. Crocker,Michael T.; Carter,Daniel P., Systems for low cost liquid cooling.
  162. Thrailkill, John E., Thermal dissipator utilizing laminar thermal transfer member.
  163. Javier Leija ; Mark D. Summers, Thermal management system for a multiple processor computer appliance.
  164. Wilcoxon, Ross K.; Dlouhy, David W.; Lower, Nathan P.; Wooldridge, James R., Thermal spreader assembly with flexible liquid cooling loop having rigid tubing sections and flexible tubing sections.
  165. Edwards, Jesse W.; June, M. Sean; Therrien, Robert Joseph; Yadav, Abhishek, Thermoelectric heat exchange system comprising cascaded cold side heat sinks.
  166. June, M. Sean; Therrien, Robert Joseph; Yadav, Abhishek; Edwards, Jesse W., Thermoelectric heat exchanger component including protective heat spreading lid and optimal thermal interface resistance.
  167. Edwards, Jesse W.; Therrien, Robert Joseph; June, M. Sean, Thermoelectric refrigeration system control scheme for high efficiency performance.
  168. Lower, Nathan P.; Wilcoxon, Ross K.; Wooldridge, James R., Thin, solid-state mechanism for pumping electrically conductive liquids in a flexible thermal spreader.
  169. Edwards, Jesse W.; June, M. Sean; Therrien, Robert Joseph; Yadav, Abhishek, Two-phase heat exchanger mounting.
  170. Townsendl, William T.; Crowell, Adam; Pratt, Gill; Hauptman, Traveler, Ultra-compact, high-performance motor controller.
  171. Townsend, William T.; Crowell, Adam; Pratt, Gill; Hauptman, Traveler, Ultra-compact, high-performance motor controller and method of using same.
  172. Townsend,William T.; Crowell,Adam; Pratt,Gill; Hauptman,Traveler, Ultra-compact, high-performance motor controller and method of using same.
  173. Gibboney, Jr., James W., Universal holiday tree stand with built-in heat pump.
  174. Zhou,Peng; Goodson,Kenneth; Suntiago,Juan, Vapor escape microchannel heat exchanger.
  175. McCutchen, Wilmot H.; McCutchen, David J., Vapor vortex heat sink.
  176. McCutchen, Wilmot H.; McCutchen, David J., Vapor vortex heat sink.
  177. Hwang, Jer-Sheng; Chang, Teng-Kai, Vortex generating finned liquid-cooling heat exchanger module with transverse plate or pathways.
  178. Duan,Qiang Fei, Water-cooling heat dissipation device.
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