|국가/구분||United States(US) Patent 등록|
|미국특허분류(USC)||257/680 ; 257/434 ; 257/437 ; 438/027 ; 438/065 ; 438/116|
|발명자 / 주소|
|출원인 / 주소|
|대리인 / 주소||
|인용정보||피인용 횟수 : 14 인용 특허 : 22|
To hermetically seal an optically transparent ceramic or glass member to a metallic housing, an aperture with a diameter less than the diameter of the member is formed through the metallic housing. The member is then press-fit into the aperture, partially displacing metal from the walls of the aperture, forming an inner burr circumscribing the aperture. The walls of the aperture and the circumscribing burr are then coated with a second metal, preferably electroless nickel. The resultant seal maintains hermeticity following thermal cycling and is particul...
[ We claim:] [1.] A hybrid electronic package, comprising:a unitary metallic housing formed from a metal having a first coefficient of thermal expansion with an aperture of a first diameter extending through a wall of said metallic housing;an optically transparent member inserted into said aperture and contacting said aperture at an intermediate point thereof wherein the diameter of said aperture is equal to the diameter of said optically transparent member outward from said intermediate point and essentially conforms to said optically transparent member...