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특허 상세정보

Optical component package with a hermetic seal

국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판) H01L-023/02   
미국특허분류(USC) 257/680 ; 257/434 ; 257/437 ; 438/027 ; 438/065 ; 438/116
출원번호 US-0118638 (1998-07-17)
발명자 / 주소
출원인 / 주소
대리인 / 주소
    Gregory S. Rosenblatt Wiggin & Dana
인용정보 피인용 횟수 : 14  인용 특허 : 22
초록

To hermetically seal an optically transparent ceramic or glass member to a metallic housing, an aperture with a diameter less than the diameter of the member is formed through the metallic housing. The member is then press-fit into the aperture, partially displacing metal from the walls of the aperture, forming an inner burr circumscribing the aperture. The walls of the aperture and the circumscribing burr are then coated with a second metal, preferably electroless nickel. The resultant seal maintains hermeticity following thermal cycling and is particul...

대표
청구항

[ We claim:] [1.] A hybrid electronic package, comprising:a unitary metallic housing formed from a metal having a first coefficient of thermal expansion with an aperture of a first diameter extending through a wall of said metallic housing;an optically transparent member inserted into said aperture and contacting said aperture at an intermediate point thereof wherein the diameter of said aperture is equal to the diameter of said optically transparent member outward from said intermediate point and essentially conforms to said optically transparent member...

이 특허에 인용된 특허 (22)

  1. Drake Anthony F. (P.O. Box 31192 Santa Barbara CA 93130-1192). Blade and process of making same. USP1986094611400.
  2. Haake John M. (St. Charles MO). Fiber optic connector having at least one microactuator for precisely aligning an optical fiber and an associated fabric. USP1997025606635.
  3. Kramer Daniel P. (Centerville OH). Hermetic fiber optic-to-metal connection technique. USP1992095143531.
  4. Stevenson David W. (Mesa AZ). Hot alignment assembly method for optoelectronic packages. USP1987034650285.
  5. Mori Hiroshi (Tokyo JPX) Watanabe Akio (Tokyo JPX). Integrated optical circuit for fiber-optics gyroscopes. USP1994035293439.
  6. Pan Jing-Jong ; Jiang Paul Shi-Qi ; Chen Jian ; Wang Li-Hua. Laser diode package with anti-reflection and anti-scattering coating. USP1998035731602.
  7. Rapoza Edward J. (West Milford NJ). Laser weldable hermetic connector. USP1992055110307.
  8. Rapoza Edward J. (West Milford NJ). Laser weldable hermetic connector. USP1995045405272.
  9. Tyler Derek E. (Cheshire CT) Mahulikar Deepak (Madison CT) Pasqualoni Anthony M. (Hamden CT) Braden Jeffrey S. (Milpitas CA) Hoffman Paul R. (Modesto CA). Metal electronic package with reduced seal width. USP1995035399805.
  10. Wright John O. (Warren PA). Method of forming a two piece chip carrier. USP1991055014418.
  11. Butrie Timothy ; Dautartas Mindaugas Fernand ; Scrak Shaun P.. Optical component package. USP1998115841178.
  12. Abbott Kathleen S. (Wilmington DE) Hodgson Michael J. (Ipswich GB2) Macdonald Brian M. (Felixstowe GB2) Smith David R. (Woodbridge GB2). Optical fiber feedthrough. USP1993015177806.
  13. Abbott Kathleen S. (Wilmington DE) Willis Frank M. (Wenonah NJ). Optical fiber feedthrough assembly having a rigidizing arrangement therein. USP1989054826276.
  14. Geiser ; Jr. Raymond W. (Orange CA) Krum Alvin L. (Hungtington Beach CA) Hartley James T. (Tustin CA). Optoelectronic hybrid package assembly including integral, self-aligned fiber optic connector. USP1991075029968.
  15. Nakagawa Eiichi (Kanagawa JPX) Yamashita Junichiro (Kanagawa JPX). Optoelectronics package. USP1991024989930.
  16. Johnson Melvin H. (Chadds Ford PA) Krauss Leland L. (Aston PA) Landman Dirk (Lancaster PA). Package for an opto-electronic component. USP1991045011256.
  17. Harazono Masaaki,JPX. Package for housing a photosemiconductor device. USP1998045744848.
  18. Watanabe Nobutaka (Tokyo JPX). Photoelectric converter module. USP1992075132532.
  19. Butt Sheldon H. (Godfrey IL). Semiconductor package. USP1991055014159.
  20. Butt Sheldon H. (Godfrey IL). Semiconductor package. USP1989094866571.
  21. Blonder Greg E. (Summit NJ) Johnson Bertrand H. (Murray Hill NJ). Subassembly for optoelectronic devices. USP1990014897711.
  22. Thillays Jacques C. (Herouville FRX). Surface-mounted optoelectronic device. USP1988024727457.

이 특허를 인용한 특허 피인용횟수: 14

  1. Mott, Lawrence; Bettger, Kenneth; Brown, Elliot. Asymmetrical flexible edge seal for vacuum insulating glass. USP2012108283023.
  2. Bettger, Kenneth J.; Stark, David H.. Filament-strung stand-off elements for maintaining pane separation in vacuum insulating glazing units. USP2013088512830.
  3. Bettger, Kenneth J.; Stark, David H.. Flexible edge seal for vacuum insulating glazing units. USP2012128329267.
  4. Wang Bily,TWX. Folded heat sink for semiconductor device package. USP2001076262481.
  5. Stark, David H.. Hermetically sealed micro-device package using cold-gas dynamic spray material deposition. USP2005086924974.
  6. Stark, David H.. Hermetically sealed micro-device package with window. USP2004076759590.
  7. Stark,David H.. Hermetically sealed micro-device package with window. USP2007077238546.
  8. Stark, David H. Insulated glazing units. USP2010117832177.
  9. Stark, David H.. Insulating glass unit having multi-height internal standoffs and visible decoration. USP2011087989040.
  10. Francis, IV, William H.; Freebury, Gregg E.; Beidleman, Neal J.; Hulse, Michael. Method and apparatus for an insulating glazing unit and compliant seal for an insulating glazing unit. USP2016059328512.
  11. Tower Steven A. ; Mravic Brian. Method for making a ceramic to metal hermetic seal. USP2000116145731.
  12. Miller, Seth A.; Stark, David H.; Francis, IV, William H.; Puligandla, Viswanadham; Boulos, Edward N.; Pernicka, John. Multi-pane glass unit having seal with adhesive and hermetic coating layer. USP2015028950162.
  13. Stark, David H.. Wafer-level hermetic micro-device packages. USP2009047517712.
  14. Stark, David H.. Wafer-level hermetic micro-device packages. USP2005116962834.