초록 ▼

A heatsink assembly for removing at least some of the heat produced by an electronic component during use includes a heatsink, a heatpipe mounted on the heatsink and a plurality of thin, elongated fins mounted on the heatpipe. The heatsink is an elongated, generally rectangularly-shaped body and com

A heatsink assembly for removing at least some of the heat produced by an electronic component during use includes a heatsink, a heatpipe mounted on the heatsink and a plurality of thin, elongated fins mounted on the heatpipe. The heatsink is an elongated, generally rectangularly-shaped body and comprises a bottom surface, a top surface and a central, cylindrical channel formed in the top surface. A pair of clip recesses are formed in the top surface of the heatsink on opposite sides of the central channel. A first set of thin, elongated fins and a second set of thin, elongated fins are also formed in the top surface of the heatsink and serve to remove at least some of the heat transferred onto the heatsink. The heatpipe comprises an evaporator section and a condenser section. The evaporator section of the heatpipe is disposed tightly within the central channel of the heatsink so as to maximize the transfer of heat from the heatsink to the heatpipe. The plurality of thin, elongated fins are disposed on the condenser section of the heatpipe in a closely spaced parallel relation and serve to remove at least some of the heat transferred onto the heatpipe.

대표청구항 ▼

[ What is claimed is:] [1.] A heatsink assembly for removing at least some of the heat produced by an electronic component during use, said heatsink assembly comprising:(a). a heatsink, said heatsink comprising an elongated body having a bottom surface, a top surface, a pair of clip recesses formed

[ What is claimed is:] [1.] A heatsink assembly for removing at least some of the heat produced by an electronic component during use, said heatsink assembly comprising:(a). a heatsink, said heatsink comprising an elongated body having a bottom surface, a top surface, a pair of clip recesses formed in the top surface and a central channel, said central channel being formed in the top surface,(b). a heatpipe having an evaporator section and a condenser section, the evaporator section of said heatpipe being disposed tightly within the central channel of said heatsink so as to maximize the transfer of heat from said heatsink to said heatpipe, and(c). a plurality of fins mounted on the condenser section of said heatpipe.