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Method and apparatus for immersion cleaning of semiconductor devices 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • B08B-003/04
출원번호 US-0106066 (1998-06-29)
발명자 / 주소
  • Dryer Paul William
  • Tirendi Richard Scott
  • Sundin James Bradley
출원인 / 주소
  • Speedfam-IPEC Corporation
대리인 / 주소
    Fitch, Even, Tabin & Flannery
인용정보 피인용 횟수 : 45  인용 특허 : 13

초록

Method and apparatus for cleaning semiconductor devices and other workpieces using an aqueous rinse solution which is de-oxygenated by passing the aqueous rinse solution and a carrier gas through an osmotic membrane degasifier. A cleaning chamber is also disclosed for carrying out the cleaning metho

대표청구항

[ What is claimed is:] [22.] Apparatus for processing a semiconductor device, comprising:a treatment chamber defining a cavity for receiving the semiconductor device with a device opening through which said semiconductor device is passed into and out of the cavity;a plenum coupled to the treatment c

이 특허에 인용된 특허 (13)

  1. Harada Yasuyuki,JPX ; Netsu Shigeyoshi,MYX, Apparatus and method for cleaning semiconductor wafers.
  2. Mashimo Noriyoshi (Tokyo JPX) Okumura Katsuya (Yokohama JPX), Arrangement for cleaning semiconductor wafers using mixer.
  3. Nakajima Kazuo (Shiga-ken JPX) Tanaka Katsunori (Shiga-ken JPX), Chemical agent producing device and method thereof.
  4. Thrasher David L. ; Hearne John S. ; Ryle Lynn S., Contamination control in substrate processing system.
  5. Cho Kwantai (Charlotte NC) Huang Xiaoyan (Charlotte NC), Degassing liquids: apparatus and method.
  6. Yamanaka Koji,JPX ; Imaoka Takashi,JPX ; Futatsuki Takashi,JPX ; Yamashita Yukinari,JPX, Equipment and process for producing high-purity water.
  7. Ciari Richard P. (San Jose CA), Final rinse/dry system for critical cleaning applications.
  8. Aoki Hidemitsu (Tokyo JPX) Nakajima Tsutomu (Tokyo JPX), Method and apparatus for wet treatment of solid surfaces.
  9. Davison Michael J. (Mesa AZ) Dryer Paul W. (Mesa AZ) Wilson Wendy K. (Mesa AZ), Method for etching a dielectric layer on a semiconductor.
  10. Park Sung-Kil (Kyoungki KRX) Kim Dong-Sauk (Seoul KRX) Yoon Yong-Hyeock (Seoul KRX), Method for forming a via contact hole of a semiconductor device.
  11. Winebarger Paul M. (Austin TX), Process for fabricating a semiconductor device using re-ionized rinse water.
  12. Chung Bryan C. (Hampton NJ) DiBello Gerald N. (Boyertown PA) Pearce Charles W. (Emmaus PA) Yanders Kevin P. (Allentown PA), Semiconductor wafer cleaning and rinsing techniques using re-ionized water and tank overflow.
  13. Nafziger Charles P. (2445 E. Encanto Mesa AZ 85213), Single-chamber cleaning, rinsing and drying apparatus and method therefor.

이 특허를 인용한 특허 (45)

  1. Siefering,Kevin L.; Nelson,Steven L., Advanced process control for low variation treatment in immersion processing.
  2. Yokomizo,Kenji, Apparatus and method of securing a workpiece during high-pressure processing.
  3. Jonathan Borkowski ; Oliver David Jones ; Kenneth C. McMahon ; Scott Petersen ; Donald Stephens ; Yassin Mehmandoust ; James M. Olivas, Apparatus for drying batches of wafers.
  4. Biberger, Maximilian Albert; Layman, Frederick Paul; Sutton, Thomas Robert, Apparatus for supercritical processing of a workpiece.
  5. Jones,William Dale, Control of fluid flow in the processing of an object with a fluid.
  6. Arena Foster,Chantal J.; Awtrey,Allan Wendell; Ryza,Nicholas Alan; Schilling,Paul, Developing photoresist with supercritical fluid and developer.
  7. Rolfson, J. Brett, Device addressing gas contamination in a wet process.
  8. Oliver David Jones ; Kenneth C. McMahon ; Jonathan Borkowski ; Scott Petersen ; Donald Stephens ; Yassin Mehmandoust ; James M. Olivas, Disk drying apparatus and method.
  9. Arena-Foster, Chantal J.; Awtrey, Allan Wendell; Ryza, Nicholas Alan; Schilling, Paul, Drying resist with a solvent bath and supercritical CO2.
  10. Gardner, Douglas G.; Smith, Stephen Mark; Bliven, Brian M., Edge roller assembly, method for contacting an edge of a substrate, and transport system for transporting semiconductor wafers to a wafer processing station.
  11. Stevens,Joseph J.; Lubomirsky,Dmitry; Pancham,Ian; Olgado,Donald J. K.; Grunes,Howard E.; Mok,Yeuk Fai Edwin, Electroless deposition apparatus.
  12. Biberger,Maximilian A.; Layman,Frederick Paul; Sutton,Thomas Robert, High pressure processing chamber for semiconductor substrate.
  13. Jones,William Dale, High-pressure processing chamber for a semiconductor wafer.
  14. Jones,William Dale, High-pressure processing chamber for a semiconductor wafer.
  15. Goshi,Gentaro, Method and apparatus for cooling motor bearings of a high pressure pump.
  16. Dryer, Paul William; Tirendi, Richard Scott; Sundin, James Bradley, Method and apparatus for immersion treatment of semiconductor and other devices.
  17. Betancourt, Ernest; Brigante, Jeffrey A.; Gale, Glenn W.; Salamon, Jr., William, Method and apparatus for recovery of semiconductor wafers from a chemical tank.
  18. Verhaverbeke, Steven; Truman, J. Kelly; Ko, Alexander; Endo, Rick R., Method and apparatus for wafer cleaning.
  19. Verhaverbeke, Steven; Truman, J. Kelly; Ko, Alexander; Endo, Rick R., Method and apparatus for wafer cleaning.
  20. Verhaverbeke,Steven; Truman,J. Kelly; Ko,Alexander; Endo,Rick R., Method and apparatus for wafer cleaning.
  21. Verhaverbeke,Steven; Truman,J. Kelly; Ko,Alexander; Endo,Rick R., Method and apparatus for wafer cleaning.
  22. Kuo, Chang; Kashkoush, Ismail; Yialamas, Nick; Skibinski, Gregory, Method and system for chemical injection in silicon wafer processing.
  23. Parent,Wayne M.; Goshi,Gentaro, Method and system for cooling a pump.
  24. Hansen,Brandon; Lowe,Marie, Method and system for treating a substrate with a high pressure fluid using fluorosilicic acid.
  25. Jolley Michael, Method for cleaning copper surfaces.
  26. Jolley, Michael, Method for cleaning copper surfaces.
  27. Rolfson, J. Brett, Method for reducing gaseous species of contamination in wet processes.
  28. Kawamura,Kohei; Asano,Akira; Miyatani,Koutarou; Hillman,Joseph T.; Palmer,Bentley, Method for supercritical carbon dioxide processing of fluoro-carbon films.
  29. Brian M. Bliven ; Michael Ravkin, Method for transferring wafers from a conveyor system to a wafer processing station.
  30. Biberger,Maximilian A.; Schilling,Paul E., Method of depositing metal film and metal deposition cluster tool including supercritical drying/cleaning module.
  31. Hillman,Joseph, Method of inhibiting copper corrosion during supercritical COcleaning.
  32. Toma,Dorel Ioan; Schilling,Paul, Method of passivating of low dielectric materials in wafer processing.
  33. Biberger,Maximilian Albert; Layman,Frederick Paul; Sutton,Thomas Robert, Method of supercritical processing of a workpiece.
  34. Schilling,Paul, Method of treating a composite spin-on glass/anti-reflective material prior to cleaning.
  35. Schilling,Paul, Method of treatment of porous dielectric films to reduce damage during cleaning.
  36. Kashkoush, Ismail; Novak, Richard; Mancuso, Tom; Vadimsky, Jim, Nextgen wet process tank.
  37. Sheydayi,Alexei, Pressure energized pressure vessel opening and closing device and method of providing therefor.
  38. Mullee,William H.; de Leeuwe,Marc; Roberson, Jr.,Glenn A.; Palmer,Bentley J., Removal of CMP and post-CMP residue from semiconductors using supercritical carbon dioxide process.
  39. Bertram, Ronald Thomas; Scott, Douglas Michael, Removal of contaminants from a fluid.
  40. Kato Toshio,JPX ; Tokumasu Noboru,JPX ; Azumi Takayoshi,JPX, Semiconductor device manufacturing system.
  41. Jacobson,Gunilla; Yellowaga,Deborah, Treatment of a dielectric layer using supercritical CO.
  42. Kevwitch, Robert, Treatment of substrate using functionalizing agent in supercritical carbon dioxide.
  43. Sheydayi,Alexei, Vacuum chuck utilizing sintered material and method of providing thereof.
  44. Jones, Oliver David; McMahon, Kenneth C.; Borkowski, Jonathan E.; Petersen, Scott; Stephens, Donald E.; Mehmandoust, Yassin; Olivas, James M., Wafer drying apparatus and method.
  45. Bliven, Brian M.; Ravkin, Michael, Wheel and conveyor system for transporting semiconductor wafers.
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