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Multilayer laminate process 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • C21D-008/00
출원번호 US-0585172 (1996-01-11)
발명자 / 주소
  • Mennucci Joseph P.
  • Mead Charles R.
출원인 / 주소
  • Brush Wellman Inc.
대리인 / 주소
    Calfee, Halter & Griswold
인용정보 피인용 횟수 : 16  인용 특허 : 60

초록

A controlled oxygen content copper clad laminate product and process. In accordance with one aspect of the present invention, there is provided a laminate having a first layer of oxygen-free copper joined to a second layer of oxygen-rich copper by the steps of (i) cladding the first layer to the sec

대표청구항

[ What is claimed is:] [1.] A process for making an energy transfer laminate product, which comprises the steps of:cladding a layer of a first material to a layer of a second material so as to form a multilayer clad laminate;finish rolling the laminate to substantially reduce its variation in thickn

이 특허에 인용된 특허 (60)

  1. Mansingh Vivek (Santa Clara CA), Air-cooled heat exchanger for electronic circuit modules.
  2. Jochym Eric P. (Baldwinsville NY), Blister-free direct bonding of metals to ceramics and metals.
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  4. Babcock Guy L. (North Syracuse NY) Bryant Walter M. (Liverpool NY) Neugebauer Constantine A. (Schenectady NY) Burgess James F. (Schenectady NY), Bonds between metal and a non-metallic substrate.
  5. Grabbe Dimitry G. (Lisbon Falls ME), Ceramic chip carrier with lead frame having removable rim.
  6. Yerman Alexander J. (Scotia NY), Chip carrier and method of fabrication.
  7. Kaufman Lance R. (7345 East Acoma Scottsdale AZ 85260), Circuit assembly and method with direct bonded terminal pin.
  8. Agonafer Dereje (Poughkeepsie NY) Anderson Timothy M. (Poughkeepsie NY) Chrysler Gregory M. (Poughkeepsie NY) Chao-fan Chu Richard (Poughkeepsie NY) Simons Robert E. (Poughkeepsie NY) Vader David T. , Convertible cooling module for air or water cooling of electronic circuit components.
  9. Kersch Dennis R. (Phoenix AZ) Mitchell Don E. (Phoenix AZ), Copper body power hybrid package and method of manufacture.
  10. Beauregard Robert E. (Lincoln RI) Gondusky Joseph M. (Warwick RI) Breit Henry F. (Attleboro MA), Copper cored enclosures for hybrid circuits.
  11. Barrell David (Temple City CA) Kennedy Donald E. (Baldwin Park CA) Marino ; Jr. James J. (Monrovia CA) Rollen Donald C. (Railto CA), Copper-clad polyester-glass fiber laminates.
  12. Krum Alvin L. (Huntington Beach CA) Campbell William T. (Costa Mesa CA), Direct bonding of copper composites to ceramics.
  13. Cusano Dominic A. (Schenectady NY) Loughran James A. (Scotia NY) Sun Yen Sheng Edmund (Auburn NY), Direct bonding of metals to ceramics and metals.
  14. Cusano ; Dominic A. ; Loughran ; James A. ; Sun ; Yen S. E., Double side cooled, pressure mounted semiconductor package and process for the manufacture thereof.
  15. Yerman Alexander J. (Scotia NY), Electrical assembly including a conductor pattern bonded to a non-metallic substrate and method of fabricating such asse.
  16. Fister Julius C. (Hamden CT) Breedis John F. (Trumbull CT), Electrical component forming process.
  17. Chrysler Gregory M. (Poughkeepsie NY) Vader David T. (New Paltz NY), Electronics package with improved thermal management by thermoacoustic heat pumping.
  18. Webster Harold F. (Scotia NY) Neugebauer Constantine A. (Schenectady NY) Burgess James F. (Schenectady NY), Enhanced direct bond structure.
  19. Tanigawa Toru (Nikko JPX) Kurihara Masaaki (Nikko JPX) Fujii Yasuji (Yokohama JPX) Inaba Toshiaki (Hiratsuka JPX), Fine copper wire for electronic instruments and method of manufacturing the same.
  20. Alvarez Juan M. (Medfield MA) Breit Henry F. (Attleboro MA) Levy Steven E. (Plainville MA) Hingorany Premkumar R. (Foxboro MA), Heat dissipating member for mounting a semiconductor device and electrical circuit unit incorporating the member.
  21. Matthews James A. (Milpitas CA), Heat exchanger for solid-state electronic devices.
  22. Minakami Ko (Kawasaki JPX) Terashima Toshinori (Yokohama JPX) Maeda Toshio (Yokohama JPX) Sasaki Tomiya (Kawasaki JPX) Hisano Katsumi (Yokohama JPX) Iwasaki Hideo (Kawasaki JPX) Kawano Koichiro (Yoko, Heat sink and the producing method thereof.
  23. Seidler Jack (Flushing NY), Heat sink formed of stacked fin elements.
  24. Kaufman Lance R. (131 North White Oak Way Mequon WI 53092), Hermetic direct bond circuit assembly.
  25. Yerman Alexander J. (Scotia NY) Neugebauer Constantine A. (Schenectady NY), Hermetic power chip packages.
  26. Granberg Helge O. (Phoenix AZ) Coffman Samuel L. (Scottsdale AZ), High power RF transistor assembly.
  27. Kato Masanori (Tokyo JPX), High-conductivity copper alloys with excellent workability and heat resistance.
  28. Kagawa Kazuhisa (Itami JPX), High-frequency high-power transistor.
  29. Chu Richard C. (Poughkeepsie NY) Ellsworth ; Jr. Michael J. (Poughkeepsie NY) Vader David T. (New Paltz NY), Impingment cooled compliant heat sink.
  30. Kuo Marco K. (San Mateo CA) Sharma Nirmal K. (Sunnyvale CA), Integrated circuit package with thermal path layers incorporating staggered thermal vias.
  31. Chu Richard C. (Poughkeepsie NY) Ellsworth ; Jr. Michael J. (Poughkeepsie NY) Simons Robert E. (Poughkeepsie NY) Vader David T. (New Paltz NY), Intersecting flow network for a cold plate cooling system.
  32. Watanabe Kunio (Sagamihara JPX) Nishimura Satoshi (Sagamihara JPX) Kaneko Kunishige (Tokyo JPX), Iron/copper/chromium alloy material for high-strength lead frame or pin grid array.
  33. Sugai Shinzo (Chigasaki JPX) Yamane Shigemi (Yokohama JPX) Kuze Takashi (Yokohama JPX), Lead frame and method for manufacturing the same.
  34. Guinet Jannick (Montmorency FRX) Hubert Jean-Claude (Sucy En Brie FRX) Martial Marie-Francoise (Puteaux FRX), Method for bonding a copper sheet to a substrate made of an electrically insulating material.
  35. Ohmae Takashi (Kanonshin JPX) Fukaya Yasuhiro (Kanonshin JPX) Hirai Shozo (Kanonshin JPX), Method for bonding ceramics and metals.
  36. Kanahara Naoyuki (Hachioji JPX) Furo Masahiro (Hachioji JPX) Furihata Tetsuo (Kodaira JPX), Method for bonding copper plate to alumina substrate and process for producing copper/alumina bonded assembly.
  37. Bunk Klaus (Worms DEX) Neidig Arno (Plankstadt DEX) Wahl Georg (Eppelheim DEX) Keser Helmut (Birr CHX), Method for directly joining metal pieces to oxide-ceramic substrates.
  38. Takeuchi Yo (Urawa JPX) Morikawa Masaki (Oomiya JPX) Tanaka Chuji (Ageo JPX) Hiji Toshiharu (Ageo JPX) Ikeda Hiroshi (Osaka JPX), Method for manufacturing stripe-patterned metal plate.
  39. Neidig Arno (Plankstadt DEX) Berndt Dietmar (Heidelberg DEX) Wahl Georg (Eppelheim DEX) Wittmer Mark (Baden CHX), Method of direct bonding copper foils to oxide-ceramic substrates.
  40. Siuzdak Allan J. (Cumberland RI), Method of forming dielectric layer on a metal substrate having improved adhesion.
  41. Beauregard, Robert E.; Gondusky, Joseph M.; Breit, Henry F., Method of manufacture of copper cored enclosures for hybrid circuits.
  42. Horiguchi Akihiro (Kawasaki JPX) Kasori Mitsuo (Kawasaki JPX) Ueno Fumio (Yokohama JPX) Komorita Hiroshi (Yokohama JPX) Endo Mitsuyoshi (Tokyo JPX), Method of manufacturing circuit board.
  43. Tsuji Masahiro (Kangawa JPX) Kawauchi Susumu (Kangawa JPX) Nakayama Hiroshi (Tokyo JPX), Method of manufacturing film carrier.
  44. Kanahara Naoyuki (Akigawa JPX) Furihata Tetsuo (Higashiyamato JPX), Method of metallizing non-oxide ceramics.
  45. Kamada Osao (Tokyo JPX) Nishiyama Shinichi (Ibaraki JPX), Method of producing electrical conductor.
  46. Borkowski Michael T. (Framingham MA) Laighton David G. (Boxboro MA) Altschul Barry (Framingham MA), Microwave transistor package.
  47. Polinski ; Sr. Paul W. (Dana Point CA), Monolithic microelectronic circuit package including low-temperature-cofired-ceramic (LTCC) tape dielectric structure an.
  48. Loo Mike C. (San Jose CA) Vogel Marlin R. (Fremont CA), Multi-chip cooling module and method.
  49. Azar Kaveh (Westwood MA) Caron Richard E. (Salem NH), Narrow channel finned heat sinking for cooling high power electronic components.
  50. Howell Hilda (Pittsburgh PA), Non-free-amine promoter system for polyester composition.
  51. Yerman, Alexander J., Power chip package.
  52. Schubert Klaus (Karlsruhe DEX) Bier Wilhelm (Eggenstein-Leopoldshafen DEX) Linder Gerd (Karlsruhe DEX) Schmid Peter (Munich DEX) Bichler Peter (Schondorf DEX) Brunner Winfried (Unterhaching DEX) Simo, Process for manufacturing finely structured bodies such as heat exchangers.
  53. Smith John Marvin (Glen Ellyn IL), RF power semiconductor package and method of manufacture.
  54. Tsuzuki Naobumi (Tokyo JPX) Anazawa Shinzo (Tokyo JPX), Semiconductor device having a highly air-tight package.
  55. Chao-Fan Chu Richard (Poughkeepsie NY) Simons Robert E. (Poughkeepsie NY) Vader David T. (New Paltz NY), Super-position cooling.
  56. Moline Daniel D. (Kuala Lumpur MYX), Surface mounting semiconductor device and method.
  57. Johnson Joseph H. (Sunnyvale CA) Max Lee B. (Sunnyvale CA), Temperature compensating transistor bias device.
  58. Chu Richard C. (Poughkeepsie NY) Ellsworth ; Jr. Michael J. (Poughkeepsie NY) Simons Robert E. (Poughkeepsie NY) Vader David T. (New Paltz NY), Topology matched conduction cooling module.
  59. Hosoda Naoyuki (Osaka JPX) Morikawa Masaki (Iwatsuki JPX) Uchiyama Naoki (Osaka JPX) Yoshida Hideaki (Kasukabe JPX) Ono Toshiaki (Osaka JPX), Wire for bonding a semiconductor device.
  60. Hosoda Naoyuki (Osaka JPX) Morikawa Masaki (Iwatsuki JPX) Uchiyama Naoki (Osaka JPX) Yoshida Hideaki (Kasukabe JPX) Ono Toshiaki (Osaka JPX), Wire for bonding a semiconductor device and process for producing the same.

이 특허를 인용한 특허 (16)

  1. Bergstrom, David S.; Schott, Kris J.; Tarhay, Mark A., Clad alloy substrates and method for making same.
  2. Bergstrom, David S.; Schott, Kris J.; Tarhay, Mark A., Clad alloy substrates and method for making same.
  3. Greiner, Ralf; Maier, Josef; Paintner, Kai; Sinning, Richard, Compact circuit carrier package.
  4. Muramatsu, Naokuni; Kimura, Hisamichi; Inoue, Akihisa, Copper alloy foil, flexible printed circuit board using the same, and method for producing copper alloy foil.
  5. Muramatsu, Naokuni; Kimura, Hisamichi; Inoue, Akihisa, Copper alloy wire and method for producing the same.
  6. Aoyama, Seigi; Sumi, Toru; Sakai, Shuji; Sato, Takahiro; Abe, Hidenori, Dilute copper alloy material, dilute copper alloy wire, dilute copper alloy twisted wire and cable using the same, coaxial cable and composite cable, and method of manufacturing dilute copper alloy material and dilute copper alloy wire.
  7. Sumi, Toru; Aoyama, Seigi; Kuroda, Hiromitsu; Sagawa, Hideyuki, Flexible flat cable with dilute copper alloy containing titanium and sulfur.
  8. Campbell Geoffrey O., Formed laminate heat pipe.
  9. Dani, Ashay A.; Houle, Sabina J.; Rumer, Christopher L.; Fitzgerald, Thomas J, Heat dissipating device with preselected designed interface for thermal interface materials.
  10. Dani, Ashay A.; Houle, Sabina J.; Rumer, Christopher L.; Fitzgerald, Thomas J, Heat dissipating device with preselected designed interface for thermal interface materials.
  11. Houle, Sabina J.; Deppisch, Carl, Heat sink with preattached thermal interface material and method of making same.
  12. Houle,Sabina J.; Deppisch,Carl, Heat sink with preattached thermal interface material and method of making same.
  13. Heiner Lichtenberger, Integral solder and plated sealing cover and method of making the same.
  14. Bhatti, Mohinder Singh; Griffin, Patrick Mitchell, Method of making high performance heat sinks.
  15. Chang, Chen-Chung S.; Jha, Bijendra, Method of producing Ti brazing strips or foils.
  16. Chang, Chen-Chung S.; Jha, Bijendra; Pohlman, Matthew J., Ti brazing strips or foils.
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